公开(公告)号：US20040035695A1

公开(公告)日：2004-02-26

申请号：US10609862

申请日：2003-06-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Yezdi N. Dordi ,  Joseph J. Stevens ,  H. Peter W. Hey ,  Donald J. K. Olgado

IPC: C25D017/00

CPC classification number: C25D17/008 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H05K3/241

Abstract: An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.

Abstract translation: 一种包括电解质电池，阳极和多孔刚性扩散器的装置。 电解质电池被配置为接收衬底以在其上沉积金属膜。 阳极被包含在电解质电池内。 多孔刚性扩散器连接到电解质电池并延伸穿过电解质电池。 当沉积金属膜并且阳极时，扩散器位于衬底要被定位的位置之间。

公开(公告)号：US20030201184A1

公开(公告)日：2003-10-30

申请号：US10424479

申请日：2003-04-28

Applicant: Applied Materials, Inc.

Inventor： Yezdi N. Dordi ,  Joseph J. Stevens ,  Michael N. Sugarman

IPC: C25D005/00

CPC classification number: C25D7/123 ,  C25D21/00 ,  C25D21/04 ,  H01L21/2885 ,  H05K3/241

Abstract: An electro-chemical plating system is described. A method is performed by the electro-chemical plating system in which a seed layer formed on a substrate is immersed into an electrolyte solution. In one aspect, a substrate is immersed in the electrochemical plating system by tilting the substrate as it enters the electrolyte solution to limit the trapping or formation of air bubbles in the electrolyte solution between the substrate and the substrate holder. In another aspect, an apparatus is provided for electroplating that comprises a cell, a substrate holder, and an actuator. The actuator can displace the substrate holder assembly in the x and z directions and also tilt the substrate. In another aspect, a method is provided of driving a meniscus formed by electrolyte solution across a surface of a substrate. The method comprises enhancing the interaction between the electrolyte solution meniscus and the surface as the substrate is immersed into the electrolyte solution.

公开(公告)号：US20030131494A1

公开(公告)日：2003-07-17

申请号：US10052015

申请日：2002-01-16

Applicant: Applied Materials, Inc.

Inventor： Dmitry Lubomirsky ,  Joseph J. Stevens

IPC: F26B017/24 ,  F26B017/30 ,  F26B005/08

CPC classification number: H01L21/67028 ,  Y10S134/902

Abstract: Embodiments of the invention provide a spin rinse dry (SRD) chamber for a semiconductor processing system. The SRD chamber includes a selectively rotatable substrate support member having an upper substrate receiving surface formed thereon, and a selectively rotatable shield member positioned above the upper substrate receiving surface, the rotatable shield member having a substantially planar lower surface that may be selectively positioned proximate the upper substrate. Embodiments of the invention further provide a method for rinsing semiconductor substrates, including the steps of positioning the substrate on a substrate support member, positioning a shield member having a substantially planar lower surface in a processing position above the substrate such that the substantially planar lower surface is in parallel orientation with an upper surface of the substrate, and flowing a fluid solution into a processing region defined by the upper surface of the substrate and the substantially planar lower surface via a fluid aperture in the substantially planar lower surface.

Abstract translation: 本发明的实施例提供了一种用于半导体处理系统的旋转冲洗干燥（SRD）室。 SRD室包括一个有选择地旋转的基板支撑件，其具有形成在其上的上基板接收表面，以及位于上基板接收表面上方的可选择地旋转的屏蔽件，该可旋转屏蔽件具有基本平坦的下表面， 上基板。 本发明的实施例还提供了一种用于冲洗半导体衬底的方法，包括以下步骤：将衬底定位在衬底支撑构件上，将具有基本平坦的下表面的屏蔽构件定位在衬底上方的处理位置，使得基本平坦的下表面 与基底的上表面平行取向，并且使流体溶液经由基本平坦的下表面中的流体孔流动到由基底的上表面和基本上平坦的下表面限定的处理区域中。

公开(公告)号：US20030073310A1

公开(公告)日：2003-04-17

申请号：US09981505

申请日：2001-10-16

Applicant: Applied Materials, Inc.

Inventor： Donald J.K. Olgado ,  Joseph J. Stevens ,  Alexander Lerner

IPC: C23F001/00 ,  C03C025/68 ,  B44C001/22 ,  H01L021/461

CPC classification number: H01L21/32115 ,  C25F7/00 ,  H01L21/32134 ,  H01L21/6708 ,  H01L21/7684

Abstract: A non-contact apparatus and method for removing a metal layer from a substrate are provided. The apparatus includes a rotatable anode substrate support member configured to support a substrate in a face-up position and to electrically contact the substrate positioned thereon. A pivotally mounted cathode fluid dispensing nozzle assembly positioned above the anode substrate support member is also provided. A power supply in electrical communication with the anode substrate support member and the cathode fluid dispensing nozzle is provided, and a system controller configured to regulate at least one of a rate of rotation of the anode substrate support member, a radial position of the cathode fluid dispensing nozzle, and an output power of the power supply is provided. The method provides for the removal of a metal layer from a substrate by rotating the substrate in a face up position on a rotatable substrate support member. A cathode fluid dispensing nozzle is positioned over a central portion of the substrate and a metal removing solution is dispensed from the cathode fluid dispensing nozzle onto the central portion of the substrate. An electrical bias is applied between the substrate and the cathode fluid dispensing nozzle, which operates to deplate the metal layer below the fluid dispensing nozzle.

Abstract translation: 提供了一种用于从基板去除金属层的非接触式设备和方法。 该装置包括可旋转的阳极基板支撑构件，其构造成将基板支撑在面朝上的位置并且电接触定位在其上的基板。 还提供了一种位于阳极基板支撑构件上方的枢转安装的阴极流体分配喷嘴组件。 提供与阳极基板支撑构件和阴极流体分配喷嘴电连通的电源，以及系统控制器，被配置为调节阳极基板支撑构件的旋转速率，阴极流体的径向位置 分配喷嘴，并且提供电源的输出功率。 该方法通过在可旋转的基板支撑构件上面向上的位置旋转基板来提供从基板移除金属层。 阴极流体分配喷嘴位于衬底的中心部分上方，金属去除溶液从阴极流体分配喷嘴分配到衬底的中心部分上。 在衬底和阴极流体分配喷嘴之间施加电偏压，其用于使流体分配喷嘴下方的金属层脱落。

公开(公告)号：US20010052465A1

公开(公告)日：2001-12-20

申请号：US09731326

申请日：2000-12-05

Applicant: Applied Materials, Inc.

Inventor： Yezdi N. Dordi ,  Joseph J. Stevens ,  H. Peter W. Hey ,  Donald J. K. Olgado

IPC: C25C007/00 ,  C25D005/16 ,  C25D017/00

CPC classification number: C25D17/008 ,  C25D7/123 ,  C25D17/001 ,  H01L21/2885 ,  H05K3/241

Abstract: An apparatus comprising an electrolyte cell, an anode, and a porous rigid diffuser. The electrolyte cell is configured to receive a substrate to have a metal film deposited thereon. An anode is contained within the electrolyte cell. A porous rigid diffuser is connected to the electrolyte cell and extends across the electrolyte cell. The diffuser is positioned between a location that the substrate is to be positioned when the metal film is deposited thereon and the anode.

Abstract translation: 一种包括电解质电池，阳极和多孔刚性扩散器的装置。 电解质电池被配置为接收衬底以在其上沉积金属膜。 阳极被包含在电解质电池内。 多孔刚性扩散器连接到电解质电池并延伸穿过电解质电池。 当沉积金属膜并且阳极时，扩散器位于衬底要被定位的位置之间。

公开(公告)号：US20010000396A1

公开(公告)日：2001-04-26

申请号：US09730968

申请日：2000-12-05

Applicant: Applied Materials Inc.

Inventor： Yezdi N. Dordi ,  Joseph J. Stevens

IPC: C25D005/02 ,  C25D017/00

CPC classification number: C25D17/001 ,  C25D7/123 ,  C25D17/12 ,  H01L21/2885 ,  H05K3/241

Abstract: An apparatus and associated method for deposition of metal ions contained in an electrolyte solution to form a metal film primarily on a seed layer formed on at least a first side of a substrate. The substrate has a second side that is opposed the first side and an edge joining the first side and the second side. The apparatus comprises a substrate holder system and an electric contact element. The electric contact element physically contacts one of the second side or the edge of the substrate. In one aspect, the substrate is rotated about its vertical axis when the seed layer of substrate is immersed in the electrolyte solution during the metal film deposition. In another aspect, the substrate is not rotated about its vertical axis when the seed layer on the substrate is immersed in the electrolyte solution during the metal film deposition. In different embodiments, the electric contact element contacts the seed layer on the second side of the substrate, a diffusion barrier layer on the second side of the substrate, or the seed layer on the edge of the substrate.

Abstract translation: 一种用于沉积包含在电解质溶液中的金属离子的装置和相关方法，以主要形成在形成在基底的至少第一侧上的种子层上形成金属膜。 衬底具有与第一侧相对的第二侧和连接第一侧和第二侧的边缘。 该装置包括基板保持器系统和电接触元件。 电接触元件物理地接触基板的第二面或边缘中的一个。 在一个方面，当在金属膜沉积期间将衬底的晶种层浸入电解质溶液中时，衬底围绕其垂直轴线旋转。 在另一方面，当在金属膜沉积期间当衬底上的晶种层浸入电解质溶液中时，衬底不绕其垂直轴旋转。 在不同的实施例中，电接触元件接触衬底的第二侧上的种子层，在衬底的第二侧上的扩散阻挡层或衬底的边缘上的种子层。

公开(公告)号：US20030141018A1

公开(公告)日：2003-07-31

申请号：US10059572

申请日：2002-01-28

Applicant: APPLIED MATERIALS, INC.

Inventor： Joseph J. Stevens ,  Dmitry Lubomirsky ,  Ian Pancham ,  Donald J. K. Olgado ,  Howard E. Grunes ,  Yeuk-Fai Edwin Mok

IPC: C23F001/00 ,  C23C016/00

CPC classification number: H01L21/67126 ,  C23C18/1607 ,  C23C18/1619 ,  C23C18/1628 ,  C23C18/165 ,  C23C18/1653 ,  C23C18/1678 ,  C25D7/123 ,  C25D17/001

Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a nullpatchnull of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer. In one embodiment, the conductive material is deposited over the catalytic layer by electroless deposition. In another embodiment, the conductive material is deposited over the catalytic layer by electroless deposition followed by electroplating or followed by chemical vapor deposition. In still another embodiment, the conductive material is deposited over the catalytic layer by electroplating or by chemical vapor deposition.

Abstract translation: 一种沉积包含至少一种选自贵金属，半贵金属，其合金及其组合的金属的催化剂层的装置和方法，其形成在基板上形成的亚微米特征。 贵金属的实例包括钯和铂。 半贵金属的例子包括钴，镍和钨。 可通过无电沉积，电镀或化学气相沉积来沉积催化层。 在一个实施方案中，催化层可以沉积在特征中以用作随后沉积的导电材料的阻挡层。 在另一个实施方案中，催化剂层可以沉积在阻挡层上。 在另一个实施方案中，催化层可以沉积在沉积在阻挡层上的种子层上，以充当种子层中任何不连续性的“贴片”。 一旦沉积了催化层，可以在催化剂层上沉积诸如铜的导电材料。 在一个实施例中，导电材料通过无电沉积沉积在催化剂层上。 在另一个实施方案中，导电材料通过无电沉积然后电镀或随后进行化学气相沉积沉积在催化剂层上。 在另一个实施例中，导电材料通过电镀或化学气相沉积沉积在催化层上。

公开(公告)号：US20030000841A1

公开(公告)日：2003-01-02

申请号：US10217872

申请日：2002-08-13

Applicant: Applied Materials, Inc.

Inventor： Joseph J. Stevens ,  Yevgeniy Rabinovich ,  Sandy S. Chao ,  Mark R. Denome ,  Allen L. D'Ambra ,  Donald J. Olgado

IPC: C25D021/12 ,  C25C003/16 ,  C25C003/20 ,  C25B009/00 ,  C25B015/00 ,  C25D003/38 ,  B23H003/02 ,  B23H007/14 ,  H01L021/445 ,  H01L021/288 ,  B23H007/04 ,  C25F007/00 ,  C25D017/00 ,  C25B009/04 ,  C25D005/02 ,  C25D005/00

CPC classification number: C25D21/14 ,  C25D7/123 ,  C25D17/001 ,  C25D21/18

Abstract: A system is provided in which a smaller flow of deposition solution is diverted from a larger flow of deposition solution flowing on an electrochemical deposition tool platform. The smaller flow is diverted to a dosing unit which may be on a separate platform. The dosing unit in one embodiment comprises a pressurized flow line.

Abstract translation: 提供了一种系统，其中较小的沉积溶液流从在电化学沉积工具平台上流动的较大流动的沉积溶液转移。 较小的流量被转移到可以在单独平台上的计量单元。 在一个实施例中的计量单元包括加压流动管线。

公开(公告)号：US20020066664A1

公开(公告)日：2002-06-06

申请号：US10039808

申请日：2001-10-26

Applicant: Applied Materials, Inc.

Inventor： Shamouil Shamouilian ,  Anada H. Kumar ,  Donald J. Olgado ,  Joseph J. Stevens ,  Ricardo Leon ,  Jon Clinton

IPC: B23H003/02

CPC classification number: H01L21/2885 ,  C25D7/123 ,  C25D17/001 ,  C25D21/12

Abstract: The present invention relates to a device that supplies electricity to a substrate. In one embodiment, the device includes multiple contacts, a current sensor, and a current regulator. The current sensor is attached to each of the plurality of contacts to sense their electric current. A current regulator controls current applied to each of the multiple contacts in response to the current sensor. In another embodiment, a compliant ridge is formed about the periphery of each contact to seal the contact from undesired chemicals.

Abstract translation: 本发明涉及向基板供电的装置。 在一个实施例中，该装置包括多个触点，电流传感器和电流调节器。 电流传感器附接到多个触点中的每一个以感测其电流。 电流调节器响应于电流传感器控制施加到多个触点中的每一个的电流。 在另一个实施例中，围绕每个接触件的周边形成柔顺脊，以将接触件密封到不期望的化学物质上。