公开(公告)号：US06251501B1

公开(公告)日：2001-06-26

申请号：US09280946

申请日：1999-03-29

申请人： William David Higdon ,  Shing Yeh

发明人： William David Higdon ,  Shing Yeh

IPC分类号： B32B300

CPC分类号： H01L24/13 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11502 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/067 ,  H05K3/3473 ,  H05K2201/0305 ,  H05K2203/043 ,  H05K2203/054 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/2495 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552 ,  H01L2924/00

摘要： A solder bumping method and structure for producing fine-pitch solder bump and which eliminate conventional process compatibility requirements for under bump metallurgy (UBM) and solder bump formation. The method generally entails forming an input/output pad on the surface of a semiconductor device, and then forming a metal layer on the input/output pad that will serve as the UBM of the solder bump. A plating seed layer is then formed on the UBM and on the surrounding surface of the device, after which a mask is formed on the plating seed layer and a via is formed in the mask to expose a portion of the plating seed layer overlying the UBM, and preferably portions of the plating seed layer not overlying the UBM. A solder material is then deposited on the portion of the plating seed layer exposed within the via. Because the via is not limited by the size of the UBM, the deposited solder material is able to cover an area larger than the metal layer, thereby increasing the amount of solder material available to form the solder bump without requiring a thicker mask.

摘要翻译： 一种用于生产细间距焊料凸块的焊料凸块方法和结构，并且消除了凸起下冶金（UBM）和焊料凸点形成的常规工艺兼容性要求。 该方法通常需要在半导体器件的表面上形成输入/输出焊盘，然后在将用作焊料凸块的UBM的输入/输出焊盘上形成金属层。 然后在UBM和器件的周围表面上形成电镀种子层，然后在电镀种子层上形成掩模，并在掩模中形成通孔，以暴露覆盖UBM的电镀种子层的一部分 ，优选不覆盖UBM的电镀种子层的部分。 然后将焊料材料沉积在暴露在通孔内的电镀种子层的部分上。 因为通孔不受UBM的尺寸的限制，所以沉积的焊料能够覆盖大于金属层的面积，从而增加可用于形成焊料凸块的焊料材料的量，而不需要较厚的掩模。

公开(公告)号：US06281106B1

公开(公告)日：2001-08-28

申请号：US09449820

申请日：1999-11-25

申请人： William David Higdon ,  Frank Stepniak ,  Shing Yeh

发明人： William David Higdon ,  Frank Stepniak ,  Shing Yeh

IPC分类号： H01L2144

CPC分类号： H05K3/3436 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11502 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3463 ,  H05K3/3473 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05541 ,  H01L2224/05005 ,  H01L2224/1146

摘要： A method for solder bumping a surface-mount circuit component, as well as electrically and mechanically connecting the component to a conductor on a substrate, and the components and assemblies formed thereby. The method generally entails forming a multilayer metal bump containing discrete layers, including at least one layer of a solder alloy, a first metallic layer having a sufficiently high melting point so as not to melt or deform at the reflow temperature of the solder alloy, and a second metallic layer containing at least one metal that is soluble in the solder alloy. During reflow, the first metallic layer does not collapse, while the solder layer and the second metallic layer readily flow and subsequently bond the first metallic layer to suitable structures on the component and substrate. As a result of the reflow operation, the multilayer metal bump of this invention forms a solder connection with a graded composition, namely, an intermediate region formed primarily by the first metallic layer, and at least one end region that contains a solid solution formed of the solder layer and the first and second metallic layers.

摘要翻译： 用于焊接凸起表面安装电路部件的方法，以及将部件电连接和机械地连接到基板上的导体以及由此形成的部件和组件。 该方法通常需要形成包含离散层的多层金属凸块，包括至少一层焊料合金，具有足够高熔点的第一金属层，以便在焊料合金的回流温度下不熔化或变形，以及 含有至少一种可溶于焊料合金的金属的第二金属层。 在回流期间，第一金属层不会塌陷，而焊料层和第二金属层容易流动，并且随后将第一金属层结合到组件和基板上的合适结构。 作为回流操作的结果，本发明的多层金属凸块形成了具有渐层组成的焊料连接，即主要由第一金属层形成的中间区，以及至少一个包含由 焊料层和第一和第二金属层。