公开(公告)号：US10128206B2

公开(公告)日：2018-11-13

申请号：US12904506

申请日：2010-10-14

申请人： Chih-Wei Lin ,  Ming-Da Cheng ,  Wen-Hsiung Lu ,  Meng-Wei Chou ,  Hung-Jui Kuo ,  Chung-Shi Liu

发明人： Chih-Wei Lin ,  Ming-Da Cheng ,  Wen-Hsiung Lu ,  Meng-Wei Chou ,  Hung-Jui Kuo ,  Chung-Shi Liu

IPC分类号： H01L21/768 ,  H01L23/48 ,  H01L23/00

摘要： The invention relates to a bump structure of a semiconductor device. An exemplary structure for a semiconductor device comprises a substrate; a contact pad over the substrate; a passivation layer extending over the substrate having an opening over the contact pad; and a conductive pillar over the opening of the passivation layer, wherein the conductive pillar comprises an upper portion substantially perpendicular to a surface of the substrate and a lower portion having tapered sidewalls.

公开(公告)号：US08897000B2

公开(公告)日：2014-11-25

申请号：US13228456

申请日：2011-09-09

申请人： Chih-Wei Chou

发明人： Chih-Wei Chou

IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/14 ,  G06F1/18

CPC分类号： H05K7/1487 ,  G06F1/183

摘要： A server includes a casing, a motherboard, a power supply unit and a pair of expansion modules. The motherboard is disposed in the casing, and the motherboard includes two slots disposed in the casing. The power supply unit is disposed in the casing and under the motherboard. The expansion modules are disposed in the casing, and each of the expansion modules includes a connecting card and a plurality of expansion cards. When the connecting card is electrically coupled to one of the slots of the motherboard, the expansion modules are disposed at two opposite sides of the motherboard correspondingly.

摘要翻译： 服务器包括壳体，主板，电源单元和一对扩展模块。 主板设置在壳体中，主板包括设置在壳体中的两个槽。 电源单元设置在壳体内和主板下方。 扩展模块设置在壳体中，并且每个扩展模块包括连接卡和多个扩展卡。 当连接卡电耦合到主板的一个槽时，扩展模块相应地设置在母板的相对两侧。

公开(公告)号：USD714972S1

公开(公告)日：2014-10-07

申请号：US29440069

申请日：2012-12-19

申请人： Chung-Chu Li ,  Chin-Wei Chou

设计人： Chung-Chu Li ,  Chin-Wei Chou

公开(公告)号：US08823166B2

公开(公告)日：2014-09-02

申请号：US12871565

申请日：2010-08-30

申请人： Cheng-Chung Lin ,  Chung-Shi Liu ,  Meng-Wei Chou ,  Kuo Cheng Lin ,  Wen-Hsiung Lu ,  Chien Ling Hwang ,  Ying-Jui Huang ,  De-Yuan Lu

发明人： Cheng-Chung Lin ,  Chung-Shi Liu ,  Meng-Wei Chou ,  Kuo Cheng Lin ,  Wen-Hsiung Lu ,  Chien Ling Hwang ,  Ying-Jui Huang ,  De-Yuan Lu

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L21/02052 ,  H01L21/32125 ,  H01L21/76873 ,  H01L21/76885 ,  H01L23/488 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2221/1084 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05541 ,  H01L2224/05573 ,  H01L2224/1111 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11614 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/11912 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/81191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0541 ,  H01L2924/07025 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/20102 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/207

摘要： Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.

摘要翻译： 用于提供焊料柱凸块的装置和方法。 通过在集成电路的端子上通过导电材料的电镀形成导电材料的支柱，在集成电路的输入/输出端子上形成支柱凸点连接。 柱状凸块的基部具有比上部更大的宽度。 柱形凸起的基部的横截面可以形成梯形，矩形或倾斜的形状。 焊料可以形成在柱的顶表面上。 所得到的焊料柱凸起形成比现有技术更可靠的细间距封装焊接连接。

公开(公告)号：US08723172B2

公开(公告)日：2014-05-13

申请号：US12699058

申请日：2010-02-03

申请人： Fang-An Shu ,  Lee-Tyng Chen ,  Henry Wang ,  Wei-Chou Lan ,  Tung-Liang Lin

发明人： Fang-An Shu ,  Lee-Tyng Chen ,  Henry Wang ,  Wei-Chou Lan ,  Tung-Liang Lin

IPC分类号： H01L29/10 ,  H01L29/12 ,  H01L29/04 ,  H01L31/00 ,  H01L21/00 ,  H01L21/16

CPC分类号： H01L29/7869 ,  H01L27/1225

摘要： A display device including a thin film transistor array substrate, transparent electrode substrate and a display medium layer disposed therebetween is provided. The thin film transistor array substrate includes a plurality of thin film transistors with an oxide semiconductor layer respectively. In each thin film transistor, a gate electrode and a gate insulating layer are disposed on a substrate sequentially and the gate electrode is covered by the gate insulating layer. The oxide semiconductor layer is conformably covering on the gate insulating layer and has a channel region located above the gate electrode. A source electrode and a drain electrode of each thin film transistor are disposed on the oxide semiconductor layer and at one side of the channel region respectively. Since the oxide semiconductor layer is made of transparent material, the patterning process of the oxide semiconductor layer can be omitted during the manufacturing process of the reflective display device. Thus, the cost and time-consumed of manufacturing process of the reflective display device can be reduced.

摘要翻译： 提供了包括薄膜晶体管阵列基板，透明电极基板和设置在其间的显示介质层的显示装置。 薄膜晶体管阵列基板分别具有多个具有氧化物半导体层的薄膜晶体管。 在每个薄膜晶体管中，栅极电极和栅极绝缘层依次设置在衬底上，并且栅电极被栅极绝缘层覆盖。 氧化物半导体层被顺应地覆盖在栅绝缘层上并且具有位于栅电极上方的沟道区。 每个薄膜晶体管的源电极和漏电极分别设置在氧化物半导体层和沟道区的一侧。 由于氧化物半导体层由透明材料制成，所以在反射式显示装置的制造过程中可以省略氧化物半导体层的构图工艺。 因此，能够降低反射型显示装置的制造工序的成本和耗时。

公开(公告)号：US08484183B1

公开(公告)日：2013-07-09

申请号：US13029262

申请日：2011-02-17

申请人： Kenneth Bruce Bubeck ,  Joseph Coyne ,  Hong Wei Chou

发明人： Kenneth Bruce Bubeck ,  Joseph Coyne ,  Hong Wei Chou

IPC分类号： G06F17/30

CPC分类号： G06F17/30283 ,  G06F17/30672 ,  G06F17/30696

摘要： A regulatory information retrieval system is disclosed. In one embodiment, the method comprises building ingredient data for manufacturing businesses. Then, those ingredients are compared with regulatory requirements. Relevant requirements are identified regarding permitted usage are extracted and converted to a guideline document. The guideline document can be viewed in a variety of ways, such as a detailed view, or an overview of repositories searched. The guidelines may then be converted to a file format that can be imported by other business applications.

摘要翻译： 公开了一种监管信息检索系统。 在一个实施方案中，该方法包括建立制造业务的成分数据。 然后将这些成分与法规要求进行比较。 确定关于允许的使用情况的相关要求被提取并转换为指南文件。 可以通过各种方式查看准则文件，例如详细视图或搜索到的存储库的概述。 然后可以将指南转换为可由其他业务应用程序导入的文件格式。

公开(公告)号：US20130146741A1

公开(公告)日：2013-06-13

申请号：US13715933

申请日：2012-12-14

申请人： David Shih-Wei Chou

发明人： David Shih-Wei Chou

IPC分类号： F16M13/02

CPC分类号： F16M13/022 ,  C12M21/02 ,  C12M29/06 ,  C12M31/00

摘要： A device and system for growing a photosynthetic culture is provided which employs one or a plurality of vertically disposed photopanels having interior cavities configured for holding liquid and the photosynthetic culture such as algae. The inner chamber of the photopanels may have a shape that is structurally supported by bridging elements. The bridging elements may be formed as stepped cones that may function as light guides to the interior chamber.

摘要翻译： 提供一种用于生长光合培养物的装置和系统，其采用一个或多个垂直布置的光面板，其具有被配置用于保持液体和诸如藻类的光合培养物的内部空腔。 照片面板的内腔可以具有结构上由桥接元件支撑的形状。 桥接元件可以形成为可用作到内部室的光导的阶梯锥体。

公开(公告)号：US20130119372A1

公开(公告)日：2013-05-16

申请号：US13550616

申请日：2012-07-17

申请人： Chia-Chun YEH ,  Henry WANG ,  Wei-Chou LAN ,  Ted-Hong SHINN

发明人： Chia-Chun YEH ,  Henry WANG ,  Wei-Chou LAN ,  Ted-Hong SHINN

IPC分类号： H01L31/0264

CPC分类号： H01L27/307 ,  H01L27/1225 ,  H01L31/032 ,  H01L31/1136 ,  H01L51/0036 ,  H01L51/422 ,  Y10S977/735

摘要： A light sensing device is disclosed. The light sensing device includes a first light sensor and a second light sensor. The first light sensor formed on a substrate includes a first metal oxide semiconductor layer for absorbing a first light having a first waveband. The second light sensor formed on the substrate includes a second metal oxide semiconductor layer and an organic light-sensitive layer on the second metal oxide semiconductor layer for absorbing a second light having a second waveband.

摘要翻译： 公开了一种感光装置。 光感测装置包括第一光传感器和第二光传感器。 形成在基板上的第一光传感器包括用于吸收具有第一波段的第一光的第一金属氧化物半导体层。 形成在基板上的第二光传感器包括在第二金属氧化物半导体层上的第二金属氧化物半导体层和有机感光层，用于吸收具有第二波段的第二光。

公开(公告)号：US20130116338A1

公开(公告)日：2013-05-09

申请号：US13289439

申请日：2011-11-04

申请人： Chih-Wei CHOU ,  Ya-Hsun HOU ,  Yueh-Hsiung KUO ,  Yung-Hsiu CHEN

发明人： Chih-Wei CHOU ,  Ya-Hsun HOU ,  Yueh-Hsiung KUO ,  Yung-Hsiu CHEN

IPC分类号： A61K47/00 ,  B82Y5/00

CPC分类号： A61K47/02 ,  A61K9/10 ,  B82Y40/00

摘要： A nanometal dispersion and a method for preparing a nanometal dispersion are provided. The method comprises the following steps: providing a first solution containing a metal ion; providing a second solution containing inulin; mixing the first solution and the second solution to provide a third solution; and providing energy to the third solution to conduct a reduction-oxidation reaction to form a nanometal therein. The produced nanometal dispersion comprises inulin and a nanometal with multimorphology.

摘要翻译： 提供了纳米金属分散体和制备纳米金属分散体的方法。 该方法包括以下步骤：提供含有金属离子的第一溶液; 提供含有菊粉的第二溶液; 混合第一溶液和第二溶液以提供第三溶液; 并向第三溶液提供能量以进行还原 - 氧化反应以在其中形成纳米金属。 所制备的纳米金属分散体包括菊粉和具有多形态的纳米金属。

公开(公告)号：US08355012B2

公开(公告)日：2013-01-15

申请号：US12916928

申请日：2010-11-01

申请人： Wei-Chou Chen ,  Chung-Wen Hsu

发明人： Wei-Chou Chen ,  Chung-Wen Hsu

IPC分类号： G06F3/042

CPC分类号： G06F3/0428

摘要： A scanning method for determining the touch position of a touch input apparatus is disclosed. First of all, a first exposure process on light sensors of the touch input apparatus by light emitting device of the touch input apparatus is performed. Then the light sensors are scanned. A light sensor generating a signal with a maximum value is located. A region of partial scan of the light sensors is determined according to the position of the light sensor generating the signal with the maximum value. A second exposure process is performed on the light sensors. Then the light sensors within the region of partial scan are scanned. A light sensor generating a signal with a maximum value within the region of partial scan is located and a next region of partial scan is determined. The maximum value of the signal is calculated and the maximum value of the signal is compared to a predetermined value to determine whether the maximum value is higher than the predetermined value.

摘要翻译： 公开了一种用于确定触摸输入装置的触摸位置的扫描方法。 首先，对触摸输入装置的发光装置的触摸输入装置的光传感器进行第一曝光处理。 然后扫描光传感器。 定位产生具有最大值的信号的光传感器。 根据产生具有最大值的信号的光传感器的位置确定光传感器的部分扫描区域。 对光传感器进行第二曝光处理。 然后扫描部分扫描区域内的光传感器。 定位产生在部分扫描区域内具有最大值的信号的光传感器，并确定下一个部分扫描区域。 计算信号的最大值，并将信号的最大值与预定值进行比较，以确定最大值是否高于预定值。