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    Interconnect structures and design structures for a radiofrequency integrated circuit
    1.
    发明授权
    Interconnect structures and design structures for a radiofrequency integrated circuit 有权
    射频集成电路的互连结构和设计结构

    公开(公告)号：US08791545B2

    公开(公告)日：2014-07-29

    申请号：US13560446

    申请日：2012-07-27

    申请人： Timothy J. Dalton ,  Ebenezer E. Eshun ,  Sarah L. Grunow ,  Zhong-Xiang He ,  Anthony K. Stamper

    发明人： Timothy J. Dalton ,  Ebenezer E. Eshun ,  Sarah L. Grunow ,  Zhong-Xiang He ,  Anthony K. Stamper

    IPC分类号： H01L21/02

    CPC分类号： H01L21/76885 ,  H01L21/76816 ,  H01L21/76832 ,  H01L21/76834 ,  H01L27/016 ,  H01L28/20 ,  H01L28/40

    摘要： Interconnect structures that include a passive element, such as a thin film resistor or a metal-insulator-metal (MIM) capacitor, methods for fabricating an interconnect structure that includes a passive element, and design structures embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit, such as a radiofrequency integrated circuit. A top surface of a dielectric layer is recessed relative to a top surface of a conductive feature in the dielectric layer. The passive element is formed on the recessed top surface of the dielectric layer and includes a layer of a conductive material that is coplanar with, or below, the top surface of the conductive feature.

    摘要翻译： 包括诸如薄膜电阻器或金属 - 绝缘体 - 金属（MIM）电容器的无源元件的互连结构，用于制造包括无源元件的互连结构的方法，以及体现在机器可读介质中的设计结构，用于设计， 制造或测试诸如射频集成电路的集成电路。 电介质层的顶表面相对于电介质层中导电特征的顶表面凹陷。 无源元件形成在介电层的凹入的顶表面上，并且包括与导电特征的顶表面共面或低于导电特征的顶表面的导电材料层。

    Pattern formation employing self-assembled material
    2.
    发明授权
    Pattern formation employing self-assembled material 有权
    采用自组装材料的图案形成

    公开(公告)号：US08486511B2

    公开(公告)日：2013-07-16

    申请号：US13430177

    申请日：2012-03-26

    申请人： Charles T. Black ,  Timothy J. Dalton ,  Bruce B. Doris ,  Carl J. Radens

    发明人： Charles T. Black ,  Timothy J. Dalton ,  Bruce B. Doris ,  Carl J. Radens

    IPC分类号： B32B3/00

    CPC分类号： H01L21/0338 ,  B81B2203/0369 ,  B81C1/00031 ,  B81C2201/0149 ,  B81C2201/0198 ,  B82Y30/00 ,  H01L21/0337 ,  H01L51/0017 ,  Y10S977/882 ,  Y10S977/887 ,  Y10S977/888 ,  Y10T428/24479 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/24736 ,  Y10T428/24802

    摘要： In one embodiment, Hexagonal tiles encompassing a large are divided into three groups, each containing ⅓ of all hexagonal tiles that are disjoined among one another. Openings for the hexagonal tiles in each group are formed in a template layer, and a set of self-assembling block copolymers is applied and patterned within each opening. This process is repeated three times to encompass all three groups, resulting in a self-aligned pattern extending over a wide area. In another embodiment, the large area is divided into rectangular tiles of two non-overlapping and complementary groups. Each rectangular area has a width less than the range of order of self-assembling block copolymers. Self-assembled self-aligned line and space structures are formed in each group in a sequential manner so that a line and space pattern is formed over a large area extending beyond the range of order.

    摘要翻译： 在一个实施例中，包括大的六边形瓦片被分成三组，每组包含彼此分离的所有六边形瓦片的1/3。 每个组中的六边形瓦片的开口形成在模板层中，并且在每个开口内施加并组合一组自组装嵌段共聚物。 该过程重复三次以包含所有三组，导致在大面积上延伸的自对准图案。 在另一个实施例中，大面积被分成两个不重叠和互补组的矩形瓦片。 每个矩形区域的宽度小于自组装嵌段共聚物的顺序范围。 在每组中以顺序的方式形成自组装的自对准线和空间结构，使得在超过有序范围的大面积上形成线和空间图案。

    Flash memory gate structure for widened lithography window
    4.
    发明授权
    Flash memory gate structure for widened lithography window 失效
    用于加宽光刻窗的闪存门结构

    公开(公告)号：US07888729B2

    公开(公告)日：2011-02-15

    申请号：US12198345

    申请日：2008-08-26

    申请人： Kangguo Cheng ,  Lawrence A. Clevenger ,  Timothy J. Dalton ,  Louis L. Hsu

    发明人： Kangguo Cheng ,  Lawrence A. Clevenger ,  Timothy J. Dalton ,  Louis L. Hsu

    IPC分类号： H01L21/336

    CPC分类号： H01L29/7881 ,  H01L29/66825

    摘要： A first portion of a semiconductor substrate belonging to a flash memory device region is recessed to a recess depth to form a recessed region, while a second portion of the semiconductor substrate belonging to a logic device region is protected with a masking layer. A first gate dielectric layer and a first gate conductor layer formed within the recessed region such that the first gate conductive layer is substantially coplanar with the top surfaces of the shallow trench isolation structures. A second gate dielectric layer, a second gate conductor layer, and a gate cap hard mask layer, each having a planar top surface, is subsequently patterned. The pattern of the gate structure in the flash memory device region is transferred into the first gate conductor layer and the first gate dielectric layer to form a floating gate and a first gate dielectric, respectively.

    摘要翻译： 属于闪存器件区域的半导体衬底的第一部分凹陷到凹陷深度以形成凹陷区域，而属于逻辑器件区域的半导体衬底的第二部分被掩蔽层保护。 形成在凹陷区域内的第一栅介质层和第一栅极导体层，使得第一栅极导电层与浅沟槽隔离结构的顶表面基本共面。 随后对第二栅介质层，第二栅极导体层和栅帽硬掩模层进行构图，每个具有平坦的顶表面。 闪存器件区域中的栅极结构的图案被转移到第一栅极导体层和第一栅极介电层中，以分别形成浮置栅极和第一栅极电介质。

    Method of forming an interconnection structure in a organosilicate glass having a porous layer with higher carbon content located between two lower carbon content non-porous layers
    5.
    发明授权
    Method of forming an interconnection structure in a organosilicate glass having a porous layer with higher carbon content located between two lower carbon content non-porous layers 失效
    在具有位于两个低碳含量无孔层之间的具有较高碳含量的多孔层的有机硅酸盐玻璃中形成互连结构的方法

    公开(公告)号：US07767587B2

    公开(公告)日：2010-08-03

    申请号：US12034692

    申请日：2008-02-21

    申请人： Nicholas C. M. Fuller ,  Timothy J. Dalton

    发明人： Nicholas C. M. Fuller ,  Timothy J. Dalton

    IPC分类号： H01L21/28 ,  H01L21/47

    CPC分类号： H01L21/76835 ,  H01L21/76807 ,  H01L21/76808 ,  H01L21/76829 ,  H01L21/76834 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Interconnect structures possessing a non-porous (dense) low-k organosilicate glass (OSG) film utilizing a porous low-k OSG film as an etch stop layer or a porous low-k OSG film using a non-porous OSG film as a hardmask for use in semiconductor devices are provided herein. The novel interconnect structures are capable of delivering improved device performance, functionality and reliability owing to the reduced effective dielectric constant of the stack compared with that of those conventionally employed and also because of the relatively uniform line heights made feasible by these unique and seemingly counterintuitive features. The present invention also provides a fluorocarbon-based dual damascene etch process that achieves selective etching of a dense low-k OSG films relative to that of a porous low-k OSG film owing to the tunability of the gas-phase fluorine:carbon ratio (gas dissociation) and ion current below a critical threshold and given the larger carbon content of the porous film relative to that of the dense film.

    摘要翻译： 具有使用多孔低k OSG膜作为蚀刻停止层的无孔（致密）低k有机硅酸盐玻璃（OSG）膜的互连结构或使用无孔OSG膜作为硬掩模的多孔低k OSG膜 用于半导体器件中。 新颖的互连结构能够提供改进的器件性能，功能和可靠性，这是由于与传统采用的叠层相比，堆叠的有效介电常数降低，并且还因为这些独特且看似违反直觉的特征使得线的高度相对均匀 。 本发明还提供了一种基于碳氟化合物的双镶嵌蚀刻工艺，由于气相氟：碳比的可调性，实现了相对于多孔低k OSG膜的致密低k OSG膜的选择性蚀刻（ 气体离解）和离子电流低于临界阈值，并且给出多孔膜相对于致密膜的碳含量较大。

    THREE DIMENSIONAL VERTICAL E-FUSE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
    8.
    发明申请
    THREE DIMENSIONAL VERTICAL E-FUSE STRUCTURES AND METHODS OF MANUFACTURING THE SAME 失效
    三维垂直电子熔断器结构及其制造方法

    公开(公告)号：US20090085152A1

    公开(公告)日：2009-04-02

    申请号：US11865079

    申请日：2007-10-01

    申请人： Kerry Bernstein ,  Timothy J. Dalton ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Stephen E. Luce ,  Anthony K. Stamper

    发明人： Kerry Bernstein ,  Timothy J. Dalton ,  Jeffrey P. Gambino ,  Mark D. Jaffe ,  Stephen E. Luce ,  Anthony K. Stamper

    IPC分类号： H01L23/62 ,  H01L21/44

    CPC分类号： H01L23/5256 ,  H01L23/62 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Three dimensional vertical e-fuse structures and methods of manufacturing the same are provided herein. The method of forming a fuse structure comprises providing a substrate including an insulator layer and forming an opening in the insulator layer. The method further comprises forming a conductive layer along a sidewall of the opening and filling the opening with an insulator material. The vertical e-fuse structure comprises a first contact layer and a second contact layer. The structure further includes a conductive material lined within a via and in electrical contact with the first contact layer and the second contact layer. The conductive material has an increased resistance as a current is applied thereto.

    摘要翻译： 本文提供三维垂直电子熔丝结构及其制造方法。 形成熔丝结构的方法包括提供包括绝缘体层并在绝缘体层中形成开口的衬底。 该方法还包括沿着开口的侧壁形成导电层并用绝缘体材料填充开口。 垂直e熔丝结构包括第一接触层和第二接触层。 该结构还包括衬里在通孔内并与第一接触层和第二接触层电接触的导电材料。 当施加电流时，导电材料具有增加的电阻。