公开(公告)号：US5938952A

公开(公告)日：1999-08-17

申请号：US787459

申请日：1997-01-22

申请人： Chang-Ming Lin ,  Richard C. Sam

发明人： Chang-Ming Lin ,  Richard C. Sam

IPC分类号： B23K26/03 ,  B23K26/00

CPC分类号： H01L24/85 ,  B23K26/032 ,  H01L24/48 ,  H01L24/50 ,  H01L24/78 ,  H01L24/79 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/4518 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4845 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/8501 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2224/92247 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532

摘要： A microelectronic packaging and interconnection apparatus and method in which dual ball bonds, metal bumps, or TAB bonds are formed by pulsed laser irradiation, but not conventional heating, compression or acoustic (e.g., ultrasonic) methods. A miniature loop forming tool is used to form a metallic wire loop, one end of which is welded to an IC bond pad while the other end of which is welded to an IC package bonding finger, thus forming ball bonds at both ends of the interconnection.

摘要翻译： 通过脉冲激光照射而不是常规的加热，压缩或声学（例如超声波）方法形成双球键，金属凸块或TAB键的微电子封装和互连装置和方法。 使用微型环形成工具形成金属​​线环，其一端焊接到IC接合焊盘，另一端焊接到IC封装接合指，从而在互连的两端形成球接合 。

公开(公告)号：US5295143A

公开(公告)日：1994-03-15

申请号：US880214

申请日：1992-05-06

申请人： Rama Rao ,  Victor Garkavy ,  Max W. Eagleson ,  Richard C. Sam

发明人： Rama Rao ,  Victor Garkavy ,  Max W. Eagleson ,  Richard C. Sam

IPC分类号： G02B6/28 ,  G02F1/35 ,  G02F1/37 ,  H01S3/08 ,  H01S3/094 ,  H01S3/16 ,  H01S3/23 ,  H01S3/10

CPC分类号： G02B6/2817 ,  H01S3/2383 ,  G02F1/3532 ,  G02F1/37 ,  H01S3/08086 ,  H01S3/094 ,  H01S3/1625

摘要： A three color laser system employs a diode pumped Nd:YAG or Nd:YLF laser to provide a green output beam and to pump two Ti:S lasers. One Ti:S laser emits a tunable red beam, while the second emits a near infrared beam. The near infrared beam is frequency doubled by a NLO device to provide a tunable blue output beam. The beams may be directed to separate optical fibers or to a single fiber. A reversed Cassegrainian mirror arrangement is used to combine a plurality of beams for transmission in a single optical fiber.

摘要翻译： 三色激光系统采用二极管泵浦Nd：YAG或Nd：YLF激光器来提供绿色输出光束并泵浦两个Ti：S激光器。 一个Ti：S激光器发射可调红光，而第二个发射近红外光束。 近红外光束被NLO器件倍频，以提供可调谐的蓝色输出光束。 光束可以被引导到单独的光纤或单个光纤。 反转卡塞格林镜配置用于组合多个光束以在单个光纤中传输。

公开(公告)号：US5181215A

公开(公告)日：1993-01-19

申请号：US796147

申请日：1991-11-22

申请人： Richard C. Sam ,  Kenrick R. Leslie ,  James E. Goodwin

发明人： Richard C. Sam ,  Kenrick R. Leslie ,  James E. Goodwin

IPC分类号： H01S3/04 ,  H01S3/042 ,  H01S3/092 ,  H01S3/131

CPC分类号： H01S3/042 ,  H01S3/092 ,  H01S3/131 ,  H01S3/0404 ,  H01S3/0405

摘要： An air cooled, flash lamp pumped, solid state laser device wherein heating devices are disposed on the laser rod at both ends to heat and temperature stabilize the laser rod. The solid state, laser rod is longer than the arc length of the flash lamp. The ends of the laser rod can be heated directly by winding heating wire, such as Nichrome, around each end or by applying heat through thermal conductive supports. A feedback loop is provided to maintain temperature of the solid state laser rod, which is preferably Alexandrite, within a desired range of 80.degree. C. to 120.degree. C.

摘要翻译： 一种空气冷却的闪光灯泵浦固体激光装置，其中加热装置在两端设置在激光棒上以加热和温度稳定激光棒。 固态激光棒的长度大于闪光灯的弧长。 激光棒的端部可以通过围绕每个端部缠绕加热丝，例如镍铬合金，或者通过导热支撑件加热来直接加热。 提供反馈回路以将固态激光棒的温度保持在80℃至120℃的期望范围内，该激光棒优选为亚历山大。