Abstract:
The pattern matching processing system includes: a recognition pattern-storage unit which stores a first image data obtained by picking up an image of at least a portion of a lead frame or a substrate of a first object and the second image data obtained by picking up an image of at least a portion of a lead frame of a second object that is different from the first object, respectively, and also stores one of the first image data and the second image data as an ordinary recognition pattern, and the other as an auxiliary recognition pattern; and a recognition unit, which recognizes input image data by a first pattern matching with the ordinary recognition pattern stored in the recognition pattern-storage unit, and also carries out the second pattern matching with the auxiliary recognition pattern when an error is caused in the first pattern matching.
Abstract:
In a case where a cellular phone exists outside a WOS system service area, the cellular phone receives a not-connectable signal and an audio message from a mobile switching controller. The cellular phone conducts disconnection processing with the not-connectable signal as a turning point. Moreover, the cellular phone stores an extension number and converts a dedicated special number into an external number for retransmission, thus establishing connection to a PBX. After the reception of a connection-accepted signal and an automatic exchange answer message from the PBX, the cellular phone automatically transmits the stored extension number.
Abstract:
The pattern matching processing system includes: a recognition pattern-storage unit which stores a first image data obtained by picking up an image of at least a portion of a lead frame or a substrate of a first object and the second image data obtained by picking up an image of at least a portion of a lead frame of a second object that is different from the first object, respectively, and also stores one of the first image data and the second image data as an ordinary recognition pattern, and the other as an auxiliary recognition pattern; and a recognition unit, which recognizes input image data by a first pattern matching with the ordinary recognition pattern stored in the recognition pattern-storage unit, and also carries out the second pattern matching with the auxiliary recognition pattern when an error is caused in the first pattern matching.
Abstract:
In a technique connecting between bonding pads of semiconductor chips, contact between wires is prevented. A semiconductor device of the present embodiment is provided with a semiconductor chip 1 in which a plurality of bonding pads 3 are arranged in line, a semiconductor chip 2 in which a plurality of bonding pads 4 are arranged in line substantially parallel to the plurality of bonding pads 3, and a plurality of wires 7 which connect the bonding pads 3 to the bonding pads 4 respectively. At least one of the wires 7 is bended with respect to a reference straight line S which passes through the bonding pad 3 and the bonding pad 4 which are connected by the wire 7. The bended wire is extended out from the bonding pad 4 in a certain direction in which a distance between the bended wire and an adjacent wire which is adjacent to the bended wire is larger than a distance between the reference straight line of the bended wire and the reference straight line of the adjacent wire.
Abstract:
An apparatus for supplying a resin material to molds of a resin press molding machine includes a supply cylinder for supplying the resin material to the molds, resin material charge hopper mounted to the supply cylinder, a plunger for extruding the resin material within the supply cylinder, a drive device for moving forward and backward the plunger in an axial direction, an opening and closing device for opening and closing an opening of a fore end of the supply cylinder, and a die positioned between the opening and closing device and the molds to form the resin material into a predetermined shape.
Abstract:
An injection molding machine is disclosed in which molten resin from an extruder is injected into the cavity of a mold through a nozzle. A runner body disposed between the mold and the extruder has a substantially L-shaped hot runner for supplying the molten resin from the extruder to the mold therethrough. The runner body is pivotably supported by a support assembly and is horizontally slidable relative to the support assembly to accommodate thermal expansion, whereby the nozzle mounted on the runner body can be brought into or out of intimate contact with the mold. To accommodate the thermal expansion of the runner body only toward the extruder, a stopper is provided on the base frame.
Abstract:
In a technique connecting between bonding pads of semiconductor chips, contact between wires is prevented. A semiconductor device of the present embodiment is provided with a semiconductor chip 1 in which a plurality of bonding pads 3 are arranged in line, a semiconductor chip 2 in which a plurality of bonding pads 4 are arranged in line substantially parallel to the plurality of bonding pads 3, and a plurality of wires 7 which connect the bonding pads 3 to the bonding pads 4 respectively. At least one of the wires 7 is bended with respect to a reference straight line S which passes through the bonding pad 3 and the bonding pad 4 which are connected by the wire 7. The bended wire is extended out from the bonding pad 4 in a certain direction in which a distance between the bended wire and an adjacent wire which is adjacent to the bended wire is larger than a distance between the reference straight line of the bended wire and the reference straight line of the adjacent wire.
Abstract:
An injection molding machine having in spaced positions at least a first injecting station for injecting a plasticized resin material into a die cavity and a second station for further treating the injected resin material concurrently and in relation with the injecting operation at the injecting station, the molding machine including a die carriage movable to and from the first and second stations and fixedly supporting thereon at least a lower die of an injection molding die set; a track for guiding movements of the die carriage to and from the respective stations; a carriage clamp for fixing the die carriage at the respective stations; a die closing mechanism provided at each station for releasably clamping an upper die against the lower die; and a drive mechanism for moving the die carriage sequentially to the first and second stations.
Abstract:
In a case where a cellular phone exists outside a WOS system service area, the cellular phone receives a not-connectable signal and an audio message from a mobile switching controller. The cellular phone conducts disconnection processing with the not-connectable signal as a turning point. Moreover, the cellular phone stores an extension number and converts a dedicated special number into an external number for retransmission, thus establishing connection to a PBX. After the reception of a connection-accepted signal and an automatic exchange answer message from the PBX, the cellular phone automatically transmits the stored extension number.
Abstract:
In a case where a cellular phone exists outside a WOS system service area, the cellular phone receives a not-connectable signal and an audio message from a mobile switching controller. The cellular phone conducts disconnection processing with the not-connectable signal as a tuning point. Moreover, the cellular phone stores an extension number and converts a dedicated special number into an external number for retransmission, thus establishing connection to a PBX. After the reception of a connection-accepted signal and an automatic exchange answer message from the PBX, the cellular phone automatically transmits the stored extension number.