Capacitor comprising improved TaO.sub.x -based dielectric
    4.
    发明授权
    Capacitor comprising improved TaO.sub.x -based dielectric 失效
    电容器包括改进的基于TaOx的电介质

    公开(公告)号:US5977582A

    公开(公告)日:1999-11-02

    申请号:US862907

    申请日:1997-05-23

    CPC分类号: H01L28/40 H01G4/08

    摘要: A dielectric layer consisting essentially of Ta, Al, oxygen and nitrogen can have advantageous properties that make such a layer useful for thin film capacitors, typically capacitors for Si integrated circuits. For instance, a significantly greater fraction of capacitors according to the invention than of prior art tantalum oxide capacitors can store a charge of 3 .mu.coulomb/cm.sup.2. In a currently preferred embodiment, the dielectric layer has composition Ta.sub.1-y Al.sub.y O.sub.x N.sub.z, with y.about.0.1, x.about.2.4, and z.about.0.02. The dielectric layer can be formed by sputter deposition or any other appropriate deposition technique, e.g., chemical vapor deposition.

    摘要翻译: 基本上由Ta,Al,氧和氮组成的电介质层可以具有使这种层用于薄膜电容器(通常用于Si集成电路的电容器)的有利特性。 例如,根据本发明的电容器比现有技术的钽氧化物电容器显着更大的部分可以存储3ul库仑/ cm 2的电荷。 在当前优选的实施例中,电介质层具有组成Ta1-yAlyOxNz,其中y DIFFERENCE 0.1,x差异2.4和z差值0.02。 介电层可以通过溅射沉积或任何其它合适的沉积技术形成,例如化学气相沉积。