摘要:
Measurement data of intensities of fluorescence obtained by directing excitation light onto a subject is acquired. An initial value of an absorption coefficient of the phosphor is set on the basis of a concentration distribution of the phosphor, an intensity distribution of the fluorescence on the basis of an absorption coefficient and a diffusion coefficient (reduced scattering coefficient) of the subject, which are set beforehand, are calculated, and the measurement data is compared with the calculation result. If these are found not to be matched, an absorption coefficient of the phosphor at which the error will be a minimum is estimated by performing an inverse problem calculation using a mathematical model. The calculation of the intensity distribution of the fluorescence and evaluation of the error from the obtained concentration distribution are repeated using the absorption coefficient, and a concentration distribution for which the error is the minimum is acquired.
摘要:
A measurement object holder that holds a measurement object in an optical measurement instrument, wherein the optical measurement instrument takes, as the measurement object, a living body in which isotropic scattering of light occurs inside and receives light emitted from the measurement object is disclosed. The measurement object holder includes a block that is formed in a predetermined outer shape by a material having optical properties in which the isotropic scattering of light occurs inside; and a cavity portion that is formed inside the block, that has an inner shape following the outer shape of the measurement object and in which the measurement object is accommodated.
摘要:
A housing member includes a main housing body and an intermediate tube provided around the outer periphery of the main housing body. Located in a front portion of the main housing body is an atomizer including an air motor and a rotary atomizing head, while located in a rear portion of the main housing body is a high voltage generator to apply a high voltage to paint through the air motor. A multitude of hollow cavities are uniformly formed in the intermediate tube over the entire outer surface thereof by the use of through holes opened through the intermediate tube. A cover member is fitted on the outer surface of the intermediate tube in contact with the intermediate tube, thereby intensifying electric field strength in outer corner portions of the hollow cavities to prevent deposition of charged paint particles.
摘要:
A current sensor for detecting a full return current is connected to a high voltage generator. A leakage current detector including current sensors for detecting a leakage current is provided at the surface of the cover of a coating machine, air passages and a paint passage. Based on current detection values obtained by the current sensors, a high voltage control unit controls a power supply voltage control unit and a high voltage to be output from the high voltage generator can be raised or dropped. By employing the current detection values, the high voltage control unit can identify and provide notification of a location where the leakage current is increased and the insulation is deteriorated, and can request an operator to perform maintenance for the pertinent location. Further, upon occurrence of the insulation being deteriorated, the high voltage control unit can stop the high voltage supply.
摘要:
Particles flowed through a micro-channel are imaged by imaging means. Particle speed measuring means determines the particle speed from the image data. Particle counting means counts the particles flowed for a predetermined time. Particle size measuring means measures the size of the particles. The measurements of the particles flowed at a predetermined timing are managed by data associating means. With this, the speed, number and size of particles flowed through a micro-channel can be determined at a time, and associated data can be obtained.
摘要:
When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.
摘要:
There is provided a toner cartridge capable of suppressing the use of the toner cartridge beyond its lifetime due to excessive refilling of toner, the toner cartridge including a housing 2 which forms an internal space for housing toner to be fed to an image forming apparatus and which has a filling port 6 for filling the internal space with the toner, a divider plate 4 which is pivotably supported in a swingable manner inside the housing 2 and which can divide the internal space when being hung down by gravity, and a fixing means which can fit the divider plate 4 in between an engaging projection 9 and a stopper 10 by screw-feeding the lower end of the divider plate 4 by a feed screw 3 for feeding toner and which can fix the divider plate 4 in the state of dividing the internal space.
摘要:
A conductive particle 30 which can be used for connecting a variety of adherends is provided, and the conductive particle 30 includes a resin particle 31, a first conductive particle disposed around the resin particle 31, a first resin coating 25 disposed on the periphery thereof and softer than the resin particle 31, and a second conductive thin film 36 disposed therearound; and if the surface part of, for example, an electrode 13 of an adherend that is to be connected is hard, a first resin coating 35 and the second conductive thin film 36 are destroyed by pressure to bring the second conductive thin film 36 in contact with the electrode 13 and a metal wiring 17. If the surface part of the electrode 13 is soft, the second conductive thin film on the surface side comes in contact with the electrode 13, which makes it possible for the particle to be used regardless of the surface state of an adherend, in other words, be used for connecting a variety of adherends
摘要:
An emission cleaning installation which is easy to connect continuously even to existing large-scale incineration furnaces and which is able to oxidatively break down and eliminate environmental pollutants contained in the emissions, for example dioxins, dibenzofurans, coplanar PCBs, nitrogen oxides (NOx) and the like without temperature control of the emission temperature, by the photocatalytic action of the photocatalyst, and to a method for emission cleaning and elimination which uses the abovementioned emission cleaning installation.
摘要:
The present invention provides an adhesive film for producing an electric device having high reliability. Release agent layer of release film of the present invention is based on a fluorine compound with no silicone oil so that the adhesive force between substrate and release agent layer is enough high to provide an electric device having high reliability wherein release agent layer is not adhered when release film is separated from adhesive layer. The surface roughness of substrate of 3 &mgr;m or less limits irregularities on the side of adhesive layer from which release film has been separated and therefore, no bubbles occur between adhesive layer and semiconductor chip when semiconductor chip is pressed against adhesive layer. If the surface roughness of substrate is 1 &mgr;m or more, adhesive film also has high slitting performance.