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公开(公告)号：US09166117B2
公开(公告)日：2015-10-20
申请号：US14066706
申请日：2013-10-30
IPC分类号： H01L33/50 , F21V9/16 , H01L25/075
CPC分类号： H01L33/50 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： An exemplary light emitting device includes a blue-green light source and a orange-red light source. The blue-green light source emits blue-green light and the orange-red light source emits orange-red light when they are activated. The blue-green light and the orange-red light are mixed together to obtain white light.
摘要翻译： 示例性的发光器件包括蓝 - 绿光源和橙红光源。 蓝绿色光源发出蓝绿色光，橙红色光源在激活时会发出橙红色光。 将蓝绿光和橙红色光混合在一起以获得白光。
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2.发明授权LED module with circuit board having a plurality of recesses for preventing total internal reflection 有权具有电路板的LED模块具有用于防止全内反射的多个凹部公开(公告)号：US09439280B2
公开(公告)日：2016-09-06
申请号：US14474797
申请日：2014-09-02
IPC分类号： H01L21/00 , H05K1/02 , H01L25/075 , H01L33/60 , H05K3/28
CPC分类号： H05K1/0274 , H01L25/0753 , H01L33/60 , H01L2924/0002 , H05K3/284 , H05K2201/09036 , H05K2201/10106 , H05K2201/2054 , H01L2924/00
摘要： An light emitting diode (LED) module includes a circuit board, a plurality of LED chips arranged on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the LED chips, a plurality of first recesses defined in a first surface of the circuit board.
摘要翻译： 发光二极管（LED）模块包括电路板，布置在电路板上并电连接到电路板的多个LED芯片以及布置在电路板上并覆盖LED芯片的密封剂，多个第一凹槽限定在 电路板的第一表面。
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3.发明授权LED light emitting apparatus having a light guiding device to achieve a uniform color distribution 有权具有导光装置以实现均匀颜色分布的LED发光装置公开(公告)号：US09109782B2
公开(公告)日：2015-08-18
申请号：US13859703
申请日：2013-04-09
IPC分类号： F21V13/14 , F21V7/00 , F21V9/16 , F21V13/02 , F21V13/12 , F21V8/00 , F21V3/04 , F21Y101/02 , F21Y105/00
CPC分类号： F21V13/14 , F21V3/12 , F21V7/0008 , F21V9/30 , F21V13/02 , F21V13/12 , F21Y2105/00 , F21Y2115/10 , G02B6/0001 , G02B6/005
摘要： An LED light emitting apparatus includes an LED light source, a light guiding device and an emitting window. The emitting window is covered with a phosphor layer. Light emitted directly from the LED light source is first transmitted to the light guiding device and then guided by the light guiding device towards the emitting window to evenly excite the phosphor layer.
摘要翻译： LED发光装置包括LED光源，导光装置和发光窗。 发射窗口被磷光体层覆盖。 从LED光源直接发射的光首先传输到导光装置，然后被导光装置引向发射窗口，以均匀地激发荧光层。
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公开(公告)号：US09515234B2
公开(公告)日：2016-12-06
申请号：US14821308
申请日：2015-08-07
IPC分类号： H01L33/00 , H01L21/00 , H01L33/54 , H01L33/48 , H01L33/52 , H01L33/56 , H01L33/50 , H01L25/075
CPC分类号： H01L33/54 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/52 , H01L33/56 , H01L2224/45144 , H01L2224/48091 , H01L2933/0033 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode package includes a substrate, several light emitting diodes mounted on the substrate, and a package member enveloping the light emitting diodes. The light emitting diodes are electrically coupled to the substrate. The package member includes at least two layers, the first layer and the second layer. The first layer is spread on the substrate and completely covers the light emitting diodes and the wires. The second layer is formed on the first layer. Fluidity of colloid forming the second layer is worse than that of the first layer. A method is also provided to manufacture the present light emitting diode package.
摘要翻译： 发光二极管封装包括衬底，安装在衬底上的几个发光二极管和封装发光二极管的封装构件。 发光二极管电耦合到衬底。 包装件包括至少两层，即第一层和第二层。 第一层铺展在基板上并完全覆盖发光二极管和导线。 第二层形成在第一层上。 形成第二层的胶体的流动性比第一层的流动性差。 还提供了一种制造本发明的发光二极管封装的方法。
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公开(公告)号：US09231174B2
公开(公告)日：2016-01-05
申请号：US14474767
申请日：2014-09-02
IPC分类号： H01L27/00 , H01L33/54 , H01L25/075
CPC分类号： H01L33/54 , H01L25/0753 , H01L2924/0002 , H01L2924/00
摘要： An light emitting diode (LED) module includes a circuit board, a set of LED chips formed on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the LED chips, a set of first recesses defined in a top surface of the encapsulant.
摘要翻译： 发光二极管（LED）模块包括电路板，形成在电路板上并电连接到电路板的一组LED芯片，以及布置在电路板上并覆盖LED芯片的密封剂，一组限定在 密封剂的顶面。
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6.发明授权公开(公告)号：US08981407B2
公开(公告)日：2015-03-17
申请号：US13919755
申请日：2013-06-17
CPC分类号： H01L33/60 , H01L2224/48091 , H01L2924/0002 , H01L2933/005 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode (LED) package includes a substrate with a flat top surface, an LED chip mounted on the substrate, and a group of blocking structure and encapsulation body. The LED chip electrically connects with the substrate. The blocking structure surrounds the LED chip. The encapsulation body covers the LED chip. A bottom of the encapsulation body is enclosed by the blocking structure; the encapsulation body has a light outputting surface, and an outer surface of the blocking structure is continuously connected with the light outputting surface. The light outputting surface has a semispherical profile. An angle between a normal line extending from the outer surface of the blocking structure and perpendicular to the substrate and a tangent line tangent to the light outputting surface at a point thereof adjacent to the outer surface is smaller than 60 degrees.
摘要翻译： 发光二极管（LED）封装包括具有平坦顶表面的基板，安装在基板上的LED芯片以及一组阻挡结构和封装体。 LED芯片与基板电连接。 阻挡结构围绕着LED芯片。 封装体覆盖LED芯片。 封装体的底部由阻挡结构封闭; 封装体具有光输出表面，并且阻挡结构的外表面与光输出表面连续地连接。 光输出表面具有半球形轮廓。 从阻挡结构的外表面延伸并垂直于基板的法线与在与外表面相邻的点处与光输出表面相切的切线之间的角度小于60度。
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公开(公告)号：US08926125B2
公开(公告)日：2015-01-06
申请号：US13859752
申请日：2013-04-10
IPC分类号： F21V1/00 , F21V29/00 , F21V7/00 , F21V3/00 , F21V7/05 , F21V3/04 , F21V13/02 , F21W111/02 , F21Y101/02
CPC分类号： F21V29/506 , F21V3/061 , F21V3/062 , F21V7/00 , F21V7/0008 , F21V7/05 , F21V13/02 , F21V29/70 , F21W2111/02 , F21Y2115/10
摘要： An LED (light emitting diode) lighting apparatus includes an LED, a light adjusting device and a shell. The LED includes a main lighting surface and a heat dissipating surface. The shell receives the LED and the light adjusting device therein, the shell having a light emitting window for light emitted from the LED to transmit therethrough after the light is directed by the light adjusting device. The heat dissipating surface of the LED connects the light emitting window, and heat generated by the LED is transferred from the heat dissipating surface to the light emitting window to prevent snow from accumulating on the light emitting window.
摘要翻译： LED（发光二极管）照明装置包括LED，调光装置和外壳。 LED包括主照明表面和散热表面。 外壳在其中接收LED和调光装置，在光被光调节装置引导之后，外壳具有用于从LED发出的光透射的发光窗口。 LED的散热面连接发光窗，LED产生的热量从散热面传递到发光窗口，防止雪积聚在发光窗上。
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公开(公告)号：US08921880B2
公开(公告)日：2014-12-30
申请号：US13729044
申请日：2012-12-28
CPC分类号： H01L33/50 , H01L33/505 , H01L33/54 , H01L33/56 , H01L2933/0091
摘要： An LED light source device includes an LED light source, a first translucent structure covering the LED light source and a second translucent structure covering the first translucent structure. An interior of the first translucent structure has light scattering powder distributed therein. The LED light source is embedded in the first translucent structure. The LED light source is covered by the light scattering powder. The second translucent structure has a radius of R and an index of refraction of N1, while the first translucent structure has a radius of r, wherein R, r and N1 satisfy the following relation: N1
摘要翻译： LED光源装置包括LED光源，覆盖LED光源的第一半透明结构和覆盖第一半透明结构的第二半透明结构。 第一半透明结构的内部具有分散在其中的光散射粉末。 LED光源嵌入在第一半透明结构中。 LED光源被光散射粉末覆盖。 第二半透明结构具有R的半径和折射率N1，而第一半透明结构具有半径r，其中R，r和N1满足以下关系：N1
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