公开(公告)号：US20180022919A1

公开(公告)日：2018-01-25

申请号：US15549657

申请日：2016-02-08

Applicant: ARISAWA MFG. CO., LTD.

Inventor： Kazuo YOSHIKAWA ,  Makoto TAI ,  Nobuyuki IWANO

IPC: C08L75/04 ,  B32B7/12 ,  B32B27/08 ,  B32B27/40 ,  B32B27/36 ,  H05K1/03 ,  B32B27/20 ,  C08L25/06 ,  C08G18/73 ,  C08G18/44 ,  H05K1/02 ,  B32B7/06 ,  B32B27/38

CPC classification number: C08L75/04 ,  B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2307/204 ,  B32B2457/08 ,  C08G18/348 ,  C08G18/44 ,  C08G18/6659 ,  C08G18/73 ,  C08G59/4269 ,  C08L25/04 ,  C08L25/06 ,  C09J163/00 ,  H01B3/302 ,  H01B3/40 ,  H05K1/0201 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/0104 ,  H05K2201/0212

Abstract: The present invention provides a low-dielectric resin composition comprising (A) a urethane resin obtained by reacting a polycarbonate diol and an isocyanate, (B) an epoxy resin, and (C) a filler, wherein the (A) urethane resin has a carboxyl group equivalent weight of 1,100 to 5,700 g/eq; the epoxy equivalent weight of the (B) epoxy resin is 0.3 to 4.5 equivalents per 1.0 equivalent of the carboxyl group of the (A) urethane resin, the (A) urethane resin has a weight-average molecular weight of 5,000 to 80,000; the (A) urethane resin has a polycarbonate content of 35% by mass or lower; the resin composition comprises 50 parts by mass or less of the (C) filler per 100 parts by mass of the (A) urethane resin; and the resin composition comprises substantially no imido group.

公开(公告)号：US20180242448A1

公开(公告)日：2018-08-23

申请号：US15896166

申请日：2018-02-14

Applicant: ARISAWA MFG. CO., LTD.

Inventor： Kazuo YOSHIKAWA ,  Makoto TAI ,  Nobuyuki IWANO ,  Takayuki MAYAMA

IPC: H05K1/03 ,  H05K3/00 ,  C08L53/00 ,  C08K3/36 ,  C09J153/00 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20

CPC classification number: H05K1/036 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B2250/02 ,  B32B2250/05 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2379/08 ,  B32B2457/08 ,  C08K3/36 ,  C08K2003/2227 ,  C08L53/005 ,  C09J7/10 ,  C09J7/387 ,  C09J153/005 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2453/00 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0112 ,  H05K2201/0133 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/2063 ,  H05K2203/107

Abstract: The present invention provides a resin composition comprising a specific styrene polymer, a specific inorganic filler, and a curing agent, wherein the styrene polymer is a specific acid-modified styrene polymer, and the resin composition satisfies specific conditions in the form of a film having a thickness of 25 μm.