摘要:
A mounting structure of a semiconductor device and a method of mounting the semiconductor device are provided. The mounting structure includes a circuit substrate having a terminal pad. A device substrate is located over the circuit substrate having a ball pad facing the terminal pad of the circuit substrate. A conductive ball is formed between the circuit substrate and the device substrate in order to connect the terminal pad of the circuit substrate to the ball pad of the device substrate. A first soldering flux including an epoxy-based resin connects the conductive ball to the ball pad of the device substrate. An underfill layer is formed between the circuit substrate and the device substrate in order to bury the conductive ball and the first soldering flux. Using the epoxy-based resin, the first soldering flux can substantially prevent crack from being generated in a solder joint between the conductive ball and the ball pad even when the device substrate is thermally deformed due to temperature variations.
摘要:
Provided are a chip network resistor contacting a printed circuit board (PCB) through solder balls and a semiconductor module having the chip network resistor. The chip network resistor includes: a body formed of an insulating material; a resistor formed on the body; external electrodes connected to the resistor and disposed on a lower surface of the body so as to have solder ball pad shapes; and conductive balls adhered on the external electrodes.
摘要:
Example embodiments of the present invention include a printed circuit board (PCB) capable of controlling the size and position of voids during a surface mounting process. To this end, the PCB includes: an insulating plate made of an insulating material; printed circuit patterns formed on the insulating plate; a plurality of lands to support a plurality of solder joints, each land coupled to one end of each of the printed circuit patterns; and anti-wetting layers mounted on a surface of each of the lands for solder joint therein. The anti-wetting layers allow a void produced during a surface mounting process to move to a central surface on a pad, so that the solder joint reliability between the solder ball and the land is increased. As a result, the reliability of a semiconductor device is enhanced.
摘要:
An electronic device with a reworkable electronic component, a method of manufacturing the electronic device, and a method of reworking the electronic component are disclosed. The electronic device includes a first cavity provided in a board body. A first metal pattern is provided on the board body and adjacent to the first cavity. A first electronic component is provided in the first cavity. A first connection pattern is provided adjacent to an upper edge portion of the first electronic component and extends to the first metal pattern so that the first metal pattern is electrically connected to the first electronic component.
摘要:
One embodiment exemplarily described herein can be generally characterized as a heat sink for an electronic component. The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body; and a confining member. The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body.
摘要:
A lead frame type stack package in which a lead of the package is well connected to a semiconductor module, and a method of fabricating the same are provided. A lead of an upper package and a lead of a lower package are connected using laser soldering. Since leads of the upper and lower packages are connected by solder balls without the use of a soldering pot, loss of a plating layer of the lead due to solder dipping is prevented and the leads are well connected without soldering defects when connecting the lead of the lower package to a connection pad of a semiconductor module substrate.
摘要:
A semiconductor memory module having a reverse mounted chip resistor, and a method of fabricating the same are provided. By reverse mounting the chip resistor on the semiconductor memory module, the resistive material is protected, thereby preventing open circuits caused by damage to the resistive material. Also, a chip-resistor connection pad of a module substrate is formed to extend higher from the module substrate than other connection pads connected to other elements. Thus, the resistive material of the chip resistor does not contact the module substrate, thereby preventing poor alignment and defective connections.
摘要:
Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.