公开(公告)号：US08704116B2

公开(公告)日：2014-04-22

申请号：US12929382

申请日：2011-01-20

申请人： Akira Akiba ,  Koichi Ikeda

发明人： Akira Akiba ,  Koichi Ikeda

IPC分类号： H01H57/00

CPC分类号： H01H57/00

摘要： There is provided a contact switch including: a plurality of first contact points arranged in parallel on a substrate; a movable member including a plurality of beams facing the plurality of first contact points, and formed to be slidable along an alignment direction of the first contact points within a face of the substrate; and a plurality of second contact points provided on faces of the beams, opposing the first contact points, respectively.

摘要翻译： 提供了一种接触开关，包括：平行布置在基板上的多个第一接触点; 可动构件，其包括面对所述多个第一接触点的多个梁，并且形成为能够沿着所述基板的表面内的所述第一接触点的排列方向滑动; 以及分别设置在所述梁的与所述第一接触点相对的面上的多个第二接触点。

公开(公告)号：US08546911B2

公开(公告)日：2013-10-01

申请号：US12847182

申请日：2010-07-30

申请人： Akira Akiba ,  Shun Mitarai ,  Koichi Ikeda

发明人： Akira Akiba ,  Shun Mitarai ,  Koichi Ikeda

IPC分类号： H01L27/08

CPC分类号： H01L23/5227 ,  H01L23/5223 ,  H01L23/5228 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H7/0115 ,  H03H7/175 ,  H03H7/1775 ,  H03H2001/0064 ,  H01L2924/00

摘要： A small high frequency device that is able to inhibit generation of an eddy current and a parasitic capacity and shows superior high frequency characteristics is provided. The high frequency device includes: a substrate having a depression; a dielectric layer over the substrate; and a plurality of electronic devices which are provided in the dielectric layer or on the dielectric layer, and at least one of which is opposed to the depression.

摘要翻译： 提供能够抑制涡电流的产生和寄生容量并显示出优异的高频特性的小型高频器件。 高频器件包括：具有凹陷的衬底; 介电层; 以及多个电子器件，其设置在电介质层或电介质层上，并且其中至少一个与凹陷相对。

公开(公告)号：US20110024273A1

公开(公告)日：2011-02-03

申请号：US12838526

申请日：2010-07-19

申请人： Akira Akiba ,  Koichi Ikeda

发明人： Akira Akiba ,  Koichi Ikeda

IPC分类号： H01H59/00

CPC分类号： H01P1/127 ,  H01H59/0009

摘要： A shunt switch allowed to improve isolation, a semiconductor device, a module and an electronic device each of which includes the shunt switch are provided. The shunt switch includes: a transmission line, a ground; and a shunt line electrically coupling the transmission line and the ground, in which two or more of the shunt lines are arranged in parallel to one another, and an impedance between the two or more shunt lines is higher than an impedance of the transmission line.

摘要翻译： 提供了一种分流开关，用于改善隔离度，提供包括分流开关的半导体器件，模块和电子器件。 分流开关包括：传输线，地线; 以及电耦合所述传输线和地线的并联线，其中所述并联线路中的两个或更多个彼此平行布置，并且所述两个或更多个分流线路之间的阻抗高于所述传输线路的阻抗。

公开(公告)号：US08456037B2

公开(公告)日：2013-06-04

申请号：US12838526

申请日：2010-07-19

申请人： Akira Akiba ,  Koichi Ikeda

发明人： Akira Akiba ,  Koichi Ikeda

IPC分类号： G05F1/10 ,  H01H51/34

CPC分类号： H01P1/127 ,  H01H59/0009

摘要： A shunt switch allowed to improve isolation, a semiconductor device, a module and an electronic device each of which includes the shunt switch are provided. The shunt switch includes: a transmission line, a ground; and a shunt line electrically coupling the transmission line and the ground, in which two or more of the shunt lines are arranged in parallel to one another, and an impedance between the two or more shunt lines is higher than an impedance of the transmission line.

摘要翻译： 提供了一种分流开关，用于改善隔离度，提供包括分流开关的半导体器件，模块和电子器件。 分流开关包括：传输线，地线; 以及电耦合所述传输线和地线的并联线，其中所述并联线路中的两个或更多个彼此平行布置，并且所述两个或更多个分流线路之间的阻抗高于所述传输线路的阻抗。

公开(公告)号：US08952856B2

公开(公告)日：2015-02-10

申请号：US12929273

申请日：2011-01-12

申请人： Akira Akiba ,  Koichi Ikeda

发明人： Akira Akiba ,  Koichi Ikeda

IPC分类号： H01Q9/00

CPC分类号： H01Q9/00

摘要： A transmission/reception element includes: a plurality of metal layers each disposed with space from another; and a switch for controlling electrical coupling between the metal layers. The switch includes a contact-point group including a plurality of contact-point pairs each disposed in parallel between each two of the metal layers, and a drive section mechanically driving the contact-point group for state change of each of the contact-point pairs between in-contact and no-contact.

摘要翻译： 发送/接收元件包括：多个金属层，每个金属层与另一个间隔设置; 以及用于控制金属层之间的电耦合的开关。 该开关包括一个接触点组，该接点组包括平行于每两个金属层之间的多个接触点对，以及驱动部分，用于机械地驱动每个接触点对的状态变化的接触点组 在联系和不接触之间。

公开(公告)号：US07566956B2

公开(公告)日：2009-07-28

申请号：US11425077

申请日：2006-06-19

申请人： Shun Mitarai ,  Koichi Ikeda ,  Masahiro Tada ,  Akira Akiba ,  Shinya Morita

发明人： Shun Mitarai ,  Koichi Ikeda ,  Masahiro Tada ,  Akira Akiba ,  Shinya Morita

IPC分类号： H01L23/02

CPC分类号： B81C1/00238

摘要： The present invention provides a semiconductor composite device including a semiconductor device formed on or in a substrate, an insulating film formed on the substrate so as to cover the semiconductor device, a micro electro mechanical portion formed on the insulating film, and a wiring layer connected to the semiconductor device and the micro electro mechanical portion.

摘要翻译： 本发明提供一种半导体复合器件，其包括形成在衬底上或衬底中的半导体器件，形成在衬底上以覆盖半导体器件的绝缘膜，形成在绝缘膜上的微机电部分和连接的布线层 到半导体器件和微机电部分。

公开(公告)号：US20060289955A1

公开(公告)日：2006-12-28

申请号：US11425077

申请日：2006-06-19

申请人： Shun Mitarai ,  Koichi Ikeda ,  Masahiro Tada ,  Akira Akiba ,  Shinya Morita

发明人： Shun Mitarai ,  Koichi Ikeda ,  Masahiro Tada ,  Akira Akiba ,  Shinya Morita

IPC分类号： H01L29/84 ,  H01L23/52

CPC分类号： B81C1/00238

摘要： The present invention provides a semiconductor composite device including a semiconductor device formed on or in a substrate, an insulating film formed on the substrate so as to cover the semiconductor device, a micro electro mechanical portion formed on the insulating film, and a wiring layer connected to the semiconductor device and the micro electro mechanical portion.

摘要翻译： 本发明提供一种半导体复合器件，其包括形成在衬底上或衬底中的半导体器件，形成在衬底上以覆盖半导体器件的绝缘膜，形成在绝缘膜上的微机电部分和连接的布线层 到半导体器件和微机电部分。

公开(公告)号：US20110187617A1

公开(公告)日：2011-08-04

申请号：US12929273

申请日：2011-01-12

申请人： Akira Akiba ,  Koichi Ikeda

发明人： Akira Akiba ,  Koichi Ikeda

IPC分类号： H01Q9/00

CPC分类号： H01Q9/00

摘要： A transmission/reception element includes: a plurality of metal layers each disposed with space from another; and a switch for controlling electrical coupling between the metal layers. The switch includes a contact-point group including a plurality of contact-point pairs each disposed in parallel between each two of the metal layers, and a drive section mechanically driving the contact-point group for state change of each of the contact-point pairs between in-contact and no-contact.

摘要翻译： 发送/接收元件包括：多个金属层，每个金属层与另一个间隔设置; 以及用于控制金属层之间的电耦合的开关。 该开关包括一个接触点组，该接点组包括平行于每两个金属层之间的多个接触点对，以及驱动部分，用于机械地驱动每个接触点对的状态变化的接触点组 在联系和不接触之间。

公开(公告)号：US20110186407A1

公开(公告)日：2011-08-04

申请号：US12929382

申请日：2011-01-20

申请人： Akira Akiba ,  Koichi Ikeda

发明人： Akira Akiba ,  Koichi Ikeda

IPC分类号： H01H57/00

CPC分类号： H01H57/00

摘要： There is provided a contact switch including: a plurality of first contact points arranged in parallel on a substrate; a movable member including a plurality of beams facing the plurality of first contact points, and formed to be slidable along an alignment direction of the first contact points within a face of the substrate; and a plurality of second contact points provided on faces of the beams, opposing the first contact points, respectively.

摘要翻译： 提供了一种接触开关，包括：平行布置在基板上的多个第一接触点; 可动构件，其包括面对所述多个第一接触点的多个梁，并且形成为能够沿着所述基板的表面内的所述第一接触点的排列方向滑动; 以及分别设置在所述梁的与所述第一接触点相对的面上的多个第二接触点。

公开(公告)号：US20110032685A1

公开(公告)日：2011-02-10

申请号：US12847240

申请日：2010-07-30

申请人： Akira Akiba ,  Shun Mitarai ,  Koichi Ikeda ,  Shinya Morita

发明人： Akira Akiba ,  Shun Mitarai ,  Koichi Ikeda ,  Shinya Morita

IPC分类号： H05K7/02

CPC分类号： H01L23/66 ,  H01L23/13 ,  H01L23/147 ,  H01L23/645 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1515 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/157 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q1/38 ,  H01Q19/24 ,  H01Q19/30 ,  H05K1/024 ,  H05K1/141 ,  H05K1/16 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/20752

摘要： An interposer with which the manufacturing steps are able to be simplified and which shows superior high frequency characteristics is provided. The interposer includes: a substrate having a front face and a rear face; a wiring that is formed on the front face side of the substrate and is electrically connected to a semiconductor chip; an electric device connected to the wiring; and a concave section that is formed from the rear face side of the substrate in a position corresponding to the electric device.

摘要翻译： 提供了能够简化制造步骤并且显示出优异的高频特性的插入器。 插入器包括：具有正面和背面的基板; 形成在基板的正面侧并与半导体芯片电连接的布线; 连接到布线的电气设备; 以及从与所述电气装置对应的位置从所述基板的背面侧形成的凹部。