COMPUTATIONAL WAFER INSPECTION
    4.
    发明申请
    COMPUTATIONAL WAFER INSPECTION 有权
    计算水轮检查

    公开(公告)号:US20170046473A1

    公开(公告)日:2017-02-16

    申请号:US15339669

    申请日:2016-10-31

    IPC分类号: G06F17/50 G03F7/20 G06N7/00

    摘要: Disclosed herein is a computer-implemented defect prediction method for a device manufacturing process involving processing a portion of a design layout onto a substrate, the method comprising: identifying a hot spot from the portion of the design layout; determining a range of values of a processing parameter of the device manufacturing process for the hot spot, wherein when the processing parameter has a value outside the range, a defect is produced from the hot spot with the device manufacturing process; determining an actual value of the processing parameter; determining or predicting, using the actual value, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the hot spot with the device manufacturing process.

    摘要翻译: 这里公开了一种用于设备制造过程的计算机实现的缺陷预测方法,该方法涉及将设计布局的一部分处理到衬底上,所述方法包括:从所述设计布局的所述部分中识别热点; 确定所述热点的装置制造过程的处理参数的值的范围,其中当所述处理参数具有超出所述范围的值时,通过所述装置制造过程从所述热点产生缺陷; 确定处理参数的实际值; 使用设备制造过程从热点产生的缺陷确定或预测使用实际值存在,存在概率,特性或其组合。