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公开(公告)号：US10746668B2
公开(公告)日：2020-08-18
申请号：US16380223
申请日：2019-04-10
发明人： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC分类号： G01N21/95 , G01B11/14 , G01B11/02 , G01N21/956 , G03F7/20 , H01L21/66 , G05B19/418 , G01B11/00 , G01B11/26
摘要： In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.
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公开(公告)号：US20190301850A1
公开(公告)日：2019-10-03
申请号：US16380223
申请日：2019-04-10
发明人： Wouter Lodewijk ELINGS , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC分类号： G01B11/00 , G01B11/02 , G01B11/14 , G01B11/26 , H01L21/66 , G03F7/20 , G05B19/418 , G01N21/956 , G01N21/95
摘要： In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.
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公开(公告)号：US20230333482A1
公开(公告)日：2023-10-19
申请号：US18212334
申请日：2023-06-21
发明人： Arnaud HUBAUX , Johan Franciscus Maria Beckers , Dylan John David Davies , Johan Gertrudis Cornelis Kunnen , Willem Richard Pongers , Ajinkya Ravindra Daware , Chung-Hsun Li , Georgios Tsirogiannis , Hendrik Cornelis Anton Borger , Frederik Eduard De Jong , Juan Manuel Gonzalez Huesca , Andriy Hlod , Maxim Pisarenco
IPC分类号： G03F7/20 , G06F30/392 , G03F1/70
CPC分类号： G03F7/70508 , G06F30/392 , G03F1/70 , G03F7/70616 , G05B2219/45028 , G05B2219/45031
摘要： A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.
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公开(公告)号：US10996176B2
公开(公告)日：2021-05-04
申请号：US16905629
申请日：2020-06-18
发明人： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC分类号： G01N21/95 , G01B11/14 , G01B11/02 , G01N21/956 , G03F7/20 , H01L21/66 , G05B19/418 , G01B11/00 , G01B11/26
摘要： In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.
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公开(公告)号：US11977034B2
公开(公告)日：2024-05-07
申请号：US17194558
申请日：2021-03-08
发明人： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC分类号： G01B11/14 , G01B11/00 , G01B11/02 , G01B11/26 , G01N21/95 , G01N21/956 , G03F7/00 , G05B19/418 , H01L21/66
CPC分类号： G01N21/9501 , G01B11/002 , G01B11/02 , G01B11/14 , G01B11/26 , G01N21/956 , G01N21/95607 , G03F7/70508 , G03F7/70625 , G03F7/70633 , G05B19/41875 , H01L22/20 , G05B2219/37224 , Y02P90/02
摘要： In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.
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公开(公告)号：US11687007B2
公开(公告)日：2023-06-27
申请号：US17423325
申请日：2020-01-09
发明人： Arnaud Hubaux , Johan Franciscus Maria Beckers , Dylan John David Davies , Johan Gertrudis Cornelis Kunnen , Willem Richard Pongers , Ajinkya Ravindra Daware , Chung-Hsun Li , Georgios Tsirogiannis , Hendrik Cornelis Anton Borger , Frederik Eduard De Jong , Juan Manuel Gonzalez Huesca , Andriy Hlod , Maxim Pisarenco
IPC分类号： G03F1/70 , G03F7/30 , G03F7/00 , G06F30/392
CPC分类号： G03F7/70508 , G03F1/70 , G03F7/70616 , G06F30/392 , G05B2219/45028 , G05B2219/45031
摘要： A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.
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公开(公告)号：US20210215622A1
公开(公告)日：2021-07-15
申请号：US17194558
申请日：2021-03-08
发明人： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC分类号： G01N21/95 , G01B11/14 , G01B11/02 , G01N21/956 , G03F7/20 , H01L21/66 , G05B19/418 , G01B11/00 , G01B11/26
摘要： In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked to at least partially recompose the measurement results according to the sample plan.
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公开(公告)号：US11774869B2
公开(公告)日：2023-10-03
申请号：US17599302
申请日：2020-01-17
发明人： Ruud Hendrikus Martinus Johannes Bloks , Hendrik Cornelis Anton Borger , Frederik Eduard De Jong , Johan Gertrudis Cornelis Kunnen , Siebe Landheer , Chung-Hsun Li , Patricius Jacobus Neefs , Georgios Tsirogiannis , Si-Han Zeng
CPC分类号： G03F7/70875 , G03F7/7085 , G03F7/70633
摘要： A method of determining an overlay value of a substrate, the method including: obtaining temperature data that includes data on measured temperature at one or more positions on a substrate table after a substrate has been loaded onto the substrate table; and determining an overlay value of the substrate in dependence on the obtained temperature data. There is further disclosed a method of determining a performance of a clamping by a substrate table using a determined overlay value.
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公开(公告)号：US11774861B2
公开(公告)日：2023-10-03
申请号：US17775802
申请日：2020-10-12
CPC分类号： G03F7/70516 , G03F7/70491
摘要： Disclosed is a method of determining calibrated reference exposure and measure grids for referencing position of a substrate stage in a lithographic system. The method comprises obtaining calibration data relating to one or more calibration substrates; and determining an exposure grid for an exposure side of the lithographic system from said calibration data and a measure grid for a measure side of the lithographic system from said calibration data. The exposure grid and said measure grid are decomposed so as to remove a calibration substrate dependent component from said exposure grid and from said measure grid to obtain a substrate independent exposure grid and substrate independent measure grid.
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公开(公告)号：US10317191B2
公开(公告)日：2019-06-11
申请号：US15432684
申请日：2017-02-14
发明人： Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Chung-Hsun Li
IPC分类号： G03F7/20 , G01B11/00 , G01B11/02 , G01B11/14 , G01B11/26 , G01N21/95 , H01L21/66 , G01N21/956 , G05B19/418
摘要： In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced 2506 defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used 2508 to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked 2510 to at least partially recompose the measurement results according to the sample plan.
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