摘要:
A lamp has a deformed lamp reflector and a lamp front glass. The deformed lamp reflector is made by deforming an ellipsoid of revolution of a conventional lamp reflector into an aspherical reflection surface rotationally symmetrical with respect to an optical axis. The lamp front glass is obtained by deforming at least one of an incident surface and outgoing surface of a conventional lamp front glass into an aspherical lens surface rotationally symmetrical with respect to the optical axis. A light flux emitted from the center point of an illuminant is reflected by the deformed lamp reflector, and output with a uniform density through all of the outgoing surface of the lamp front lens so that the light flux is condensed at focus point.
摘要:
A lamp has a deformed lamp reflector and a lamp front glass. The deformed lamp reflector is made by deforming an ellipsoid of revolution of a conventional lamp reflector into an aspherical reflection surface rotationally symmetrical with respect to an optical axis. The lamp front glass is obtained by deforming at least one of an incident surface and outgoing surface of a conventional lamp front glass into an aspherical lens surface rotationally symmetrical with respect to the optical axis. A light flux emitted from the center point of an illuminant is reflected by the deformed lamp reflector, and output with a uniform density through all of the outgoing surface of the lamp front lens so that the light flux is condensed at focus point.
摘要:
Lengths of both sides of each end plane of a light-intensity distribution uniformizing element receiving a light flux and having an F-number of 1 are set to ½ of those of a reflecting surface of a reflecting optical-spatial modulator element, position information of uniformed light fluxes output from the light-intensity distribution uniformizing element is Fourier-transformed into diverging angle information indicated by incident light fluxes output from a first group of lenses, a relay deformed diaphragm intercepts an interference component of each incident light flux, which is expected to interfere with an outgoing light flux, to produce asymmetric light fluxes, the asymmetric light fluxes are incident on the reflecting optical-spatial modulator element, a projection lens deformed diaphragm removes stray light from outgoing light fluxes output from the reflecting optical-spatial modulator element, and an image is displayed according to the outgoing light fluxes.
摘要:
A lamp has a deformed lamp reflector and a lamp front glass. The deformed lamp reflector is formed by deforming a paraboloid of revolution of a conventional lamp reflector to an aspherical reflection surface which is rotationally symmetrical with respect to an optical axis. The lamp front glass is obtained by deforming the incident plane of a conventional lamp front glass to an aspherical lens surface rotationally symmetric with respect to the optical axis. A light flux radiated from the center point of the light source of an illuminant is reflected by the deformed lamp reflector, and is output through the lens as a parallel light flux having a circular cross section equal in area to the lens.
摘要:
An image display apparatus includes a plurality of light emission sources, a drive circuit for pulse-driving the plurality of light emission sources in order in a predetermined period, a moving reflecting mirror for swinging in order in an incidence direction of light from each of the light emission sources in response to the pulse driving timing of each of the light emission sources and reflecting light beams from the light emission sources in order approximately in the same direction, and a combining optical system for guiding the light reflected by the moving reflecting mirror into a light valve.
摘要:
Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.
摘要:
A semiconductor film production apparatus includes a reaction vessel for containing a substrate and including a gas supply port for supplying a reaction gas to the vessel, a gas discharge port for discharging the reaction gas from the vessel after reaction, and a light-transmitting glass window; a light source disposed outside the reaction vessel for irradiating a substrate in the reaction vessel through the light-transmitting glass window to heat the substrate; a cylindrical substrate holder disposed in the reaction vessel for holding the substrate with a first surface facing the light source and a second surface, opposed to the first surface, exposed to the reaction gas; a ring plate having a central opening with an area smaller than the substrate and an outside diameter dividing the reaction vessel into two compartments, the ring plate contacting the first surface of the substrate; a carrier gas supply port for introducing a carrier gas between the substrate and the light-transmitting glass window; and a reaction gas supply nozzle disposed in the substrate holder connected to said gas supply port and opposing the second surface of the substrate.
摘要:
A mold for molding a disk and a method of molding a disk substrate which can enhance flatness and thus quality of a molded product are provided. The mold for molding a disk includes a first mirror-surface disk; a stamper (29) attached to the first mirror-surface disk; a second mirror-surface disk disposed in opposition to the first mirror-surface disk and forming a cavity therebetween at the time of mold clamping; and an adjustment member having a surface allowing the stamper (29) to slide thereon, formed near an outer circumference of the first mirror-surface disk, extending radially outward, and projecting toward the cavity. Even when, during the entire disk substrate being cooled, shrinkage of the disk substrate near the outer circumference thereof is small, whereas shrinkage of the remaining portion thereof is large, an increase in thickness of the disk substrate near the outer circumference thereof can be prevented.
摘要:
The invention provides a mold for molding a disk which can uniformly cool a molded product and prevent generation of printing unevenness in a printing region of the molded product, and a molded product molded by use of the mold. The mold includes a first mold plate; a first mirror-surface disk; a second mold plate disposed to advance and retreat in relation to the first mold plate; a second mirror-surface disk forming a cavity in cooperation with the first mirror-surface disk in a mold-clamped condition; a stamper (32) attached to one of the first and second mirror-surface disks and having a fine pattern formed on a front end surface thereof; and a bush (55) extending through the other of the first and second mirror-surface disks. On a front end surface of the other mirror-surface disk, the bush (55) is disposed radially inward of a region for forming a clamp area. In this case, since the area of the front end surface of the bush (55) decreases, lowering of the performance of cooling the molded product can be prevented.
摘要:
Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.