公开(公告)号：US08053732B2

公开(公告)日：2011-11-08

申请号：US12537445

申请日：2009-08-07

申请人： Sang Kuk Choi ,  Kwang Yong Kang ,  Mun Cheol Paek ,  Min Hwan Kwak ,  Seung Beom Kang

发明人： Sang Kuk Choi ,  Kwang Yong Kang ,  Mun Cheol Paek ,  Min Hwan Kwak ,  Seung Beom Kang

IPC分类号： G01J5/02

CPC分类号： G01J3/108 ,  G01J3/02 ,  G01J3/0208 ,  Y10T29/49826

摘要： Provided are a terahertz wave transmission and reception (Tx/Rx) module package and method of manufacturing the same. The complete and separate terahertz wave Tx/Rx module package is implemented by simply aligning a silicon ball lens, a photoconductive antenna and a focusing lens, and thus facilitates generation or measurement of a terahertz wave. The terahertz wave Tx/Rx module package and method can remarkably reduce time and cost required to build a terahertz wave generation and measurement system, and simplify and miniaturize the terahertz wave generation and measurement system. In addition, characteristics of a terahertz wave generated by the photoconductive antenna can be simply measured. Furthermore, the terahertz wave Tx/Rx module package can be stored and transported with a photoconductive antenna, a silicon ball lens and a focusing lens kept aligned as they are, and also it is possible to minimize pollution of terahertz wave devices caused by surroundings.

摘要翻译： 提供了一种太赫兹波发送和接收（Tx / Rx）模块封装及其制造方法。 通过简单地对准硅球透镜，光电导天线和聚焦透镜来实现完整和单独的太赫兹波Tx / Rx模块封装，从而有助于太赫兹波的产生或测量。 太赫兹波Tx / Rx模块封装和方法可以显着降低构建太赫兹波生成和测量系统所需的时间和成本，并简化和小型化太赫兹波生成和测量系统。 此外，可以简单地测量由光电导天线产生的太赫兹波的特性。 此外，太赫兹波Tx / Rx模块封装可以用光电导天线，硅球透镜和聚焦透镜保持原样保持并传输，并且还可以最小化由周围环境引起的太赫兹波器件的污染。

公开(公告)号：US07598594B2

公开(公告)日：2009-10-06

申请号：US11259959

申请日：2005-10-24

申请人： Jin Woo Jeong ,  Dae Jun Kim ,  Sang Kuk Choi ,  Dae Yong Kim ,  Ho Seob Kim

发明人： Jin Woo Jeong ,  Dae Jun Kim ,  Sang Kuk Choi ,  Dae Yong Kim ,  Ho Seob Kim

IPC分类号： H01L29/06 ,  H01L21/3205 ,  G01N23/00

CPC分类号： H01J37/3177 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/04 ,  H01J2237/0492 ,  H01J2237/1205 ,  H01J2237/1518

摘要： Provided is a wafer-scale microcolumn array using a low temperature co-fired ceramic (LTCC) substrate. The microcolumn array includes a LTCC substrate having wirings and wafer-scale beam deflector arrays, which are attached to at least one side of the LTCC substrate and has an array of deflection devices deflecting electron beams. The wafer-scale microcolumn array using the LTCC substrate makes it possible to significantly increase the throughput of semiconductor wafers, simplify its manufacturing process, and lower its production cost.

摘要翻译： 提供了使用低温共烧陶瓷（LTCC）衬底的晶片级微柱阵列。 微柱阵列包括具有布线和晶片级光束偏转器阵列的LTCC衬底，其连接到LTCC衬底的至少一侧，并具有偏转电子束的偏转装置阵列。 使用LTCC基板的晶片级微柱阵列使得可以显着增加半导体晶片的生产量，简化其制造工艺并降低其生产成本。

公开(公告)号：US07307260B2

公开(公告)日：2007-12-11

申请号：US11174916

申请日：2005-07-01

申请人： Sang Kuk Choi ,  Dae Yong Kim

发明人： Sang Kuk Choi ,  Dae Yong Kim

IPC分类号： H01J37/12

CPC分类号： H01J9/02 ,  H01J3/18 ,  H01J9/14 ,  H01J37/12 ,  H01J2237/1205 ,  H01J2237/3175 ,  H01J2237/31754 ,  Y10T29/49117

摘要： Provided is an electron beam lens for a micro-column electron beam apparatus and a method of manufacturing the same. A photosensitive glass substrate is used as a base isolation substrate and a thin metal film is grown by a plating method. Holes through which electron beam passes are formed by a lift off method after forming a resist pattern shaped as a hole on a seed metal layer and plating the thin metal film.

公开(公告)号：US07214117B2

公开(公告)日：2007-05-08

申请号：US10853519

申请日：2004-05-26

申请人： Sang Kuk Choi ,  Dae Yong Kim ,  Dong Yel Kang

发明人： Sang Kuk Choi ,  Dae Yong Kim ,  Dong Yel Kang

IPC分类号： H01L21/00

CPC分类号： H01J9/02 ,  B82Y10/00 ,  B82Y40/00 ,  H01J3/26 ,  H01J37/1477 ,  H01J37/3174 ,  H01J37/3177 ,  H01J2237/1516 ,  H01J2237/31793

摘要： The present invention relates to a deflector of a micro-column electron beam apparatus and method for fabricating the same, which forms a seed metal layer and a mask layer on both sides of a substrate, and exposes some of the seed metal layer on which deflecting plates, wirings and pads are to be formed by lithography process using a predetermined mask. The wirings and pads are formed by plating metal on the exposed portion, and some of the metal layer is also exposed on which the deflecting plates are to be formed using a predetermined mask, and then the metal is plated with desired thickness, thereby the deflecting plates are completed. Therefore, by forming plurality of deflecting plates on both sides of the substrate at the same time through plating process, alignment between the deflecting plates formed on both sides of the substrate can be exactly made, and by fabricating a deflector integrated with the substrate and deflecting plates in a batch process, productivity and reproducibility is improved. In addition, since the deflecting plates, wirings and pads are directly formed on the substrate, structural safety is improved and thereby durability is also improved.

摘要翻译： 微柱电子束装置的偏转器及其制造方法技术领域本发明涉及一种微柱电子束装置的偏转器及其制造方法，其在基板的两面形成种子金属层和掩模层，并使一些种子金属层露出偏转 板，布线和焊盘将通过使用预定掩模的光刻工艺形成。 布线和焊盘通过在暴露部分上电镀金属而形成，并且一些金属层也暴露在其上将使用预定掩模在其上形成偏转板，然后以期望的厚度镀覆金属，由此偏转 板块完成。 因此，通过电镀处理同时在基板的两面形成多个偏转板，可以精确地形成形成在基板两侧的偏转板之间的对准，并且通过制造与基板一体化的偏转板和偏转 分批处理板，提高了生产率和再现性。 此外，由于偏转板，布线和焊盘直接形成在基板上，所以结构安全性得到改善，从而也提高了耐久性。

公开(公告)号：US06213817B1

公开(公告)日：2001-04-10

申请号：US09465757

申请日：1999-12-17

申请人： Myung Yung Jeong ,  Seung Ho Ahn ,  Sang Kuk Choi ,  Dong Pil Shin ,  Tae Goo Choy

发明人： Myung Yung Jeong ,  Seung Ho Ahn ,  Sang Kuk Choi ,  Dong Pil Shin ,  Tae Goo Choy

IPC分类号： H01R1342

CPC分类号： H01R12/585

摘要： A compliant press-fit pin for electrically coupling a first board to a second board via a plated through hole formed in the second board, includes: an upper part for electrically fixing the first board; a lower part for electrically coupling the first board to a third board via the plated through hole formed in the second board; and a press-fit part located between said upper part and said lower part and containing a fixed beam and a compliant cantilever beam, for electrically coupling the first board fixed to said press-fit part to the second board, wherein the fixed beam and the compliant cantilever beam provide a retention force against a wall of the plated through hole, thereby electrically press-fitting the compliant press-fit pin into the plated through hole, when said press-fit part is inserted into the plated through hole.

摘要翻译： 一种用于通过形成在所述第二板中的电镀通孔将第一板电连接到第二板的柔性压配合销包括：用于电固定所述第一板的上部; 下部，用于经由形成在第二板中的电镀通孔将第一板电连接到第三板; 以及位于所述上部和所述下部之间并且包含固定梁和柔顺悬臂梁的压配合部分，用于将固定到所述压配合部分的第一板电连接到第二板，其中固定梁和 当所述压配合部分插入到电镀通孔中时，柔性悬臂梁提供抵抗电镀通孔的壁的保持力，从而将柔性压配合销电压到电镀通孔中。

公开(公告)号：US07929308B2

公开(公告)日：2011-04-19

申请号：US12535969

申请日：2009-08-05

申请人： Sang Kuk Choi ,  Hyun Tak Kim ,  Byung Gyu Chae ,  Bong Jun Kim

发明人： Sang Kuk Choi ,  Hyun Tak Kim ,  Byung Gyu Chae ,  Bong Jun Kim

IPC分类号： H05K7/20 ,  H01L21/335

CPC分类号： H05K1/0201 ,  H01L2224/48091 ,  H05K1/181 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10522 ,  H01L2924/00014

摘要： A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device.

摘要翻译： 功率器件封装使用半永久性金属 - 绝缘体转换（MIT）装置代替保险丝来控制功率器件的发热，并通过仅在一个区域上提供的小型散热器发射由功率器件产生的热量 功率器件，从而确保良好的散热。 因此，功率器件封装可以有效地应用于使用功率器件的任何电/电子电路。

公开(公告)号：US07755100B2

公开(公告)日：2010-07-13

申请号：US12176867

申请日：2008-07-21

申请人： Sang Kuk Choi ,  Kwang Yong Kang ,  Mun Cheol Paek ,  Min Hwan Kwak

发明人： Sang Kuk Choi ,  Kwang Yong Kang ,  Mun Cheol Paek ,  Min Hwan Kwak

IPC分类号： H01L29/22 ,  H01L33/00 ,  H01L29/227 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  H01L31/02325

摘要： There is provided a packaging apparatus of a terahertz device, the apparatus including: a terahertz device having an active region at which terahertz wave is radiated or detected; a device substrate mounting the terahertz device whose active region is positioned at an opening region formed at the center of the device substrate, and electrically connecting the terahertz device and an external terminal to each other; a ball lens block arranged and fixed to an upper part of the terahertz device; and upper and lower cases receiving the device substrate mounted with the terahertz device therein and opening region vertical upper and lower portions of the active region of the terahertz device.

摘要翻译： 提供了一种太赫兹装置的包装装置，该装置包括：具有辐射或检测太赫兹波的有源区的太赫兹装置; 安装太赫兹器件的器件基板，其有源区域位于形成在器件基板的中心的开口区域，并将太赫兹器件和外部端子彼此电连接; 布置并固定到太赫兹装置的上部的球形透镜块; 以及容纳安装有太赫兹装置的装置基板的上壳体和下壳体以及太赫兹装置的有源区域的开口区域垂直上下部分。

公开(公告)号：US20090152699A1

公开(公告)日：2009-06-18

申请号：US12176867

申请日：2008-07-21

申请人： Sang Kuk CHOI ,  Kwang Yong Kang ,  Mun Cheol Paek ,  Min Hwan Kwak

发明人： Sang Kuk CHOI ,  Kwang Yong Kang ,  Mun Cheol Paek ,  Min Hwan Kwak

IPC分类号： H01L31/0203

CPC分类号： H01L31/0203 ,  H01L31/02325

摘要： There is provided a packaging apparatus of a terahertz device, the apparatus including: a terahertz device having an active region at which terahertz wave is radiated or detected; a device substrate mounting the terahertz device whose active region is positioned at an opening region formed at the center of the device substrate, and electrically connecting the terahertz device and an external terminal to each other; a ball lens block arranged and fixed to an upper part of the terahertz device; and upper and lower cases receiving the device substrate mounted with the terahertz device therein and opening region vertical upper and lower portions of the active region of the terahertz device.

摘要翻译： 提供了一种太赫兹装置的包装装置，该装置包括：具有辐射或检测太赫兹波的有源区的太赫兹装置; 安装太赫兹器件的器件基板，其有源区域位于形成在器件基板的中心的开口区域，并将太赫兹器件和外部端子彼此电连接; 布置并固定到太赫兹装置的上部的球形透镜块; 以及容纳安装有太赫兹装置的装置基板的上壳体和下壳体以及太赫兹装置的有源区域的开口区域垂直上下部分。

公开(公告)号：US20100182034A1

公开(公告)日：2010-07-22

申请号：US12376668

申请日：2007-07-05

申请人： Hyun-Tak Kim ,  Bong-Jun Kim ,  Yong-Wook Lee ,  Sun-Jin Yun ,  Sang-Kuk Choi

发明人： Hyun-Tak Kim ,  Bong-Jun Kim ,  Yong-Wook Lee ,  Sun-Jin Yun ,  Sang-Kuk Choi

IPC分类号： G01R31/26

CPC分类号： G01R31/2641

摘要： Provided are a circuit for continuously measuring a discontinuous metal-insulator transition (MIT) of an MIT element and an MIT sensor using the circuit. The circuit comprises a to-be-measured object unit including the MIT element having a discontinuous MIT occurring at the transition voltage thereof, a power supply unit applying a predetermined pulse current or voltage signal to the to-be-measured object unit, a measurement unit measuring the discontinuous MIT of the MIT element, and a microprocessor controlling the power supply unit and the measurement unit. The discontinuous MIT measurement circuit continuously measures the discontinuous MIT of the MIT element, and thus it can be used as a sensor for sensing a variation in an external factor.

摘要翻译： 提供了一种用于连续测量使用该电路的MIT元件和MIT传感器的不连续金属 - 绝缘体转变（MIT）的电路。 该电路包括被测量对象单元，其包括具有在其转变电压下出现的不连续MIT的MIT元件，向待测量对象单元施加预定脉冲电流或电压信号的电源单元， 测量MIT元件的不连续MIT的单元，以及控制电源单元和测量单元的微处理器。 不连续的MIT测量电路连续测量MIT元件的不连续MIT，因此它可以用作感测外部因素变化的传感器。

公开(公告)号：US20100155605A1

公开(公告)日：2010-06-24

申请号：US12537445

申请日：2009-08-07

申请人： Sang Kuk CHOI ,  Kwang Yong KANG ,  Mun Cheol Paek ,  Min Hwan KWAK ,  Seung Beom KANG

发明人： Sang Kuk CHOI ,  Kwang Yong KANG ,  Mun Cheol Paek ,  Min Hwan KWAK ,  Seung Beom KANG

IPC分类号： G01J5/02

CPC分类号： G01J3/108 ,  G01J3/02 ,  G01J3/0208 ,  Y10T29/49826

摘要： Provided are a terahertz wave transmission and reception (Tx/Rx) module package and method of manufacturing the same. The complete and separate terahertz wave Tx/Rx module package is implemented by simply aligning a silicon ball lens, a photoconductive antenna and a focusing lens, and thus facilitates generation or measurement of a terahertz wave. The terahertz wave Tx/Rx module package and method can remarkably reduce time and cost required to build a terahertz wave generation and measurement system, and simplify and miniaturize the terahertz wave generation and measurement system. In addition, characteristics of a terahertz wave generated by the photoconductive antenna can be simply measured. Furthermore, the terahertz wave Tx/Rx module package can be stored and transported with a photoconductive antenna, a silicon ball lens and a focusing lens kept aligned as they are, and also it is possible to minimize pollution of terahertz wave devices caused by surroundings.

摘要翻译： 提供了一种太赫兹波发送和接收（Tx / Rx）模块封装及其制造方法。 通过简单地对准硅球透镜，光电导天线和聚焦透镜来实现完整和单独的太赫兹波Tx / Rx模块封装，从而有助于太赫兹波的产生或测量。 太赫兹波Tx / Rx模块封装和方法可以显着降低构建太赫兹波生成和测量系统所需的时间和成本，并简化和小型化太赫兹波生成和测量系统。 此外，可以简单地测量由光电导天线产生的太赫兹波的特性。 此外，太赫兹波Tx / Rx模块封装可以用光电导天线，硅球透镜和聚焦透镜保持原样保持并传输，并且还可以最小化由周围环境引起的太赫兹波器件的污染。