公开(公告)号：US20070015351A1

公开(公告)日：2007-01-18

申请号：US11525943

申请日：2006-09-25

申请人： Hiroaki Tomimori ,  Hidemitsu Aoki ,  Kaoru Mikagi ,  Akira Furuya ,  Tetsuya Tao

发明人： Hiroaki Tomimori ,  Hidemitsu Aoki ,  Kaoru Mikagi ,  Akira Furuya ,  Tetsuya Tao

IPC分类号： H01L21/44 ,  H01L21/302

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03019 ,  H01L2224/035 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05557 ,  H01L2224/05561 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05552

摘要： An oxide film formed on the surface of copper film of an electrode pad is cleaned by oxalic acid after unevenness is formed on the surface of copper film by treating the surface with organic acid. Thereby, stable resistance is obtained when carrying out a characteristic inspection by bringing a probe into contact with the electrode pad, and it is easily recognized by observation through a microscope that the probe is brought into contact with the electrode pad. In addition, wettability with respect to solder is satisfactory, and it is possible to favorably form a solder bump on the electrode pad.

摘要翻译： 通过用有机酸处理表面，在铜膜的表面上形成凹凸后，用草酸清洗形成在电极焊盘的铜膜表面上的氧化膜。 由此，通过使探针与电极焊盘接触进行特性检查时，获得稳定的电阻，并且通过用显微镜观察容易地识别出探针与电极焊盘接触。 此外，相对于焊料的润湿性是令人满意的，并且可以有利地在电极焊盘上形成焊料凸块。

公开(公告)号：US06432807B1

公开(公告)日：2002-08-13

申请号：US09590515

申请日：2000-06-09

申请人： Hiroyuki Tsukui ,  Chikara Yamashita ,  Tetsuya Tao

发明人： Hiroyuki Tsukui ,  Chikara Yamashita ,  Tetsuya Tao

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3473 ,  H05K2203/0152 ,  H05K2203/0338 ,  H05K2203/0726 ,  H01L2224/05599

摘要： A bump formation plate is provided with a base and solder bumps formed on the base. The top portion of the solder bump inclines from the center thereof to the periphery thereof. A contact surface of the solder bump with the base may be flat. The base is made of, for example, aluminum or stainless steel.

摘要翻译： 凸块形成板设置有形成在基部上的基部和焊料凸块。 焊料凸块的顶部从其中心向其周边倾斜。 焊料凸块与基座的接触表面可以是平坦的。 基座由例如铝或不锈钢制成。

公开(公告)号：US06756685B2

公开(公告)日：2004-06-29

申请号：US10210157

申请日：2002-08-01

申请人： Tetsuya Tao

发明人： Tetsuya Tao

IPC分类号： H01L2348

CPC分类号： H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00

摘要： In a semiconductor device which is formed by connecting electrodes of a package substrate composed of a resin and electrodes of a semiconductor chip formed of a silicon semiconductor, an underfill resin having the Young's modulus of less than 100 kgf/mm2 is filled in the gap of the junction between the semiconductor chip and the package substrate.

摘要翻译： 在通过连接由树脂构成的封装衬底的电极和由硅半导体形成的半导体芯片的电极形成的半导体器件中，填充杨氏模量小于100kgf / mm 2的底部填充树脂 半导体芯片和封装衬底之间的接合部的间隙。

公开(公告)号：US07560372B2

公开(公告)日：2009-07-14

申请号：US11525943

申请日：2006-09-25

申请人： Hiroaki Tomimori ,  Hidemitsu Aoki ,  Kaoru Mikagi ,  Akira Furuya ,  Tetsuya Tao

发明人： Hiroaki Tomimori ,  Hidemitsu Aoki ,  Kaoru Mikagi ,  Akira Furuya ,  Tetsuya Tao

IPC分类号： H01L23/485 ,  H01L23/488

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03019 ,  H01L2224/035 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05557 ,  H01L2224/05561 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05552

摘要： An oxide film formed on the surface of copper film of an electrode pad is cleaned by oxalic acid after unevenness is formed on the surface of copper film by treating the surface with organic acid. Thereby, stable resistance is obtained when carrying out a characteristic inspection by bringing a probe into contact with the electrode pad, and it is easily recognized by observation through a microscope that the probe is brought into contact with the electrode pad. In addition, wettability with respect to solder is satisfactory, and it is possible to favorably form a solder bump on the electrode pad.

摘要翻译： 通过用有机酸处理表面，在铜膜的表面上形成凹凸后，用草酸清洗形成在电极焊盘的铜膜表面上的氧化膜。 由此，通过使探针与电极焊盘接触进行特性检查时，获得稳定的电阻，并且通过用显微镜观察容易地识别出探针与电极焊盘接触。 此外，相对于焊料的润湿性是令人满意的，并且可以有利地在电极焊盘上形成焊料凸块。

公开(公告)号：US07170172B2

公开(公告)日：2007-01-30

申请号：US10318199

申请日：2002-12-13

申请人： Hiroaki Tomimori ,  Hidemitsu Aoki ,  Kaoru Mikagi ,  Akira Furuya ,  Tetsuya Tao

发明人： Hiroaki Tomimori ,  Hidemitsu Aoki ,  Kaoru Mikagi ,  Akira Furuya ,  Tetsuya Tao

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03019 ,  H01L2224/035 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05557 ,  H01L2224/05561 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05552

摘要： An oxide film formed on the surface of copper film of an electrode pad is cleaned by oxalic acid after unevenness is formed on the surface of copper film by treating the surface with organic acid. Thereby, stable resistance is obtained when carrying out a characteristic inspection by bringing a probe into contact with the electrode pad, and it is easily recognized by observation through a microscope that the probe is brought into contact with the electrode pad. In addition, wettability with respect to solder is satisfactory, and it is possible to favorably form a solder bump on the electrode pad.

摘要翻译： 通过用有机酸处理表面，在铜膜的表面上形成凹凸后，用草酸清洗形成在电极焊盘的铜膜表面上的氧化膜。 由此，通过使探针与电极焊盘接触进行特性检查时，获得稳定的电阻，并且通过用显微镜观察容易地识别出探针与电极焊盘接触。 此外，相对于焊料的润湿性是令人满意的，并且可以有利地在电极焊盘上形成焊料凸块。

公开(公告)号：US06410981B1

公开(公告)日：2002-06-25

申请号：US09176326

申请日：1998-10-22

申请人： Tetsuya Tao

发明人： Tetsuya Tao

IPC分类号： H01L2312

摘要： A packaged semiconductor device having high reliability that allows for a large number of pins and that provides good heat removal properties, and that can discharge the high pressure moisture in a gas state from the inside thereof to the exterior. The device includes a strengthening ring arranged around a semiconductor chip that includes a process type electrode and that is mounted on an isolated substrate; a resin to fill spaces between the semiconductor chip and the isolated substrate; and a cap on the semiconductor chip and the strengthening ring, wherein at least one vent is formed perpendicular to the direction of the thickness of the semiconductor chip.