-
公开(公告)号：US10208156B2
公开(公告)日：2019-02-19
申请号：US15113618
申请日：2015-06-01
发明人： Xianping Zeng , Liexiang He , Yongjing Xu
IPC分类号： C08G59/06 , C08G59/42 , C08G59/32 , C08G73/10 , C08L63/00 , C08L79/00 , C08K3/013 , C08K3/36 , C08K5/00 , C08K5/11 , C08J5/24 , H05K1/03 , B32B27/04
摘要： Provided in the present invention are an epoxy resin composition, prepreg and laminate using the same, the epoxy resin composition comprising the following components: (A) an imide modified epoxy resin; and (B) a crosslinking agent, the imide modified epoxy resin being an epoxy resin having a structure of formula (1) and/or formula (2). The prepreg and laminate prepared from the epoxy resin composition have a high glass-transition temperature, a low dielectric constant, a low dielectric loss factor, a high heat and humidity resistance, a high toughness and a good processability.
-
公开(公告)号：US20170283609A1
公开(公告)日：2017-10-05
申请号：US15118204
申请日：2015-06-01
发明人： Xianping Zeng , Liexiang He
CPC分类号： C08L63/04 , C08G59/4071 , C08G59/4215 , C08G59/4238 , C08G59/4284 , C08G59/621 , C08G59/685 , C08G59/686 , C08J5/043 , C08J5/10 , C08J5/24 , C08J2363/04 , C08J2425/08 , C08J2461/14 , C08L63/00 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/05 , H05K1/0373 , C08L61/14 , C08L61/12 , C08L61/32
摘要： Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.
-
公开(公告)号：US11053352B2
公开(公告)日：2021-07-06
申请号：US16523735
申请日：2019-07-26
发明人： Guangbin Chen , Qianfa Liu , Shanyin Yan , Xianping Zeng , Cuiming Du
IPC分类号： C08K9/04 , C08G65/329 , C08F236/06 , C08J5/24 , C08K3/38 , C08K5/14 , C08K7/26 , C08L53/02 , C08F8/02 , C08F8/46
摘要： A vinyl thermosetting resin composition, a prepreg, a laminate, and a printed circuit board are provided. The vinyl thermosetting resin composition has a vinyl thermosetting resin, a curing agent, and hollow borosilicate microspheres with surfaces chemically modified by a vinyl polyphenylene ether resin. The laminate not only has excellent overall properties such as low dielectric constant, low dielectric loss, low water absorption rate, good heat resistance, and the like, but also has only small fluctuations in dielectric constants between batches, which can satisfy the requirements for dielectric constant stability and/or thickness consistency of a substrate.
-
公开(公告)号：US10745599B2
公开(公告)日：2020-08-18
申请号：US15744446
申请日：2016-03-02
发明人： Guangbing Chen , Xianping Zeng , Chiji Guan
IPC分类号： C09J171/12 , C08L71/12 , H05K1/03 , C08J5/24 , C09J11/04 , C09J11/06 , C08G77/20 , C08G65/48 , H05K1/02
摘要： The present invention relates to a polyphenyl ether resin composition and a use thereof in a high-frequency circuit substrate. The polyphenyl ether resin composition comprises a vinyl-modified polyphenyl ether resin and an organic silicon resin containing unsaturated double bonds and having a three-dimensional net structure. The high-frequency circuit substrate of the present invention has a high glass-transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate of high-speed electronic equipment.
-
公开(公告)号：US10308806B2
公开(公告)日：2019-06-04
申请号：US15027365
申请日：2014-08-11
发明人： Guangbing Chen , Xianping Zeng
摘要： The present invention discloses a resin composition, comprising an unsaturated thermosetting modified polyphenylether resin and an MQ organosilicon resin containing unsaturated double bonds and having a three-dimensional network structure and hydrolytically condensed from monofunctional siloxane unit (M unit) and tetrafunctional silica unit (Q unit). The present invention further discloses a high-frequency circuit substrate prepared from the aforesaid resin composition and the uses of the aforesaid resin composition in the art. The high frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interstratified adhesive force, a low dielectric constant and a low dielectric loss tangent, and are very suitable as the circuit substrates of high frequency electronic equipments.
-
公开(公告)号：US10723875B2
公开(公告)日：2020-07-28
申请号：US15744686
申请日：2017-08-14
发明人： Xianping Zeng , Liexiang He
摘要： The present disclosure relates to a halogen-free epoxy resin composition and a prepreg and a laminate using the same. The halogen-free epoxy resin composition comprises: (A) a halogen-free epoxy resin; (B) an active ester resin; and (C) a reactive phosphorous-containing flame retardant. The prepreg and laminate made from the halogen-free epoxy resin composition have the advantages of high inter-laminar adhesive force, low coefficient of thermal expansion and high heat-humidity resistance, and can achieve the halogen-free flame retardant purpose.
-
公开(公告)号：US10465069B2
公开(公告)日：2019-11-05
申请号：US15744579
申请日：2016-04-08
发明人： Guangbing Chen , Xianping Zeng
摘要： Provided are a polyphenyl ether resin composition and a prepreg and a laminated board containing same. The polyphenyl ether resin composition comprises the following components: (1) a tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin; and (2) a vinyl resin cross-linking agent, the weight of the vinyl resin cross-linking agent being 40-100 parts by weight based on 100 parts by weight of the tetrafunctional or higher multifunctional acrylate-modified thermosetting polyphenyl ether resin. The modified thermosetting polyphenyl ether resin, due to containing a tetrafunctional or higher multifunctional acrylate active group, can cross-link more vinyl resin cross-linking agents. Not only the prepared high-speed electronic circuit substrate has low dielectric constant and dielectric loss, but also double bonds in side chains of the vinyl resin cross-linking agent are reacted completely in a resin curing system, so that the high-speed electronic circuit substrate has a better thermo-oxidative aging resistance.
-
公开(公告)号：US09873789B2
公开(公告)日：2018-01-23
申请号：US15118204
申请日：2015-06-01
发明人： Xianping Zeng , Liexiang He
IPC分类号： C08L63/00 , C08L63/04 , C08G59/62 , C08G59/42 , C08J5/24 , C08J5/04 , C08J5/10 , C08G59/68 , H05K1/03
CPC分类号： C08L63/04 , C08G59/4071 , C08G59/4215 , C08G59/4238 , C08G59/4284 , C08G59/621 , C08G59/685 , C08G59/686 , C08J5/043 , C08J5/10 , C08J5/24 , C08J2363/04 , C08J2425/08 , C08J2461/14 , C08L63/00 , C08L2201/02 , C08L2201/22 , C08L2203/20 , C08L2205/05 , H05K1/0373 , C08L61/14 , C08L61/12 , C08L61/32
摘要： Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.
-
公开(公告)号：US10584222B2
公开(公告)日：2020-03-10
申请号：US15555826
申请日：2015-09-18
发明人： Xianping Zeng , Guangbing Chen , Chiji Guan , Wenhua Yang
IPC分类号： C08J5/24 , B32B5/26 , B32B15/08 , B32B15/085 , B32B15/20 , C08F257/02 , H05K1/03 , C08L9/06 , B32B15/14 , C08F279/02 , B32B7/04 , B32B37/10 , C08L71/12
摘要： Provided in the present invention are a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of a polyolefin resin and a bifunctional maleimide or a multifunctional maleimide; and, (B) vinyl thermosetting polyphenylene ether, where with the weight of the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide being 100 parts by weight, the weight of the vinyl thermosetting polyphenylene ether is 200 to 1000 parts by weight. The present invention, by employing the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the polyolefin resin and vinyl thermosetting polyphenylene ether. An aqueous glue solution so mixed is uniform and consistent, the pre-preg has a uniform expression, and a substrate resin area is free of a phase-separation problem.
-
公开(公告)号：US10149380B2
公开(公告)日：2018-12-04
申请号：US14647672
申请日：2013-01-21
发明人： Guangbing Chen , Xianping Zeng
IPC分类号： H05K1/03 , C08J5/24 , C08K5/5425 , C08K5/549 , C08L71/12 , C08L83/04 , B32B15/14 , B32B15/20 , C08G65/48 , C08K5/3417 , C08K5/53 , C08L71/00 , C08G77/20 , H05K3/02
摘要： Disclosed in the present invention is a resin composition, comprising a modified polyphenylene ether resin and an organic silicon compound containing unsaturated double bonds. Also disclosed is a method for preparing a high-frequency circuit substrate using the resin composition as described above and a high-frequency circuit substrate obtained by the preparation method. The high-frequency circuit substrate of the present invention has a high glass transition temperature, a high thermal decomposition temperature, a high interlayer adhesive force, a low dielectric constant and a low dielectric loss tangent, and is very suitable as a circuit substrate in a high-frequency electronic device.
-
-
-
-
-
-
-
-
-
搜索结果
17 条记录 (耗时 0.022 秒)