Plating method, light-transmitting electrically-conductive film and light-transmitting electromagnetic wave shield film
    1.
    发明授权
    Plating method, light-transmitting electrically-conductive film and light-transmitting electromagnetic wave shield film 有权
    电镀方法,透光导电膜和透光电磁波屏蔽膜

    公开(公告)号:US08097143B2

    公开(公告)日:2012-01-17

    申请号:US11920352

    申请日:2006-06-06

    申请人: Yoshihiro Fujita

    发明人: Yoshihiro Fujita

    IPC分类号: C25D7/00

    摘要: A plating method comprising: continuously electroplating a surface of a film having a surface resistivity of from 1 to 1,000Ω/□ in a plurality of times, wherein the plurality of times are equally divided into a former half stage and a latter half stage, and wherein an average plating time of the former half stage of the electroplating step is shorter than an average plating time of the latter half stage of the electroplating step or an average plating voltage at the latter half stage of the electroplating step is 60% or less of an average plating voltage at the former half stage of the electroplating step.

    摘要翻译: 一种电镀方法,其特征在于,在多次中连续地对表面电阻率为1〜1000Ω/□以上的膜的表面进行电镀,其中多次被分成前半部和后半部, 并且其中,所述电镀步骤的前半部分的平均电镀时间比所述电镀步骤的后半部分的平均电镀时间短,或者所述电镀工序的后半段的平均电镀电压为60%以下 在电镀步骤的前半段的平均电镀电压。

    WELDING SYSTEM AND WELDING METHOD
    2.
    发明申请
    WELDING SYSTEM AND WELDING METHOD 审中-公开
    焊接系统和焊接方法

    公开(公告)号:US20110284508A1

    公开(公告)日:2011-11-24

    申请号:US13111211

    申请日:2011-05-19

    IPC分类号: B23K26/00

    CPC分类号: B23K31/125

    摘要: A welding system has: a welding mechanism, a reception laser light source, a reception optical mechanism, an interferometer, a data recording/analysis mechanism and a data recording/analysis mechanism. The reception laser light source generates reception laser light so as to irradiate the object to be welded with the reception laser light for the purpose of detecting a reflected ultrasonic wave obtained as a result of reflection of a transmission ultrasonic wave. The reception optical mechanism transmits, during or after welding operation, the reception laser light generated from the reception laser light source to the surface of the object to be welded for irradiation while moving, together with the welding mechanism, relative to the object to be welded and collects laser light scattered/reflected at the surface of the object to be welded.

    摘要翻译: 焊接系统具有:焊接机构,接收激光光源,接收光学机构,干涉仪,数据记录/分析机构和数据记录/分析机构。 为了检测作为发送超声波的反射而得到的反射超声波,接收激光光源产生接收激光以照射被接收激光的被焊物体。 接收光学机构在焊接操作期间或之后将从接收激光光源产生的接收激光与焊接机构相对于被焊接物体一起移动而被发射到被焊接物体的表面 并收集在待焊接物体的表面上散射/反射的激光。

    Color developer replenisher and concentrated composition for color photographic material
    5.
    发明授权
    Color developer replenisher and concentrated composition for color photographic material 有权
    彩色显影剂补充剂和彩色照相材料的浓缩组合物

    公开(公告)号:US07118850B2

    公开(公告)日:2006-10-10

    申请号:US10622534

    申请日:2003-07-21

    IPC分类号: G03C1/413

    CPC分类号: G03C7/413 G03C5/266

    摘要: A concentrated composition of a color developer replenisher for a silver halide color photographic material, the composition comprising a single solution, wherein the solution comprises 0.14 mol/liter or more of a p-phenylenediamine color developing agent, the solution has a specific gravity of 1.2 or more, the solution has pH of 13.3 or more, the solution comprises from 0.2 to 1 mol/liter of at least one compound selected from benzenesulfonic acids which may be substituted with an alkyl group, and lactams, and the solution comprises substantially no alkanolamine.

    摘要翻译: 用于卤化银彩色照相材料的彩色显影剂补充剂的浓缩组合物,该组合物包含单一溶液,其中该溶液包含0.14mol /升或更多的对苯二胺彩色显影剂,该溶液的比重为1.2 以上,溶液的pH为13.3以上,溶液含有0.2〜1mol / l的选自可被烷基取代的苯磺酸的至少一种化合物和内酰胺,该溶液基本上不含烷醇胺 。

    Testboard for IC tester
    6.
    发明授权
    Testboard for IC tester 失效
    IC测试仪测试板

    公开(公告)号:US5994894A

    公开(公告)日:1999-11-30

    申请号:US897110

    申请日:1997-07-18

    申请人: Yoshihiro Fujita

    发明人: Yoshihiro Fujita

    IPC分类号: G01R31/26 G01R31/28 G01R31/02

    CPC分类号: G01R31/2886 G01R31/2889

    摘要: This testboard for an IC tester comprises second connector 4, housing 7, cable 9, and socket board 12; and second connector 4 is mounted on base card 5 and engages first connectors 3 of a plurality of pincards 1. Housing 7 is mounted on base card 5 on the opposite side to second connector 4, holds third connector 8 which is fitted into second connector 4, while being arranged orthogonally to the above-mentioned plurality of pincards 1; and there is one housing 7 for each device 14 being tested. Cable 9 is connected to third connector 8 of housing 7 and to fourth connector 10 at the socket board 12 end. Fifth connector 11 which engages fourth connector 10 and IC socket 13 for the above-mentioned device 14 being tested are mounted on socket board 12.

    摘要翻译: 用于IC测试器的该测试板包括第二连接器4,壳体7,电缆9和插座板12; 并且第二连接器4安装在基卡5上并与多个卡扣1的第一连接器3接合。外壳7在与第二连接器4相反的一侧上的基卡5上安装,并保持装配到第二连接器4中的第三连接器8 同时正交配置在上述多个卡扣1上; 并且每个被测试的设备14都有一个外壳7。 电缆9连接到壳体7的第三连接器8,并且在插座板12端连接到第四连接器10。 与第四连接器10接合的第五连接器11和被测试的上述装置14的IC插座13安装在插座板12上。