公开(公告)号：US09459331B2

公开(公告)日：2016-10-04

申请号：US13984855

申请日：2012-02-01

申请人： Yosuke Otake ,  Yoshihisa Soutome ,  Ryota Sato ,  Yoshitaka Bito ,  Koji Hirata

发明人： Yosuke Otake ,  Yoshihisa Soutome ,  Ryota Sato ,  Yoshitaka Bito ,  Koji Hirata

IPC分类号： G01R33/3415 ,  G01R33/36 ,  G01R33/422 ,  G01R33/34

CPC分类号： G01R33/365 ,  G01R33/34053 ,  G01R33/34069 ,  G01R33/34076 ,  G01R33/3415 ,  G01R33/3635 ,  G01R33/3657 ,  G01R33/3678 ,  G01R33/422

摘要： To provide a technique for sufficiently eliminating magnetic coupling between RF coils and improving image quality when a multi-element multi-tuned RF coil is used as a receive RF coil for an MRI device. In the invention, each of RF coils which constitute a multi-element multi-tuned RF coil which is used as a receive RF coil for an MRI device is provided with an inter-coil magnetic coupling prevention circuit which resonates at each frequency to which each RF coil is tuned and provides a high impedance. The inter-coil magnetic coupling prevention circuit adjusts an inductor and a capacitor so that both of a circuit on the side of a pre-amplifier viewed from both ends of a signal reception circuit and a circuit on the side of the signal reception circuit viewed from both ends of a serial resonance circuit connected to the pre-amplifier resonate at a plurality of frequencies to which the respective RF coils are tuned.

摘要翻译： 提供一种用于充分消除RF线圈之间的磁耦合并且当多元素多调谐RF线圈用作MRI装置的接收RF线圈时提高图像质量的技术。 在本发明中，构成用作MRI装置的接收RF线圈的多元素多调谐RF线圈的每个RF线圈都设置有线圈间磁耦合防止电路，该电路在每个频率下共振， RF线圈被调谐并提供高阻抗。 线圈间磁耦合防止电路调整电感器和电容器，使得从信号接收电路的两端观看的前置放大器侧的电路和从信号接收电路侧观察的电路 连接到前置放大器的串联谐振电路的两端以相应的RF线圈调谐到的多个频率谐振。

公开(公告)号：US20100178879A1

公开(公告)日：2010-07-15

申请号：US12730310

申请日：2010-03-24

申请人： Yusuke Sato ,  Nobuyoshi Maejima ,  Tomoaki Kudaishi ,  Shinji Moriyama ,  Naoki Kuroda ,  Ryota Sato ,  Masashi Okano

发明人： Yusuke Sato ,  Nobuyoshi Maejima ,  Tomoaki Kudaishi ,  Shinji Moriyama ,  Naoki Kuroda ,  Ryota Sato ,  Masashi Okano

IPC分类号： H04B1/04

CPC分类号： H03F3/195 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F3/68 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/294 ,  H03F2200/451 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.

摘要翻译： 提供了一种技术，用于在增强电子设备的性能的同时，实现具有功率放大器电路的电子设备的尺寸的减小。 用于移动通信设备的RF功率模块包括安装在布线板上的第一和第二半导体芯片，无源部件以及第一和第二集成无源部件。 在第一半导体芯片中，形成用于GSM 900和DCS 1800的功率放大器电路的MISFET元件，并且还形成控制电路。 在第一集成无源部件中，形成用于GSM 900的低通滤波器电路，并且在第二集成无源部件中形成用于DCS 1800的低通滤波器电路。 在第二半导体芯片中，形成用于GSM 900和DCS 1800的天线切换电路。 在布线板的上表面上，第二半导体芯片设置在集成的无源元件之间的第一半导体芯片的旁边。

公开(公告)号：US08166848B2

公开(公告)日：2012-05-01

申请号：US12382048

申请日：2009-03-06

申请人： Shingo Uozumi ,  Nobukazu Ike ,  Takeshi Fukuma ,  Masataka Kameyama ,  Ryota Sato

发明人： Shingo Uozumi ,  Nobukazu Ike ,  Takeshi Fukuma ,  Masataka Kameyama ,  Ryota Sato

IPC分类号： F16H57/02

CPC分类号： F16H57/025 ,  Y10T74/2186

摘要： A transmission case includes a housing that accommodates a starting device, the housing having rib portions on an inner surface; and a speed change mechanism case connected to the housing, the speed change mechanism case accommodating a speed change mechanism, wherein a thin wall portion is provided in the housing by a groove formed in the housing, and the transmission case is structured such that stress is concentrated on the thin wall portion by at least one of the rib portions when an impact load is applied to the transmission case.

摘要翻译： 传动箱包括容纳起动装置的壳体，所述壳体在内表面上具有肋部; 以及与所述壳体连接的变速机构壳体，所述变速机构壳体容纳变速机构，其中，通过形成在所述壳体中的槽而在所述壳体内设置有薄壁部，所述变速箱构造成使得应力为 当冲击载荷施加到变速箱时，通过至少一个肋部分集中在薄壁部分上。

公开(公告)号：US07706756B2

公开(公告)日：2010-04-27

申请号：US11626485

申请日：2007-01-24

申请人： Yusuke Sato ,  Nobuyoshi Maejima ,  Tomoaki Kudaishi ,  Shinji Moriyama ,  Naoki Kuroda ,  Ryota Sato ,  Masashi Okano

发明人： Yusuke Sato ,  Nobuyoshi Maejima ,  Tomoaki Kudaishi ,  Shinji Moriyama ,  Naoki Kuroda ,  Ryota Sato ,  Masashi Okano

IPC分类号： H04B1/44 ,  H04Q7/20

CPC分类号： H03F3/195 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F3/68 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/294 ,  H03F2200/451 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.

摘要翻译： 提供了一种技术，用于在增强电子设备的性能的同时，实现具有功率放大器电路的电子设备的尺寸的减小。 用于移动通信设备的RF功率模块包括安装在布线板上的第一和第二半导体芯片，无源部件以及第一和第二集成无源部件。 在第一半导体芯片中，形成用于GSM 900和DCS 1800的功率放大器电路的MISFET元件，并且还形成控制电路。 在第一集成无源部件中，形成用于GSM 900的低通滤波器电路，并且在第二集成无源部件中形成用于DCS 1800的低通滤波器电路。 在第二半导体芯片中，形成用于GSM 900和DCS 1800的天线切换电路。 在布线板的上表面上，第二半导体芯片设置在集成的无源元件之间的第一半导体芯片的旁边。

公开(公告)号：US20070210866A1

公开(公告)日：2007-09-13

申请号：US11626485

申请日：2007-01-24

申请人： Yusuke Sato ,  Nobuyoshi Maejima ,  Tomoaki Kudaishi ,  Shinji Moriyama ,  Naoki Kuroda ,  Ryota Sato ,  Masashi Okano

发明人： Yusuke Sato ,  Nobuyoshi Maejima ,  Tomoaki Kudaishi ,  Shinji Moriyama ,  Naoki Kuroda ,  Ryota Sato ,  Masashi Okano

IPC分类号： H03F3/68

CPC分类号： H03F3/195 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F3/68 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/294 ,  H03F2200/451 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.

摘要翻译： 提供了一种技术，用于在增强电子设备的性能的同时，实现具有功率放大器电路的电子设备的尺寸的减小。 用于移动通信设备的RF功率模块包括安装在布线板上的第一和第二半导体芯片，无源部件以及第一和第二集成无源部件。 在第一半导体芯片中，形成用于GSM 900和DCS 1800的功率放大器电路的MISFET元件，并且还形成控制电路。 在第一集成无源部件中，形成用于GSM 900的低通滤波器电路，并且在第二集成无源部件中形成用于DCS 1800的低通滤波器电路。 在第二半导体芯片中，形成用于GSM 900和DCS 1800的天线切换电路。 在布线板的上表面上，第二半导体芯片设置在集成的无源元件之间的第一半导体芯片的旁边。

公开(公告)号：US09617315B2

公开(公告)日：2017-04-11

申请号：US14114636

申请日：2012-05-30

申请人： Kazuhide Sekiyama ,  Kaori Sekiyama ,  Mizuki Ishikawa ,  Ryota Sato ,  Shinya Murata

发明人： Kazuhide Sekiyama ,  Kaori Sekiyama ,  Mizuki Ishikawa ,  Ryota Sato ,  Shinya Murata

IPC分类号： C07K14/435 ,  D01F4/02 ,  D01F6/68 ,  D01D5/06 ,  D01D5/16

CPC分类号： C07K14/43518 ,  D01D5/06 ,  D01D5/16 ,  D01F4/02 ,  D01F6/68

摘要： An artificial polypeptide fiber of the present invention is an artificial fiber containing a polypeptide as a main component, and has a stress of 350 MPa or more and a toughness of 138 MJ/m3 or more. A method for producing an artificial polypeptide fiber of the present invention is a method for producing the artificial polypeptide fiber obtained by spinning a spinning solution (6) containing a polypeptide derived from natural spider silk proteins and performing drawing of at least two stages. The drawing of at least two stages includes a first-stage drawing (3) in wet heat and a second-stage drawing (4) in dry heat. Thereby, the present invention provides high-toughness artificial polypeptide fibers having favorable stress and rupture elongation, and a method for producing the same.

公开(公告)号：US08106840B2

公开(公告)日：2012-01-31

申请号：US11937590

申请日：2007-11-09

申请人： Ryota Sato ,  Shingo Tadokoro ,  Susumu Chonan ,  Yukihisa Shimazu

发明人： Ryota Sato ,  Shingo Tadokoro ,  Susumu Chonan ,  Yukihisa Shimazu

IPC分类号： H01Q1/32

CPC分类号： H01Q1/1278 ,  H01Q1/526 ,  H05K9/0005

摘要： A window glass of a vehicle having a roof antenna mounted on an upper rear portion of a roof of the vehicle, has a defogger formed, on the rear window glass, by a plurality of horizontal heating lines which are connected with each other at the respective both ends by busbars; a noise shield pattern provided at a head space of the defogger on the rear window glass and having at least three horizontal lines and at least one vertical line that cross each other; and at least three connecting lines that connect the noise shield pattern and the defogger. The noise shield pattern is formed in a symmetrical shape, and the connecting lines connect the noise shield pattern and the defogger symmetrically at center position and symmetrical positions about the center position in right-and-left direction of the noise shield pattern and the defogger.

摘要翻译： 具有安装在车辆顶部的上后部的屋顶天线的车辆的窗玻璃具有通过多个水平加热线在后窗玻璃上形成的除雾器，所述多个水平加热线在相应的位置处彼此连接 两端都是母线; 噪声屏蔽图案设置在后窗玻璃上的除雾器的顶部空间处，并且具有至少三条水平线和至少一条彼此交叉的垂直线; 以及连接噪声屏蔽图案和除雾器的至少三条连接线。 噪声屏蔽图案形成为对称形状，并且连接线将噪声屏蔽图案和除雾器以中心位置对称设置，并且围绕噪声屏蔽图案和除雾器的左右方向的中心位置的对称位置连接。

公开(公告)号：US07962105B2

公开(公告)日：2011-06-14

申请号：US12730310

申请日：2010-03-24

申请人： Yusuke Sato ,  Nobuyoshi Maejima ,  Tomoaki Kudaishi ,  Shinji Moriyama ,  Naoki Kuroda ,  Ryota Sato ,  Masashi Okano

发明人： Yusuke Sato ,  Nobuyoshi Maejima ,  Tomoaki Kudaishi ,  Shinji Moriyama ,  Naoki Kuroda ,  Ryota Sato ,  Masashi Okano

IPC分类号： H04B1/44 ,  H04K3/00

CPC分类号： H03F3/195 ,  H01L2224/05554 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F3/68 ,  H03F3/72 ,  H03F2200/111 ,  H03F2200/294 ,  H03F2200/451 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A technique is provided for achieving reduction in size of an electronic device with a power amplifier circuit, while enhancing the performance of the electronic device. An RF power module for a mobile communication device includes first and second semiconductor chips, a passive component, and first and second integrated passive components, which are mounted over a wiring board. In the first semiconductor chip, MISFET elements constituting power amplifier circuits for the GSM 900 and for the DCS 1800 are formed, and a control circuit is also formed. In the first integrated passive component, a low pass filter circuit for the GSM 900 is formed, and in the second integrated passive component, a low pass filter circuit for the DCS 1800 is formed. In the second semiconductor chip, antenna switch circuits for the GSM 900 and DCS 1800 are formed. Over the upper surface of the wiring board, the second semiconductor chip is disposed next to the first semiconductor chip between the integrated passive components.

摘要翻译： 提供了一种技术，用于在增强电子设备的性能的同时，实现具有功率放大器电路的电子设备的尺寸的减小。 用于移动通信设备的RF功率模块包括安装在布线板上的第一和第二半导体芯片，无源部件以及第一和第二集成无源部件。 在第一半导体芯片中，形成用于GSM 900和DCS 1800的功率放大器电路的MISFET元件，并且还形成控制电路。 在第一集成无源部件中，形成用于GSM 900的低通滤波器电路，并且在第二集成无源部件中形成用于DCS 1800的低通滤波器电路。 在第二半导体芯片中，形成用于GSM 900和DCS 1800的天线切换电路。 在布线板的上表面上，第二半导体芯片设置在集成的无源元件之间的第一半导体芯片的旁边。

公开(公告)号：US08218328B2

公开(公告)日：2012-07-10

申请号：US12687114

申请日：2010-01-13

申请人： Nobuyoshi Maejima ,  Ryota Sato

发明人： Nobuyoshi Maejima ,  Ryota Sato

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K3/3442 ,  H01L23/3677 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/66 ,  H01L24/16 ,  H01L24/31 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L29/0847 ,  H01L29/4175 ,  H01L29/7787 ,  H01L29/7835 ,  H01L2223/6644 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0237 ,  H05K1/141 ,  H05K2201/09727 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： To provide a technique that can improve the reliability of coupling between a package with a PA module and a mounting board in mounting the package over the mounting board. The width of a back conductor pattern is made smaller than the width of each of back terminals. Specifically, for example, the back terminals are arranged in the X direction. The back terminals arranged in parallel to the X direction are coupled together by the back conductor pattern. At this time, the coupling direction (coupling line direction) of the back conductor pattern is the X direction. Taking into consideration the Y direction orthogonal to (intersecting) the X direction, the width of the back conductor pattern in the Y direction is made smaller than the width of each of the back terminals in the Y direction.

摘要翻译： 提供一种技术，可以在将封装安装在安装板上时，提高具有PA模块的封装与安装板之间的耦合的可靠性。 使后导体图案的宽度小于每个后端子的宽度。 具体地，例如，后端子沿X方向排列。 与X方向平行布置的背面端子通过背面导体图案耦合在一起。 此时，背面导体图案的耦合方向（耦合线方向）为X方向。 考虑与X方向正交（Y相交）的Y方向，使背面导体图案在Y方向上的宽度比Y方向上的各个背面端子的宽度小。

公开(公告)号：US20130314091A1

公开(公告)日：2013-11-28

申请号：US13984855

申请日：2012-02-01

申请人： Yosuke Otake ,  Yoshihisa Soutome ,  Ryota Sato ,  Yoshitaka Bito ,  Koji Hirata

发明人： Yosuke Otake ,  Yoshihisa Soutome ,  Ryota Sato ,  Yoshitaka Bito ,  Koji Hirata

IPC分类号： G01R33/36

CPC分类号： G01R33/365 ,  G01R33/34053 ,  G01R33/34069 ,  G01R33/34076 ,  G01R33/3415 ,  G01R33/3635 ,  G01R33/3657 ,  G01R33/3678 ,  G01R33/422

摘要： To provide a technique for sufficiently eliminating magnetic coupling between RF coils and improving image quality when a multi-element multi-tuned RF coil is used as a receive RF coil for an MRI device. In the invention, each of RF coils which constitute a multi-element multi-tuned RF coil which is used as a receive RF coil for an MRI device is provided with an inter-coil magnetic coupling prevention circuit which resonates at each frequency to which each RF coil is tuned and provides a high impedance. The inter-coil magnetic coupling prevention circuit adjusts an inductor and a capacitor so that both of a circuit on the side of a pre-amplifier viewed from both ends of a signal reception circuit and a circuit on the side of the signal reception circuit viewed from both ends of a serial resonance circuit connected to the pre-amplifier resonate at a plurality of frequencies to which the respective RF coils are tuned.

摘要翻译： 提供一种用于充分消除RF线圈之间的磁耦合并且当多元素多调谐RF线圈用作MRI装置的接收RF线圈时提高图像质量的技术。 在本发明中，构成用作MRI装置的接收RF线圈的多元素多调谐RF线圈的每个RF线圈都设置有线圈间磁耦合防止电路，该电路在每个频率下共振， RF线圈被调谐并提供高阻抗。 线圈间磁耦合防止电路调整电感器和电容器，使得从信号接收电路的两端观看的前置放大器侧的电路和从信号接收电路侧观察的电路 连接到前置放大器的串联谐振电路的两端以相应的RF线圈调谐到的多个频率谐振。