公开(公告)号：US07531844B2

公开(公告)日：2009-05-12

申请号：US10529725

申请日：2003-09-29

申请人： Akihisa Matsumoto ,  Tatsuya Motoike ,  Toshinori Nakahara

发明人： Akihisa Matsumoto ,  Tatsuya Motoike ,  Toshinori Nakahara

IPC分类号： H01L29/22 ,  H01L29/227

CPC分类号： H01L33/60 ,  H01L23/49861 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01S5/02244 ,  H01S5/024 ,  H01L2924/00014

摘要： A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light emitting chip fixed to the lead frame. On the lead frame, a rise portion is formed in a side wall of the case or along the inner surface of the side wall. The lead frame has a first lead frame fixing the light emitting chip and a second lead frame connected to the light emitting chip by the wire bonding. At least on the first lead frame, a rise portion is formed.

摘要翻译： 发光元件包括：由绝缘材料形成且在其内部具有空间的盒状壳体; 由导电材料形成并固定到壳体上的引线框架; 以及固定到引线框架的发光芯片。 在引线框架上，在壳体的侧壁或侧壁的内表面上形成上升部分。 引线框架具有固定发光芯片的第一引线框架和通过引线接合连接到发光芯片的第二引线框架。 至少在第一引线框架上形成上升部分。

公开(公告)号：US20060108669A1

公开(公告)日：2006-05-25

申请号：US10529725

申请日：2003-09-29

申请人： Akihisa Matsumoto ,  Tatsuya Motoike ,  Toshinori Nakahara

发明人： Akihisa Matsumoto ,  Tatsuya Motoike ,  Toshinori Nakahara

IPC分类号： F21V29/00 ,  H01L23/495

CPC分类号： H01L33/60 ,  H01L23/49861 ,  H01L33/483 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01S5/02244 ,  H01S5/024 ,  H01L2924/00014

摘要： A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light emitting chip fixed to the lead frame. On the lead frame, a rise portion is formed in a side wall of the case or along the inner surface of the side wall. The lead frame has a first lead frame fixing the light emitting chip and a second lead frame connected to the light emitting chip by the wire bonding. At least on the first lead frame, a rise portion is formed.

公开(公告)号：US20090314534A1

公开(公告)日：2009-12-24

申请号：US12301265

申请日：2007-05-29

申请人： Yoichi Matsuoka ,  Toshinori Nakahara ,  Keiko Takigawa ,  Akihisa Matsumoto

发明人： Yoichi Matsuoka ,  Toshinori Nakahara ,  Keiko Takigawa ,  Akihisa Matsumoto

IPC分类号： H05K1/16 ,  H05K1/11

CPC分类号： H01L33/642 ,  H01L23/24 ,  H01L24/45 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/647 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic component (1) is provided with a circuit board (2) having a plurality of electrodes on the upper and lower planes of an insulating substrate, and a circuit element (7) fixed to the upper plane of the circuit board (2). The electronic component is also provided with an upper electrode (4) whereupon a circuit element (7) is to be arranged; a through hole (13) penetrating the insulating substrate (12); and a lower electrode (15), which is formed on the lower side ranging from a first side end (20A) of the circuit board (2) to a sectional side end (20B) facing the first side end (20A) and carries electricity to the upper electrode (4) through the through hole (13).

摘要翻译： 电子部件（1）具有在绝缘基板的上下面具有多个电极的电路基板（2）和固定在电路基板（2）的上面的电路元件（7） 。 电子部件还设置有上电极（4），电路元件（7）将被布置; 穿过所述绝缘基板（12）的通孔（13）; 以及下电极（15），其形成在从电路基板（2）的第一侧端部（20A）到面向第一侧端部（20A）的截面侧端部（20B）的下侧，并且承载电力 通过通孔（13）到达上电极（4）。

公开(公告)号：US20090154176A1

公开(公告)日：2009-06-18

申请号：US12301283

申请日：2007-05-29

申请人： Yoichi Matsuoka ,  Toshinori Nakahara ,  Keiko Takigawa ,  Akihisa Matsumoto

发明人： Yoichi Matsuoka ,  Toshinori Nakahara ,  Keiko Takigawa ,  Akihisa Matsumoto

IPC分类号： H05K1/16 ,  F21V21/00 ,  H05K13/04

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/14 ,  Y10T29/5313 ,  H01L2924/00014 ,  H01L2924/00

摘要： In an electronic component (1), a frame (3) composed of a conductor is fixed on a circumference portion on the upper surface of a circuit board (2). The circuit board (2) and the frame (3) have a side surface (41) composed of a same surface, and the circuit board (2) is provided with terminal sections (16, 17) exposed on the side surface (41). The frame (3) has an empty space (22) over a lower surface facing the circuit board (2) and a side surface (20). The empty space (22) may be filled with an insulating material.

摘要翻译： 在电子部件（1）中，由导体构成的框架（3）固定在电路基板（2）的上表面的圆周部上。 电路板（2）和框架（3）具有由相同的表面组成的侧表面（41），并且电路板（2）设置有暴露在侧表面（41）上的端子部分（16,17） 。 框架（3）在面向电路板（2）的下表面和侧表面（20）上具有空的空间（22）。 空的空间（22）可以填充绝缘材料。