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    Method of manufacturing multilayer wiring boards
    4.
    发明授权
    Method of manufacturing multilayer wiring boards 有权
    多层布线板的制造方法

    公开(公告)号：US06527963B1

    公开(公告)日：2003-03-04

    申请号：US09600424

    申请日：2000-07-13

    申请人： Eiji Yoshimura

    发明人： Eiji Yoshimura

    IPC分类号： H01B1300

    CPC分类号： H05K3/062 ,  H05K3/061 ,  H05K3/244 ,  H05K3/4647 ,  H05K2203/0384 ,  H05K2203/072 ,  H05K2203/0733

    摘要： In a method of manufacturing a multilayer wiring board according to the present invention having the step of after forming a column-like metallic body on a lower wiring layer, forming an upper wiring layer whose part is conductively connected with the column-like metallic body, the column-like metallic body is formed by the step of coating the lower wiring layer with a conductor showing durability at the time of etching metal composing the column-like metallic body so as to form a conductive layer, the step of forming a plating layer of the metal composing the column-like metallic body on a whole surface including the conductive layer, the step of forming a mask layer on a surface portion of the plating layer where the column-like metallic body is formed, and the step of etching the plating layer. The present invention can provide the method of manufacturing a multilayer wiring board which can form the column-like metallic body having uniform height for short time according to a simple and low-priced method.

    摘要翻译： 在制造根据本发明的多层布线板的方法中，具有在下布线层上形成柱状金属体之后的步骤，形成其一部分与柱状金属体导电连接的上布线层， 柱状金属体通过以下方式形成：在蚀刻构成柱状金属体的金属时形成耐久性的导体涂布下部布线层，形成导电层，形成镀层的工序 构成柱状金属体的金属在包括导电层的整个表面上形成掩模层的步骤，在形成柱状金属体的镀层的表面部分上形成蚀刻步骤 电镀层。 本发明可以提供一种多层布线板的制造方法，该多层布线基板可以根据简单且低价格的方法在短时间内形成具有均匀高度的柱状金属体。

    Method of manufacturing multilayer wiring board
    5.
    发明授权
    Method of manufacturing multilayer wiring board 有权
    多层布线板的制造方法

    公开(公告)号：US06555209B1

    公开(公告)日：2003-04-29

    申请号：US09914819

    申请日：2001-08-31

    申请人： Eiji Yoshimura ,  Toshiro Higuchi

    发明人： Eiji Yoshimura ,  Toshiro Higuchi

    IPC分类号： B32B300

    CPC分类号： B32B3/00 ,  H05K3/4647 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/0733 ,  Y10T428/24917

    摘要： A method of manufacturing a multilayer wiring board comprising a step of forming an upper wiring layer (27), a part thereof being electrically connected to a pillar-shaped metallic body (24a), after he pillar-shaped metal body (24a) is formed on a lower wiring layer (22) is characterized in that the step of forming the metallic body includes a sub-step of forming a plating layer (24) constituting the metallic body, a sub-step of forming a mask layer (25) on the surface where the metal body is formed, of the plating layer, and a sub-step of etching the plating layer. The manufacture can be carried out with simple equipment combination of conventional steps and the wiring layer can be made fine. Moreover, a multilayer wiring board having a high reliability can be manufactured,

    摘要翻译： 一种制造多层布线板的方法，包括在形成柱状金属体（24a）之后，形成上部布线层（27）的一部分与柱状金属体（24a）电连接的步骤 在下布线层（22）上的特征在于，形成金属体的步骤包括形成构成金属体的镀层（24）的子步骤，形成掩模层（25）的子步骤 形成金属体的表面，镀层的蚀刻镀层的子步骤。 制造可以用常规步骤的简单设备组合进行，并且布线层可以做得很好。 此外，可以制造具有高可靠性的多层布线板，

    SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT AND METHOD FOR PRODUCING SAME
    6.
    发明申请
    SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT AND METHOD FOR PRODUCING SAME 审中-公开
    用于安装发光元件的基板及其制造方法

    公开(公告)号：US20120311856A1

    公开(公告)日：2012-12-13

    申请号：US13509243

    申请日：2010-10-15

    申请人： Eiji Yoshimura

    发明人： Eiji Yoshimura

    IPC分类号： H05K3/00

    CPC分类号： H01L33/647 ,  H01L33/486 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2933/0066 ,  Y10T29/49124 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： Disclosed is a method for producing a substrate for mounting a light-emitting element, whereby a substrate for mounting a light-emitting element such that power can be supplied via a columnar metal body even if the side surfaces of the columnar metal body do not have pads can be produced by means of a low-cost and easy step that does not involve lamination of a metal foil, plating, or the like. Further disclosed are a substrate for mounting a light-emitting element and a light-emitting element package. The substrate for mounting a light-emitting element is provided with: at least two columnar metal bodies (14a-14c); at least two electrodes (10a-10b) that are provided on the rear surface side of the columnar metal bodies (14a-14c) so as to be conductive therewith; and an insulating layer (16) that exposes the upper surface of the columnar metal bodies (14a-14c). The sides of the columnar metal bodies do not have pads.

    摘要翻译： 公开了一种用于制造用于安装发光元件的基板的方法，由此即使柱状金属体的侧表面不具有用于安装发光元件的基板，使得能够经由柱状金属体供电， 可以通过不涉及金属箔，电镀等的层叠的低成本且容易的步骤来制造垫。 进一步公开了用于安装发光元件和发光元件封装的基板。 用于安装发光元件的基板设置有：至少两个柱状金属体（14a-14c）; 至少两个电极（10a-10b），其设置在所述柱状金属体（14a-14c）的背面侧以便与其导电; 以及暴露柱状金属体（14a-14c）的上表面的绝缘层（16）。 柱状金属体的两侧不具有垫。

    Automobile movable floor apparatus
    8.
    发明授权
    Automobile movable floor apparatus 失效
    汽车移动地板装置

    公开(公告)号：US07556307B2

    公开(公告)日：2009-07-07

    申请号：US11700948

    申请日：2007-02-01

    申请人： Tomonori Ohtsubo ,  Hiroki Uemura ,  Toshimine Morino ,  Kazuhiro Matsuhashi ,  Keisuke Iida ,  Yukio Iwayama ,  Eiji Yoshimura

    发明人： Tomonori Ohtsubo ,  Hiroki Uemura ,  Toshimine Morino ,  Kazuhiro Matsuhashi ,  Keisuke Iida ,  Yukio Iwayama ,  Eiji Yoshimura

    IPC分类号： B60N3/06 ,  B62J25/00 ,  G05G1/18

    CPC分类号： B62D25/2045 ,  B60N2/074 ,  B60N3/063 ,  B60N3/066 ,  G05G1/60

    摘要： A floor board positioned in the foot area of an occupant seated in an occupant seat is allowed to be driven up or down. In an automobile movable floor apparatus, a floor board 5 that covers the upper face of an automobile body floor 3 and a raising-lowering drive mechanism 6 that drives the floor board 5 to be raised or lowered are provided in the foot area of an occupant seated in an occupant seat 4, and a toe board portion 8 sloping down to the rear and a floor base portion 9 that extends toward the rear of the automobile body and is continuous with the rear end of the toe board portion 8 are provided in the automobile body floor 3. The floor board 5 includes a toe board corresponding portion 18 that corresponds to the toe board portion 8 of the automobile body floor 3, and a floor base corresponding portion 19 that corresponds to the floor base portion 9, and the toe board corresponding portion 18 and the floor base corresponding portion 19 are formed in a flattened V-like shape when viewed from the side.

    摘要翻译： 位于乘坐者座位的脚部区域中的地板被允许被上下驱动。 在汽车移动地板装置中，在乘员的脚部区域设置有覆盖汽车车身地板3的上表面的地板5和驱动地板5的升降的升降驱动机构6 位于乘员座椅4上的脚趾板部8和向后方倾斜的脚趾板部8以及朝向车身后方延伸并且与脚趾板部8的后端连续的地板基部9设置在 汽车车身地板3.地板5包括对应于汽车车身地板3的脚趾板部分8的脚趾板对应部分18和对应于地板底座部分9的地板底座对应部分19和脚趾部分 板对应部分18和地板底座对应部分19从侧面观察时形成为扁平的V形形状。

    Automobile movable floor appparatus
    9.
    发明申请
    Automobile movable floor appparatus 失效
    汽车移动地板设备

    公开(公告)号：US20070176456A1

    公开(公告)日：2007-08-02

    申请号：US11700948

    申请日：2007-02-01

    申请人： Tomonori Ohtsubo ,  Hiroki Uemura ,  Toshimine Morino ,  Kazuhiro Matsuhashi ,  Keisuke Iida ,  Yukio Iwayama ,  Eiji Yoshimura

    发明人： Tomonori Ohtsubo ,  Hiroki Uemura ,  Toshimine Morino ,  Kazuhiro Matsuhashi ,  Keisuke Iida ,  Yukio Iwayama ,  Eiji Yoshimura

    IPC分类号： B60N3/06

    CPC分类号： B62D25/2045 ,  B60N2/074 ,  B60N3/063 ,  B60N3/066 ,  G05G1/60

    摘要： A floor board positioned in the foot area of an occupant seated in an occupant seat is allowed to be driven up or down. In an automobile movable floor apparatus, a floor board 5 that covers the upper face of an automobile body floor 3 and a raising-lowering drive mechanism 6 that drives the floor board 5 to be raised or lowered are provided in the foot area of an occupant seated in an occupant seat 4, and a toe board portion 8 sloping down to the rear and a floor base portion 9 that extends toward the rear of the automobile body and is continuous with the rear end of the toe board portion 8 are provided in the automobile body floor 3. The floor board 5 includes a toe board corresponding portion 18 that corresponds to the toe board portion 8 of the automobile body floor 3, and a floor base corresponding portion 19 that corresponds to the floor base portion 9, and the toe board corresponding portion 18 and the floor base corresponding portion 19 are formed in a flattened V-like shape when viewed from the side.

    摘要翻译： 位于乘坐者座位的脚部区域中的地板被允许被上下驱动。 在汽车移动地板装置中，在乘员的脚部区域设置有覆盖汽车车身地板3的上表面的地板5和驱动地板5的升降的升降驱动机构6 位于乘员座椅4上的脚趾板部8和向后方倾斜的脚趾板部8以及朝向车身后方延伸并且与脚趾板部8的后端连续的地板基部9设置在 汽车车身地板3。 地板5包括对应于汽车车身地板3的脚趾板部分8的脚趾板对应部分18和对应于地板底座部分9的地板底座对应部分19和趾板对应部分18和 当从侧面观察时，底板对应部分19形成为扁平的V形形状。