PRINTED CIRCUIT BOARD CAPABLE OF VOID CONTROL DURING SURFACE MOUNTING PROCESS
    3.
    发明申请
    PRINTED CIRCUIT BOARD CAPABLE OF VOID CONTROL DURING SURFACE MOUNTING PROCESS 审中-公开
    印刷电路板在表面安装过程中能够进行无声控制

    公开(公告)号:US20080164054A1

    公开(公告)日:2008-07-10

    申请号:US11971854

    申请日:2008-01-09

    IPC分类号: H05K1/00 B23K31/00

    摘要: Example embodiments of the present invention include a printed circuit board (PCB) capable of controlling the size and position of voids during a surface mounting process. To this end, the PCB includes: an insulating plate made of an insulating material; printed circuit patterns formed on the insulating plate; a plurality of lands to support a plurality of solder joints, each land coupled to one end of each of the printed circuit patterns; and anti-wetting layers mounted on a surface of each of the lands for solder joint therein. The anti-wetting layers allow a void produced during a surface mounting process to move to a central surface on a pad, so that the solder joint reliability between the solder ball and the land is increased. As a result, the reliability of a semiconductor device is enhanced.

    摘要翻译: 本发明的示例性实施例包括能够在表面安装处理期间控制空隙的尺寸和位置的印刷电路板(PCB)。 为此,PCB包括:由绝缘材料制成的绝缘板; 形成在绝缘板上的印刷电路图案; 多个焊盘以支撑多个焊点,每个焊盘连接到每个印刷电路图案的一端; 以及安装在每个焊盘的表面上的防润湿层,用于焊接接头。 抗潮湿层允许在表面安装过程期间产生的空隙移动到焊盘上的中心表面,使得焊球和焊盘之间的焊点可靠性增加。 结果,提高了半导体器件的可靠性。

    FIN-TYPE HEAT SINK FOR ELECTRONIC COMPONENT
    5.
    发明申请
    FIN-TYPE HEAT SINK FOR ELECTRONIC COMPONENT 有权
    用于电子元件的FIN型散热器

    公开(公告)号:US20090065175A1

    公开(公告)日:2009-03-12

    申请号:US12205773

    申请日:2008-09-05

    IPC分类号: F28F7/00

    摘要: One embodiment exemplarily described herein can be generally characterized as a heat sink for an electronic component. The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body; and a confining member. The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body.

    摘要翻译: 本文示例性描述的一个实施例通常可以表征为电子部件的散热器。 散热器可以包括可与电子部件热接触的主体; 至少一个翅片与主体热接触; 和一个限制成员。 所述至少一个翅片和所述限制构件可以协同地接合,使得所述至少一个翅片可在相对于所述主体的纵向轴线的第一位置和相对于所述主体的纵向轴线的第二位置之间移动 身体。

    LEAD FRAME TYPE STACK PACKAGE AND METHOD O FABRICATING THE SAME
    6.
    发明申请
    LEAD FRAME TYPE STACK PACKAGE AND METHOD O FABRICATING THE SAME 审中-公开
    引线框架类型堆叠包装及其制造方法

    公开(公告)号:US20080079128A1

    公开(公告)日:2008-04-03

    申请号:US11855951

    申请日:2007-09-14

    IPC分类号: H01L23/495 H01L21/60

    摘要: A lead frame type stack package in which a lead of the package is well connected to a semiconductor module, and a method of fabricating the same are provided. A lead of an upper package and a lead of a lower package are connected using laser soldering. Since leads of the upper and lower packages are connected by solder balls without the use of a soldering pot, loss of a plating layer of the lead due to solder dipping is prevented and the leads are well connected without soldering defects when connecting the lead of the lower package to a connection pad of a semiconductor module substrate.

    摘要翻译: 一种引线框架型堆叠封装,其中封装的引线与半导体模块良好连接,并提供其制造方法。 使用激光焊接连接上封装的引线和下封装的引线。 由于上,下封装的引线通过焊锡球连接而不使用焊锡锅,因此防止了由焊料浸渍引起的引线的镀层损失,并且当连接引线 下封装到半导体模块基板的连接焊盘。