公开(公告)号：US07566956B2

公开(公告)日：2009-07-28

申请号：US11425077

申请日：2006-06-19

申请人： Shun Mitarai ,  Koichi Ikeda ,  Masahiro Tada ,  Akira Akiba ,  Shinya Morita

发明人： Shun Mitarai ,  Koichi Ikeda ,  Masahiro Tada ,  Akira Akiba ,  Shinya Morita

IPC分类号： H01L23/02

CPC分类号： B81C1/00238

摘要： The present invention provides a semiconductor composite device including a semiconductor device formed on or in a substrate, an insulating film formed on the substrate so as to cover the semiconductor device, a micro electro mechanical portion formed on the insulating film, and a wiring layer connected to the semiconductor device and the micro electro mechanical portion.

摘要翻译： 本发明提供一种半导体复合器件，其包括形成在衬底上或衬底中的半导体器件，形成在衬底上以覆盖半导体器件的绝缘膜，形成在绝缘膜上的微机电部分和连接的布线层 到半导体器件和微机电部分。

公开(公告)号：US20060289955A1

公开(公告)日：2006-12-28

申请号：US11425077

申请日：2006-06-19

申请人： Shun Mitarai ,  Koichi Ikeda ,  Masahiro Tada ,  Akira Akiba ,  Shinya Morita

发明人： Shun Mitarai ,  Koichi Ikeda ,  Masahiro Tada ,  Akira Akiba ,  Shinya Morita

IPC分类号： H01L29/84 ,  H01L23/52

CPC分类号： B81C1/00238

摘要： The present invention provides a semiconductor composite device including a semiconductor device formed on or in a substrate, an insulating film formed on the substrate so as to cover the semiconductor device, a micro electro mechanical portion formed on the insulating film, and a wiring layer connected to the semiconductor device and the micro electro mechanical portion.

摘要翻译： 本发明提供一种半导体复合器件，其包括形成在衬底上或衬底中的半导体器件，形成在衬底上以覆盖半导体器件的绝缘膜，形成在绝缘膜上的微机电部分和连接的布线层 到半导体器件和微机电部分。

公开(公告)号：US20110032685A1

公开(公告)日：2011-02-10

申请号：US12847240

申请日：2010-07-30

申请人： Akira Akiba ,  Shun Mitarai ,  Koichi Ikeda ,  Shinya Morita

发明人： Akira Akiba ,  Shun Mitarai ,  Koichi Ikeda ,  Shinya Morita

IPC分类号： H05K7/02

CPC分类号： H01L23/66 ,  H01L23/13 ,  H01L23/147 ,  H01L23/645 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12034 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1515 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/157 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01Q1/38 ,  H01Q19/24 ,  H01Q19/30 ,  H05K1/024 ,  H05K1/141 ,  H05K1/16 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/20752

摘要： An interposer with which the manufacturing steps are able to be simplified and which shows superior high frequency characteristics is provided. The interposer includes: a substrate having a front face and a rear face; a wiring that is formed on the front face side of the substrate and is electrically connected to a semiconductor chip; an electric device connected to the wiring; and a concave section that is formed from the rear face side of the substrate in a position corresponding to the electric device.

摘要翻译： 提供了能够简化制造步骤并且显示出优异的高频特性的插入器。 插入器包括：具有正面和背面的基板; 形成在基板的正面侧并与半导体芯片电连接的布线; 连接到布线的电气设备; 以及从与所述电气装置对应的位置从所述基板的背面侧形成的凹部。

公开(公告)号：US08546911B2

公开(公告)日：2013-10-01

申请号：US12847182

申请日：2010-07-30

申请人： Akira Akiba ,  Shun Mitarai ,  Koichi Ikeda

发明人： Akira Akiba ,  Shun Mitarai ,  Koichi Ikeda

IPC分类号： H01L27/08

CPC分类号： H01L23/5227 ,  H01L23/5223 ,  H01L23/5228 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H7/0115 ,  H03H7/175 ,  H03H7/1775 ,  H03H2001/0064 ,  H01L2924/00

摘要： A small high frequency device that is able to inhibit generation of an eddy current and a parasitic capacity and shows superior high frequency characteristics is provided. The high frequency device includes: a substrate having a depression; a dielectric layer over the substrate; and a plurality of electronic devices which are provided in the dielectric layer or on the dielectric layer, and at least one of which is opposed to the depression.

摘要翻译： 提供能够抑制涡电流的产生和寄生容量并显示出优异的高频特性的小型高频器件。 高频器件包括：具有凹陷的衬底; 介电层; 以及多个电子器件，其设置在电介质层或电介质层上，并且其中至少一个与凹陷相对。

公开(公告)号：US20110031583A1

公开(公告)日：2011-02-10

申请号：US12847182

申请日：2010-07-30

申请人： Akira Akiba ,  Shun Mitarai ,  Koichi Ikeda

发明人： Akira Akiba ,  Shun Mitarai ,  Koichi Ikeda

IPC分类号： H01L27/06

CPC分类号： H01L23/5227 ,  H01L23/5223 ,  H01L23/5228 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H7/0115 ,  H03H7/175 ,  H03H7/1775 ,  H03H2001/0064 ,  H01L2924/00

摘要： A small high frequency device that is able to inhibit generation of an eddy current and a parasitic capacity and shows superior high frequency characteristics is provided. The high frequency device includes: a substrate having a depression; a dielectric layer over the substrate; and a plurality of electronic devices which are provided in the dielectric layer or on the dielectric layer, and at least one of which is opposed to the depression.

摘要翻译： 提供能够抑制涡电流的产生和寄生容量并显示出优异的高频特性的小型高频器件。 高频器件包括：具有凹陷的衬底; 介电层; 以及多个电子器件，其设置在电介质层或电介质层上，并且其中至少一个与凹陷相对。

公开(公告)号：US08142669B2

公开(公告)日：2012-03-27

申请号：US11676353

申请日：2007-02-19

申请人： Akira Akiba ,  Shun Mitarai

发明人： Akira Akiba ,  Shun Mitarai

IPC分类号： H01L21/302 ,  B81C1/00

CPC分类号： B81C1/00896 ,  B81B2207/015 ,  B81C2201/056

摘要： An electromechanical element includes a mechanically movable element through a hollow formed on a substrate, and a plurality of holes formed in the movable element. In the electromechanical element, the plurality of holes are arranged such that at least two holes are in a same line, at least one hole is in another line located adjacent to the one line with at least two holes, and a distance between one of the holes arranged in the same line and the other hole located at the closest position from the one of the two holes arranged in the same line is longer than a distance between the holes adjacently arranged in the same line.

摘要翻译： 机电元件包括​​通过形成在基板上的中空的机械可移动元件和形成在可移动元件中的多个孔。 在机电元件中，多个孔布置成使得至少两个孔处于相同的线中，至少一个孔位于与具有至少两个孔的一条线相邻的另一条线中，并且其中一个之间的距离 布置在同一条线上的孔和位于与布置在同一条线上的两个孔中的一个最靠近的位置处的另一个孔比相邻排列在同一直线上的孔之间的距离更长。

公开(公告)号：US20080174204A1

公开(公告)日：2008-07-24

申请号：US11676353

申请日：2007-02-19

申请人： Akira Akiba ,  Shun Mitarai

发明人： Akira Akiba ,  Shun Mitarai

IPC分类号： B81B7/00 ,  B81C1/00 ,  C23F1/00

CPC分类号： B81C1/00896 ,  B81B2207/015 ,  B81C2201/056

摘要： An electromechanical element includes a mechanically movable element through a hollow formed on a substrate, and a plurality of holes formed in the movable element. In the electromechanical element, the plurality of holes are arranged such that at least two holes are in a same line, at least one hole is in another line located adjacent to the one line with at least two holes, and a distance between one of the holes arranged in the same line and the other hole located at the closest position from the one of the two holes arranged in the same line is longer than a distance between the holes adjacently arranged in the same line.

摘要翻译： 机电元件包括​​通过形成在基板上的中空的机械可移动元件和形成在可移动元件中的多个孔。 在机电元件中，多个孔布置成使得至少两个孔处于相同的线中，至少一个孔位于与具有至少两个孔的一条线相邻的另一条线中，并且其中一个之间的距离 布置在同一条线上的孔和位于与布置在同一条线上的两个孔中的一个最靠近的位置处的另一个孔比相邻排列在同一直线上的孔之间的距离更长。

公开(公告)号：US07893783B2

公开(公告)日：2011-02-22

申请号：US12123913

申请日：2008-05-20

申请人： Shinya Morita ,  Akira Akiba

发明人： Shinya Morita ,  Akira Akiba

IPC分类号： H03B5/30

CPC分类号： H03H9/2431 ,  H03H9/2463 ,  H03H2009/02354 ,  H03H2009/02511

摘要： Disclosed is a resonator including a plurality of resonator elements each including at least oscillation parts and lower electrodes with an intervening space therebetween, in which the plurality of resonator elements are disposed in a closed system and the oscillation parts of the plurality of resonator elements are continuously formed in an integrated manner.

摘要翻译： 公开了一种谐振器，其包括多个谐振元件，每个谐振器元件至少包括振荡部分和下部电极，其间具有中间空间，其中多个谐振器元件设置在闭合系统中，并且多个谐振器元件的振荡部分连续地 形成一体的方式。

公开(公告)号：US07889017B2

公开(公告)日：2011-02-15

申请号：US12235710

申请日：2008-09-23

申请人： Shinya Morita ,  Akira Akiba

发明人： Shinya Morita ,  Akira Akiba

IPC分类号： H03B5/30

CPC分类号： H03H9/2431 ,  H03H9/2463 ,  H03H2009/02354 ,  H03H2009/02511

摘要： A resonator containing a plurality of resonator elements, respectively having an electrode and an oscillating component opposed while having a space in between, arranged so as to form a closed system. The oscillating component of the plurality of resonator elements is continuously formed in an integrated manner.

摘要翻译： 包含分别具有电极和振荡部件的多个谐振器元件的谐振器，其间具有间隔而布置成形成封闭系统。 多个谐振器元件的振荡部件以一体的方式连续地形成。

公开(公告)号：US20090085683A1

公开(公告)日：2009-04-02

申请号：US12235710

申请日：2008-09-23

申请人： Shinya Morita ,  Akira Akiba

发明人： Shinya Morita ,  Akira Akiba

IPC分类号： H03B1/00

CPC分类号： H03H9/2431 ,  H03H9/2463 ,  H03H2009/02354 ,  H03H2009/02511

摘要： A resonator containing a plurality of resonator elements, respectively having an electrode and an oscillating component opposed while having a space in between, arranged so as to form a closed system. The oscillating component of the plurality of resonator elements is continuously formed in an integrated manner.

摘要翻译： 包含分别具有电极和振荡部件的多个谐振器元件的谐振器，其间具有间隔而布置成形成封闭系统。 多个谐振器元件的振荡部件以一体的方式连续地形成。