摘要:
A substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, comprising:an insulating layer which is composed of a resin containing heat conductive fillers under the mounting position of said light emitting element and has a heat conductivity of 1.0 W/mK or more; and a metal layer disposed inside said insulating layer and having the thick metal section, wherein a heat conductive mask section is disposed at the top of said thick metal section.
摘要:
This invention provides a substrate for a light emitting element package that can obtain a sufficient heat dissipation effect from a light emitting element and can also lower the costs and reduce the size as a substrate for packaging the light emitting element, as well as a light emitting element package using the same. The substrate for a light emitting element package includes an insulating layer 1 composed of a resin 1a containing heat conductive fillers 1b, 1c, a thick metal section 2 formed under a mounting position of a light emitting element 4, and a surface electrode section 3 formed on a mounting side of said insulating layer 1 separately from said thick metal section 2.
摘要:
A thermoplastic resin composition composed of a mixture comprising a graft polymer obtained by subjecting a monomer mixture of an aromatic vinyl monomer and a vinyl cyanide monomer to emulsion polymerization in the presence of a diene rubber latex, and a hard polymer obtained by copolymerizing a monomer mixture of an aromatic vinyl monomer and a vinyl cyanide monomer, in which the number average particle size Dn of diene rubber particles contained in the composition is at most 0.1 .mu.m, the ratio (Dw/Dn) of the weight average particle size Dw to the number average particle size Dn of the diene rubber particles is at least 5.0, the graft rate of said graft polymer is at least 60%, and the content of an emulsifier and a reaction product of an emulsifier is not higher than 2% by weight.
摘要:
A thermoplastic resin composition composed of a mixture comprising:(A) from 5 to 94% by weight of an elastomer-containing styrene resin comprising an elastomer component and a resin component having a glass transition temperature of higher than 20.degree. C., with a covalent substance of the elastomer and resin components being present at the interface between the elastomer component constituting a dispersed phase and the resin component constituting a continuous phase;(B) from 5 to 94% by weight of a polycarbonate resin; and(C) from 0.1 to 20% by weight of a polymer of a monomer containing an acrylate monomer having a solubility parameter of from 8.4 to 9.8 (cal/cc).sup.1/2, a glass transition temperature of not higher than 20.degree. C. and a gel content of not higher than 70% by weight.
摘要:
A molded article of a transparent ABS resin comprising 10 to 24% by weight of a diene type rubber having a weight average particle size of 150 m.mu. or less and not containing methyl methacrylate in the continuous resin phase is subjected to wet plating. The resulting plated resin article has an excellent adhesion of the plating layer and a good transparency.
摘要:
A thermoplastic resin composition consists essentially of (A) 100 parts by weight of a rubber-containing styrene type resin and (B) 1 to 45 parts by weight of a polymeric substance selected from the group consisting of a homopolymer of an acrylic acid ester, copolymers of an acrylic acid ester, and a mixture of these polymers, said component (B) having a solubility parameter of from 8.4 to 9.8 (cal/c.c.).sup.1/2, a glass transition temperature of 20.degree. C. or below, a gel content of 70% by weight or below, and relative viscosity of a substance soluble in methylethyl ketone of 20 or below.
摘要:
A method for manufacturing a substrate for a light emitting element package provided with a thick metal section formed under a mounting position of a light emitting element, having a lamination step of laminating and integrating a laminate having an insulating adhesive agent which is composed of a resin containing heat conductive fillers and has a heat conductivity of 1.0 W/mK or more and a metal layer member, with a metal layer member having a thick metal section while drawing out each member.
摘要:
In an ATM switching module, expansion interfaces are connected in pair to an ATM switch to respectively operate in active and standby states. When another ATM switching module is installed and a connection is established between an expansion interface of standby state and the newly installed ATM switching module, a process sets the standby state expansion interface in hot-standby state, and holds off incoming ATM cells destined for the hot-standby state expansion interface until the connection is ready to accept cell traffic, whereupon the hot-standby state expansion interface is switched to active state, whereby the ATM switch and an ATM switch of the another switching module constitute a multi-stage configuration. The processor is arranged to update the routing table according to internal state of the ATM switch so that, when a call is to be established for an incoming ATM cell, the header of the cell contains a plurality of fields containing routing data respectively associated with different stages of the multi-stage configuration.
摘要:
A brush-equipped container for a cyanoacrylate adhesive, the container comprising: a container main body comprising a polyolefin resin; and a cap for capping the container main body, which has a brush member provided on the inner side of the cap so that the brush member is housed in the container main body, the brush member comprising a handle and bristles, wherein at least the container main body is coated with a gas-impermeable coating material which is insoluble in the cyanoacrylate and which has poor adhesion property with respect to the cyanoacrylate.
摘要:
A polymer composition obtained by mixing, in an emulsion state,(A) from 20 to 90% by weight (as solid content of polymer) of an emulsion of polymer component (A) which is a polymer of a vinyl monomer and has a glass transition temperature of higher than 20.degree. C., a gel content of not higher than 10% and a solubility parameter of from 8.0 to 11.0 (cal/cc).sup.1/2 and which has a weight average molecular weight, based on polystyrene, of at least 1.5.times.10.sup.5, and(B) from 10 to 80% by weight (as solid content of polymer) of an emulsion of polymer component (B) which is a homopolymer of an acrylate monomer, a copolymer of acrylate monomers or a copolymer of an acrylate monomer with other copolymerizable monomer and has a glass transition temperature of not higher than 20.degree. C., a gel content of not higher than 70% and a solubility parameter of from 8.4 to 9.8 (cal/cc).sup.1/2,and separating the polymer from the emulsion mixture.