公开(公告)号：US07751205B2

公开(公告)日：2010-07-06

申请号：US11482793

申请日：2006-07-10

申请人： Takashi Kariya ,  Yasuhiko Mano ,  Shuichi Kawano ,  Liyi Chen

发明人： Takashi Kariya ,  Yasuhiko Mano ,  Shuichi Kawano ,  Liyi Chen

IPC分类号： H05K7/00

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/16152 ,  H01L2924/207 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/0002 ,  H01L2224/0401 ,  H01L2924/01005

摘要： This invention provides a small package board integrated with power supply capable of supplying a low level of voltage and high level of current to an IC while achieving a low height of its power supply. It becomes hard to saturate an inductor magnetically when the surface of a copper wire is coated with a magnetic layer, and the inductor can accordingly be provided with a sufficient degree of inductance. A multiplicity of inductors can be provided within a confined space by arranging a multiplicity of inductors in parallel, and by fixing them with resin so as to form an inductor array, thereby making it possible to divide a power supply. The number of power supply lines is increased by dividing the power supply so as to reduce the level of current in an individual power supply line, so that a high level of current can be supplied to an IC chip. Further, a distance between a power supply and the IC chip can be decreased by incorporating a power supply module into the package board so as to reduce generation of heat and curb a drop in voltage in the power supply line, thereby making it possible to supply a high level of current to the IC chip.

摘要翻译： 本发明提供了一种与电源集成的小封装板，其能够在实现其电源的低高度的同时向IC提供低电平和高电平的电流。 当铜线的表面涂覆有磁性层时，磁感应器难以饱和，并且电感器因此可以具有足够的电感。 通过并排布置多个电感器，并且通过用树脂固定它们以形成电感器阵列，可以在限制空间内提供多个电感器，从而可以划分电源。 通过分割电源来增加电源线的数量，以便降低单个电源线中的电流水平，从而可以向IC芯片提供高电平的电流。 此外，通过将电源模块并入封装板中可以减小电源和IC芯片之间的距离，以减少热量的产生并且抑制电源线中的电压下降，从而可以供应 电流高达IC芯片。

公开(公告)号：US20080007925A1

公开(公告)日：2008-01-10

申请号：US11482793

申请日：2006-07-10

申请人： Takashi Kariya ,  Yasuhiko Mano ,  Shuichi Kawano ,  Liyi Chen

发明人： Takashi Kariya ,  Yasuhiko Mano ,  Shuichi Kawano ,  Liyi Chen

IPC分类号： H05K7/00

CPC分类号： H01L23/49827 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/16152 ,  H01L2924/207 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/0002 ,  H01L2224/0401 ,  H01L2924/01005

摘要： This invention provides a small package board integrated with power supply capable of supplying a low level of voltage and high level of current to an IC while achieving a low height of its power supply. It becomes hard to saturate an inductor magnetically when the surface of a copper wire is coated with a magnetic layer, and the inductor can accordingly be provided with a sufficient degree of inductance. A multiplicity of inductors can be provided within a confined space by arranging a multiplicity of inductors in parallel, and by fixing them with resin so as to form an inductor array, thereby making it possible to divide a power supply. The number of power supply lines is increased by dividing the power supply so as to reduce the level of current in an individual power supply line, so that a high level of current can be supplied to an IC chip. Further, a distance between a power supply and the IC chip can be decreased by incorporating a power supply module into the package board so as to reduce generation of heat and curb a drop in voltage in the power supply line, thereby making it possible to supply a high level of current to the IC chip.

摘要翻译： 本发明提供了一种与电源集成的小封装板，其能够在实现其电源的低高度的同时向IC提供低电平和高电平的电流。 当铜线的表面涂覆有磁性层时，磁感应器难以饱和，并且电感器因此可以具有足够的电感。 通过并排布置多个电感器，并且通过用树脂固定它们以形成电感器阵列，可以在限制空间内提供多个电感器，从而可以划分电源。 通过分割电源来增加电源线的数量，以便降低单个电源线中的电流水平，从而可以向IC芯片提供高电平的电流。 此外，通过将电源模块并入封装板中可以减小电源和IC芯片之间的距离，以减少热量的产生并且抑制电源线中的电压下降，从而可以供应 电流高达IC芯片。

公开(公告)号：US07911802B2

公开(公告)日：2011-03-22

申请号：US11949795

申请日：2007-12-04

申请人： Shuichi Kawano ,  Liyi Chen

发明人： Shuichi Kawano ,  Liyi Chen

IPC分类号： H05K1/18

CPC分类号： H01G4/35 ,  H01G4/01 ,  H01G4/236 ,  H01L2224/16265 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19103 ,  Y10T29/49165

摘要： An interposer including: a substrate including a first layer and second layer, wherein the first layer and second layer are positioned parallel to each other; electrodes each having a concave-convex structure formed on each facing surface of the first layer and second layer of the substrate; a dielectric layer sandwiched between the electrodes which are formed on each facing surface of the first layer and second layer of the substrate; a first conductive part which vertically passes through the first layer of the substrate from a first outer surface of the substrate and is electrically connected to an electrode formed on a surface of the second layer of the substrate that faces the first layer of the substrate; and a second conductive part which vertically passes through the second layer of the substrate from a second outer surface of the substrate and is electrically connected to an electrode formed on a surface of the first layer of the substrate that faces the second layer of the substrate.

摘要翻译： 一种插入器，包括：包括第一层和第二层的衬底，其中所述第一层和第二层彼此平行地定位; 每个具有形成在基板的第一层和第二层的每个相对表面上的凹凸结构的电极; 夹在电极之间的电介质层，其形成在基板的第一层和第二层的每个相对表面上; 第一导电部件，其从衬底的第一外表面垂直地穿过衬底的第一层，并且电连接到形成在衬底的面向衬底的第一层的第二层的表面上的电极; 以及第二导电部件，其从所述基板的第二外表面垂直地穿过所述基板的所述第二层，并且电连接到形成在所述基板的所述第一层的面向所述基板的第二层的表面上的电极。

公开(公告)号：US20080247116A1

公开(公告)日：2008-10-09

申请号：US11949795

申请日：2007-12-04

申请人： Shuichi KAWANO ,  Liyi Chen

发明人： Shuichi KAWANO ,  Liyi Chen

IPC分类号： H01G4/35 ,  H01R43/20

CPC分类号： H01G4/35 ,  H01G4/01 ,  H01G4/236 ,  H01L2224/16265 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19103 ,  Y10T29/49165

摘要： An interposer including: a substrate including a first layer and second layer, wherein the first layer and second layer are positioned parallel to each other; electrodes each having a concave-convex structure formed on each facing surface of the first layer and second layer of the substrate; a dielectric layer sandwiched between the electrodes which are formed on each facing surface of the first layer and second layer of the substrate; a first conductive part which vertically passes through the first layer of the substrate from a first outer surface of the substrate and is electrically connected to an electrode formed on a surface of the second layer of the substrate that faces the first layer of the substrate; and a second conductive part which vertically passes through the second layer of the substrate from a second outer surface of the substrate and is electrically connected to an electrode formed on a surface of the first layer of the substrate that faces the second layer of the substrate.

摘要翻译： 一种插入器，包括：包括第一层和第二层的衬底，其中所述第一层和第二层彼此平行地定位; 每个具有形成在基板的第一层和第二层的每个相对表面上的凹凸结构的电极; 夹在电极之间的电介质层，其形成在基板的第一层和第二层的每个相对表面上; 第一导电部件，其从衬底的第一外表面垂直地穿过衬底的第一层，并且电连接到形成在衬底的面向衬底的第一层的第二层的表面上的电极; 以及第二导电部件，其从所述基板的第二外表面垂直地穿过所述基板的所述第二层，并且电连接到形成在所述基板的所述第一层的面向所述基板的第二层的表面上的电极。

公开(公告)号：US20120199386A1

公开(公告)日：2012-08-09

申请号：US13325414

申请日：2011-12-14

申请人： Takema Adachi ,  Liyi Chen

发明人： Takema Adachi ,  Liyi Chen

IPC分类号： H05K1/02 ,  H05K3/02

CPC分类号： H05K3/445 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/056 ,  H05K3/0032 ,  H05K3/3478 ,  H05K3/4608 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/0323 ,  H05K2203/1572

摘要： A printed wiring board including a core substrate having a metal layer, a first resin insulation layer on a surface of the metal layer and a second resin insulation layer on the opposite surface of the metal layer, a first conductive circuit formed on the first layer, a second conductive circuit formed on the second layer, and a through-hole conductor formed in a penetrating hole through the substrate and connecting the first and second circuits. The metal layer has an opening filled with a filler resin, the penetrating hole has a first opening in the first layer, a second opening in the second layer and a third opening in the filler resin, the first opening tapers toward the filler resin, the second opening tapers toward the filler resin, and the third opening is connecting the first and second openings.

摘要翻译： 一种印刷电路板，包括具有金属层的芯基板，在所述金属层的表面上的第一树脂绝缘层和在所述金属层的相对表面上的第二树脂绝缘层，形成在所述第一层上的第一导电电路， 形成在第二层上的第二导电电路，以及形成在穿过基板的穿透孔中并连接第一和第二电路的通孔导体。 金属层具有填充有填充树脂的开口，贯通孔在第一层中具有第一开口，在第二层中具有第二开口，在填充树脂中具有第三开口，第一开口朝着填充树脂逐渐变细， 第二开口朝向填充树脂逐渐变细，第三开口连接第一和第二开口。

公开(公告)号：US20120061347A1

公开(公告)日：2012-03-15

申请号：US13273335

申请日：2011-10-14

申请人： Satoru KAWAI ,  Kenji Sakai ,  Liyi Chen

发明人： Satoru KAWAI ,  Kenji Sakai ,  Liyi Chen

IPC分类号： H05K3/46

CPC分类号： H05K3/4007 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/205 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09436 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49162 ,  Y10T29/49213 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film.

摘要翻译： 一种制造印刷电路板的方法，包括制备载体，在载体上形成金属层，在金属层上形成抗蚀剂，在抗蚀剂下面的金属层形成金属膜，除去暴露于金属层的部分 所述抗蚀剂和所述金属层的与所述金属层的所述部分相邻并且在所述抗蚀剂下方的部分，在所述膜和载体的侧表面上形成涂层，在所述涂层上形成焊盘，除去所述抗蚀剂，形成树脂 在所述膜的表面和所述垫的表面上形成绝缘层，形成在所述绝缘层中到达所述焊盘表面的开口，在所述绝缘层上形成导电电路，形成在所述开口中连接所述电路和所述焊盘的通孔导体， 载体从膜和涂层，并去除膜。

公开(公告)号：US20100202729A1

公开(公告)日：2010-08-12

申请号：US12765842

申请日：2010-04-22

申请人： Hiroaki KODAMA ,  Liyi Chen ,  Kensaku Nakashima

发明人： Hiroaki KODAMA ,  Liyi Chen ,  Kensaku Nakashima

IPC分类号： G02B6/12 ,  H01R43/00

CPC分类号： G02B6/43 ,  G02B6/3608 ,  G02B6/4212 ,  G02B6/4214 ,  G02B2006/12069 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49128

摘要： An optoelectronic wiring board includes a flex-rigid substrate and an optical communication unit. The flex-rigid substrate includes a flexible substrate provided with an electric wiring, and a pair of rigid sections provided on both sides of the flexible substrate. The pair of rigid sections each include a lamination formed of a conductive circuit and an insulating layer. The optical communication unit is made of a flexible material and has both end faces substantially perpendicular to its optical path of transmitting light. Both end portions of the optical communication unit are disposed and fixed on the rigid sections so that both end faces of the optical communication unit face an optical element mounting region provided on the rigid sections of the flex-rigid substrate.

摘要翻译： 光电布线板包括柔性基板和光通信单元。 挠性刚性基板包括设置有电布线的柔性基板和设置在柔性基板两侧的一对刚性部分。 一对刚性部分各自包括由导电电路和绝缘层形成的叠片。 光通信单元由柔性材料制成，并且具有基本上垂直于其透光光路的两个端面。 光通信单元的两端部设置并固定在刚性部分上，使得光通信单元的两个端面面对设置在柔性刚性基板的刚性部分上的光学元件安装区域。

公开(公告)号：US09021692B2

公开(公告)日：2015-05-05

申请号：US13305907

申请日：2011-11-29

申请人： Satoru Kawai ,  Kenji Sakai ,  Liyi Chen

发明人： Satoru Kawai ,  Kenji Sakai ,  Liyi Chen

IPC分类号： H05K3/10 ,  H05K3/40 ,  H05K1/11 ,  H05K3/20 ,  H05K3/46

CPC分类号： H05K1/112 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/113 ,  H05K3/205 ,  H05K3/3457 ,  H05K3/4007 ,  H05K3/4644 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09472 ,  H05K2201/096 ,  H05K2203/0361 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a first via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a first conductive circuit formed on the second surface of the resin insulation layer, and a first via conductor formed in the opening and connecting the pad and the first conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

摘要翻译： 印刷电路板包括具有在第一表面的相对侧的第一表面和第二表面的树脂绝缘层，树脂绝缘层具有用于第一通孔导体的开口，形成在树脂绝缘体的第一表面上的焊盘 并且提供以安装电子部件，形成在树脂绝缘层的第二表面上的第一导电电路和形成在开口中并连接焊盘和第一导电电路的第一通孔导体。 垫具有嵌入在树脂绝缘层中的嵌入部分和从树脂绝缘层突出的突出部分，并且嵌入部分具有大于突出部分的外部形状的外部形状。

公开(公告)号：US09018337B2

公开(公告)日：2015-04-28

申请号：US13980479

申请日：2011-01-26

申请人： Liyi Chen ,  Jan Kluegge

发明人： Liyi Chen ,  Jan Kluegge

IPC分类号： C08G8/04 ,  C08G12/04 ,  C08G16/02 ,  C08G16/04 ,  C08G65/331

CPC分类号： C08G16/0225 ,  C04B24/30 ,  C04B24/302 ,  C04B2103/32 ,  C04B2103/40 ,  C08G16/04 ,  C08G65/331 ,  C08G65/3315

摘要： The present invention relates to a process for producing a polycondensation product by polycondensing monomers including (A) an aromatic or heteroaromatic compound containing a polyether chain, (B) optionally an aromatic or heteroaromatic compound which is different from monomer (A), and (C) an aldehyde, in the presence of a protonation catalyst, wherein the aldehyde is provided by a fast-releasing aldehyde source and a slow-releasing aldehyde source.

摘要翻译： 本发明涉及通过缩聚单体缩聚缩聚产物的方法，包括（A）含有聚醚链的芳族或杂芳族化合物，（B）任选的不同于单体（A）的芳族或杂芳族化合物，和（C ）醛，在质子化催化剂存在下，其中醛由快速释放醛源和缓释醛源提供。

公开(公告)号：US08419924B2

公开(公告)日：2013-04-16

申请号：US12827343

申请日：2010-06-30

申请人： Toru Nakai ,  Liyi Chen

发明人： Toru Nakai ,  Liyi Chen

IPC分类号： C25F3/14 ,  C25D11/02

CPC分类号： C25D1/04 ,  C25D5/022 ,  C25D11/02 ,  C25D11/026 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/244 ,  H05K3/3484 ,  H05K3/4038 ,  H05K3/4605 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2203/0315 ,  H05K2203/043 ,  H05K2203/1142 ,  H05K2203/1147

摘要： [Subject Matter] To provide a method for manufacturing a wiring substrate where rigidity is enhanced in an insulative portion made by oxidizing aluminum.[Solution(s)] Aluminum oxide insulative portion 24 is formed on aluminum plate 20 as shown in FIG. 1(A) through anodic oxidation (FIG. 1(C)). Then, holes (nano-holes) (24h) in aluminum oxide 24 are filled with resin 30 (FIG. 1(E)). Accordingly, the rigidity (strength) of insulative portion 24 will be enhanced and cracking will not occur during heat cycles. Also, the insulation reliability of aluminum oxide will increase, and short circuiting may be prevented at through holes 26 (aluminum portions) separated by aluminum oxide 24.

摘要翻译： [主题]提供一种制造在通过氧化铝制成的绝缘部分中提高刚性的布线基板的方法。 [解决方案]如图1所示，在铝板20上形成氧化铝绝缘部24。 1（A）通过阳极氧化（图1（C））。 然后，在树脂30中填充氧化铝24中的孔（纳米孔）（24小时）（图1（E））。 因此，绝缘部24的刚性（强度）提高，并且在热循环期间不会发生开裂。 此外，氧化铝的绝缘可靠性将增加，并且可以防止由氧化铝24分离的通孔26（铝部分）的短路。