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公开(公告)号：US20210280490A1
公开(公告)日：2021-09-09
申请号：US17249493
申请日：2021-03-03
发明人： Marco Gavagnin , Gerald Weis , Markus Leitgeb , Gernot Grober , Young Hy Jung
IPC分类号： H01L23/367 , H01L23/373 , H01L23/532
摘要： An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged.
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公开(公告)号：US10991674B2
公开(公告)日：2021-04-27
申请号：US16298512
申请日：2019-03-11
发明人： Gerald Weis
IPC分类号： H01L25/065 , H01L23/66 , H01L23/00 , H01P3/06 , H05K1/18 , H01L23/538 , H05K1/02
摘要： Provided is an electronic assembly including (a) an interconnect carrier having an electrically insulating core and at least two electrically conducting layers formed at the electrically insulating core; (b) a first integrated circuit chip mounted at a first side of the interconnect carrier; (c) a second integrated circuit chip mounted at a second side of the interconnect carrier opposite to the first side; and (d) an interconnection structure electrically connecting the first integrated circuit chip with the second integrated circuit chip. The electric interconnection structure extends around the insulating core and includes at least one electric conductor path which is designed in such a manner that an impedance match between the first integrated circuit chip and the second integrated circuit chip is provided. Further, there is provided an electronic system comprising such an electronic assembly.
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公开(公告)号：US10998672B2
公开(公告)日：2021-05-04
申请号：US16599429
申请日：2019-10-11
发明人： Gerald Weis , Thomas Krivec
摘要： An electric device which includes a first component carrier structure with a first magnet structure and a first connection structure, and a second component carrier structure with a second magnet structure and a second connection structure. The first magnet structure and the second magnet structure are configured such that upon attaching the first component carrier structure and the second component carrier structure to one another the first connection structure is connected to the second connection structure, holding the first component carrier structure and the second component carrier structure together by an attracting magnetic force between the first magnet structure and the second magnet structure.
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公开(公告)号：US11450587B2
公开(公告)日：2022-09-20
申请号：US17249493
申请日：2021-03-03
发明人： Marco Gavagnin , Gerald Weis , Markus Leitgeb , Gernot Grober , Young Hy Jung
IPC分类号： H01L23/367 , H01L23/373 , H01L23/532 , H01L21/768 , H01L25/065 , H01L23/13 , H01L23/498
摘要： An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged.
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5.发明授权公开(公告)号：US11178772B2
公开(公告)日：2021-11-16
申请号：US15940588
申请日：2018-03-29
发明人： Gernot Grober , Gerald Weis
IPC分类号： H05K1/18 , H01L21/48 , H01L21/56 , H01L21/683 , H01L23/538 , H01L23/552 , H01L23/66 , H01L23/00 , H01L25/065 , H01L25/00 , H05K1/02 , H05K1/09 , H05K1/11 , H05K3/00 , H05K3/40 , H05K3/46 , H01L23/498 , H01L29/16
摘要： An electronic device includes a first component carrier with a stack of at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, and a second component carrier with a respective stack of at least one second electrically conductive layer structure and at least one second electrically insulating layer structure. The second component carrier is connected with the first component carrier so that a stacking direction of the first component carrier is angled with regard to a stacking direction of the second component carrier.
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公开(公告)号：US20210241952A1
公开(公告)日：2021-08-05
申请号：US17248582
申请日：2021-01-29
发明人： Gerald Weidinger , Gerald Weis , Ivan Salkovic
IPC分类号： H01F1/37 , H01F1/28 , H01L23/552 , H01F27/28
摘要： A magnetic member having a substantially annular structure includes a non-magnetic matrix and magnetic particles embedded in the matrix. The magnetic member may be arranged on or in a component carrier.
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公开(公告)号：US10332818B2
公开(公告)日：2019-06-25
申请号：US15880055
申请日：2018-01-25
发明人： Mike Morianz , Gerald Weis , Johannes Stahr
IPC分类号： H01L23/34 , H01L23/367 , H01L23/538 , H01L23/00 , H01L25/07 , H01L21/48 , H05K1/02 , H05K1/18 , H05K3/30 , H05K3/46 , H02M7/06
摘要： A component carrier has an interconnected stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack and a diode, and at least one heat removal layer configured for removing heat from the diode and substantially fully covering a whole main surface of the component carrier.
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公开(公告)号：US20170092630A1
公开(公告)日：2017-03-30
申请号：US15272568
申请日：2016-09-22
IPC分类号： H01L25/16 , H05K1/02 , H05K1/11 , H05K7/20 , H01L23/467 , H01L25/07 , H01L23/00 , H05K1/18 , H01L23/538
CPC分类号： H01L25/16 , H01L23/3677 , H01L23/467 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L24/17 , H01L24/19 , H01L24/20 , H01L25/074 , H01L25/105 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/2518 , H01L2225/1035 , H01L2225/1047 , H01L2225/1094 , H01L2924/1033 , H01L2924/13055 , H01L2924/1306 , H01L2924/1426 , H01L2924/1436 , H01L2924/153 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19102 , H01L2924/19105 , H05K1/0206 , H05K1/0209 , H05K1/0212 , H05K1/0298 , H05K1/115 , H05K1/181 , H05K1/185 , H05K7/20154 , H05K2201/10015 , H05K2201/10166 , Y02P70/611
摘要： In a connection system for electronic components (1) comprising a plurality of insulating layers (2) and conductive layers (3) and further comprising at least one embedded electronic component (4) embedded within at least one of the plurality of insulating layers (2) and conductive layers (3) the at least one embedded electronic component (4) is at least one first transistor having a bulk terminal thereof in thermal contact with a thermal duct (6) comprised of a plurality of vias (7) reaching through at least one of an insulating layer (2) and a conductive layer (3) of the connection system for electronic components (1) and emerging on a first outer surface (8) of the connection system for electronic components (1) under a first surface-mounted component (10).
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公开(公告)号：US11889622B2
公开(公告)日：2024-01-30
申请号：US17650309
申请日：2022-02-08
发明人： Gerald Weis
CPC分类号： H05K1/0272 , H01R12/52 , H05K1/185 , H05K3/368 , H05K2201/064
摘要： An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure.
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公开(公告)号：US20220256692A1
公开(公告)日：2022-08-11
申请号：US17650309
申请日：2022-02-08
发明人： Gerald Weis
摘要： An electronic device includes a component carrier having a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, an electronic component on and/or in the stack, and a cooling member with a fluid cooling unit at least partially therein. The component carrier and the cooling member are connected by a connection structure.
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