公开(公告)号：US06825915B2

公开(公告)日：2004-11-30

申请号：US10362461

申请日：2003-02-25

申请人： Akira Yamauchi ,  Yoshiyuki Arai ,  Chisa Inaka ,  Eiji Shamoto ,  Toshimichi Moriwaki

发明人： Akira Yamauchi ,  Yoshiyuki Arai ,  Chisa Inaka ,  Eiji Shamoto ,  Toshimichi Moriwaki

IPC分类号： G03B2742

CPC分类号： H01L21/67294 ,  B23Q1/34 ,  G03F7/707 ,  G03F7/70708 ,  H01L21/67259 ,  H01L21/68

摘要： An alignment device comprising a movable table, a plurality of movable support means for movably supporting the movable table, means for reading a recognition mark, and a control means for controlling the drive of the movable support means based on information from the recognition means, wherein each movable support means comprises means having a pair of support blocks each provided to be able to contact/separate with/from the movable table and a pair of piezoelectric actuators each provided with expansible first, second and third piezoelectric elements connected to a support block and extending in each direction, and being capable of walking operation relative to the movable table by the operations of the respective piezoelectric actuators. An alignment accuracy up to a nanometer level can be attained, and the alignment device itself and therefore the entire apparatus incorporating the alignment device can be significantly reduced in thickness and size.

摘要翻译： 一种对准装置，包括可移动台，用于可移动地支撑可移动台的多个可移动支撑装置，用于读取识别标记的装置，以及用于基于来自识别装置的信息来控制可移动支撑装置的驱动的控制装置，其中 每个可移动支撑装置包括具有一对支撑块的装置，每个支撑块设置成能够与可移动工作台接触/分离;以及一对压电致动器，每个压电致动器设置有连接到支撑块的可膨胀的第一，第二和第三压电元件， 在每个方向上延伸，并且能够通过各个压电致动器的操作相对于可移动工作台行走操作。 可以达到高达纳米级的对准精度，并且对准装置本身以及因此整合对准装置的整个装置的厚度和尺寸可以显着减小。

公开(公告)号：US06821381B1

公开(公告)日：2004-11-23

申请号：US10416839

申请日：2003-05-15

申请人： Akira Yamauchi ,  Yoshiyuki Arai

发明人： Akira Yamauchi ,  Yoshiyuki Arai

IPC分类号： B30B1534

CPC分类号： B23K20/025 ,  B29C65/18 ,  B29C66/80 ,  B29C66/8122 ,  B29C66/81241 ,  B29C66/81261 ,  B29C66/81431 ,  B29C66/8181 ,  B29C66/91212 ,  B29C66/91231 ,  B29C66/91421 ,  B29K2909/02 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/14

摘要： A ceramic holder 2 is mounted on the lower end of a connecting block 30 of metal mounted on the lower end of a tool main body 1 of metal, such ceramic holder 2, a ceramic heater 4 and a ceramic presser 5 being sintered. In addition) the coefficient of linear expansion of the ceramic holder 2 is approximately equal to those of the ceramic heater 4 and ceramic presser 5; furthermore, the thermal conductivities of the ceramic holder 2 and ceramic presser 5 are greater as the pressure side of the ceramic presser 5 as seen from the ceramic heater 4 is approached and are smaller as the attaching surface side of the ceramic holder 2 is approached.

摘要翻译： 安装在金属的工具主体1的下端上的金属的连接块30的下端，陶瓷保持架2，陶瓷保持架2，陶瓷加热器4和陶瓷压板5被烧结。 此外，陶瓷保持架2的线膨胀系数大致等于陶瓷加热器4和陶瓷加压器5的线膨胀系数; 此外，陶瓷加压器5的压力侧从瓷陶瓷加热器4接近时，陶瓷保持架2和陶瓷压板5的导热率较大，并且随着陶瓷保持架2的安装面侧的接近而变小。

公开(公告)号：US06811627B2

公开(公告)日：2004-11-02

申请号：US10363693

申请日：2003-03-12

申请人： Yoshiyuki Arai ,  Akira Yamauchi

发明人： Yoshiyuki Arai ,  Akira Yamauchi

IPC分类号： B32B3100

CPC分类号： H01L21/67294 ,  H01L21/67144 ,  H01L21/67248 ,  H01L21/67259 ,  H01L24/75 ,  H05K13/089

摘要： A chip mounting device comprising a first recognition means (3) for recognizing a first recognition mark (5) on the upper chip-retainable head (2) side, a second recognition means (4) for recognizing a second recognition mark (6) on the lower substrate-retainable stage (1) side, a third recognition means (18) for recognizing the recognition marks (5, 6) concurrently when the first recognition mark (5) is brought close to or into contact with the second recognition mark (6), and a temperature detection means (17) attached to the first recognition means (3) or the second recognition means (4), wherein calibration is carried out based on the recognition of the recognition marks when the temperature detection means (17) detects a beyond-allowance temperature change, whereby permitting a high-accuracy, efficient calibration independently of mechanical deformation and temperature change in environmental atmosphere.

摘要翻译： 一种芯片安装装置，包括用于识别上部可芯片保持头部（2）侧的第一识别标记（5）的第一识别装置（3），用于识别第二识别标记（6）的第二识别装置 下基板保持级（1）侧，第三识别装置（18），用于当第一识别标记（5）靠近或接触第二识别标记时同时识别识别标记（5,6） 6），以及安装在第一识别装置（3）或第二识别装置（4）上的温度检测装置（17），其中当温度检测装置（17）基于识别标记的识别执行校准， 检测超出容限的温度变化，从而独立于环境气氛中的机械变形和温度变化，允许高精度，高效的校准。

公开(公告)号：US07341877B2

公开(公告)日：2008-03-11

申请号：US11016720

申请日：2004-12-21

申请人： Akira Yamauchi ,  Yoshiyuki Arai

发明人： Akira Yamauchi ,  Yoshiyuki Arai

IPC分类号： H01L21/66

CPC分类号： H01L21/67294 ,  H01L21/67144 ,  H01L22/20 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002 ,  H05K13/08 ,  H05K13/089 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method of accurately calibrating a movement control system of mark recognition means in a chip mounting device, comprising the steps of: recognizing a first recognition mark put on a head (2) and a second recognition mark (13) put on a stage (26) with two-field recognition means (7) so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7); and, with the head (2) lowered to position the first recognition mark closely to the second recognition mark (13), recognizing both marks with third recognition means (20) when the two-field recognition means (7) is moved back so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7).

摘要翻译： 一种在芯片安装装置中精确校准标记识别装置的移动控制系统的方法，包括以下步骤：识别放置在平台（26）上的头部（2）和第二识别标记（13）上的第一识别标记 ），用于校准和更新输入到两场识别装置（7）的运动控制系统中的先前控制参数; 并且当头部（2）降低以将第一识别标记定位到第二识别标记（13）时，当两场识别装置（7）被移回时，用第三识别装置（20）识别两个标记，以便 校准和更新输入到两场识别装置（7）的运动控制系统中的先前控制参数。

公开(公告)号：US20050104230A1

公开(公告)日：2005-05-19

申请号：US11016720

申请日：2004-12-21

申请人： Akira Yamauchi ,  Yoshiyuki Arai

发明人： Akira Yamauchi ,  Yoshiyuki Arai

IPC分类号： H01L21/00 ,  H01L21/66 ,  H01L23/544 ,  H05K13/00 ,  H05K13/08

CPC分类号： H01L21/67294 ,  H01L21/67144 ,  H01L22/20 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002 ,  H05K13/08 ,  H05K13/089 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method of accurately calibrating a movement control system of mark recognition means in a chip mounting device, comprising the steps of: recognizing a first recognition mark put on a head (2) and a second recognition mark (13) put on a stage (26) with two-field recognition means (7) so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7); and, with the head (2) lowered to position the first recognition mark closely to the second recognition mark (13), recognizing both marks with third recognition means (20) when the two-field recognition means (7) is moved back so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7).

摘要翻译： 一种在芯片安装装置中精确校准标记识别装置的移动控制系统的方法，包括以下步骤：识别放置在平台（26）上的头部（2）和第二识别标记（13）上的第一识别标记 ），用于校准和更新输入到两场识别装置（7）的运动控制系统中的先前控制参数; 并且当头部（2）降低以将第一识别标记定位到第二识别标记（13）时，当两场识别装置（7）被移回时，用第三识别装置（20）识别两个标记，以便 校准和更新输入到两场识别装置（7）的运动控制系统中的先前控制参数。

公开(公告)号：US06892447B1

公开(公告)日：2005-05-17

申请号：US10416452

申请日：2000-11-14

申请人： Akira Yamauchi ,  Yoshiyuki Arai

发明人： Akira Yamauchi ,  Yoshiyuki Arai

IPC分类号： H01L21/00 ,  H01L21/66 ,  H01L23/544 ,  H05K13/00 ,  H05K13/08 ,  H01R43/00

CPC分类号： H01L21/67294 ,  H01L21/67144 ,  H01L22/20 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/0002 ,  H05K13/08 ,  H05K13/089 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method accurately calibrating a movement control system of mark recognition in a chip mounting device, comprising the steps of: recognizing a first recognition mark put on a head (2) and a second recognition mark (13) put on a stage (26) with two-field recognition means (7) so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7); and, with the head (2) lowered to position the first recognition mark closely to the second recognition mark (13), recognizing both marks with third recognition means (20) when the two-field recognition means (7) is moved back so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7).

摘要翻译： 一种在芯片安装装置中精确校准标记识别的移动控制系统的方法，包括以下步骤：识别放置在平台（26）上的头部（2）和第二识别标记（13）上的第一识别标记， 双场识别装置（7），用于校准和更新输入到两场识别装置（7）的运动控制系统的先前控制参数; 并且当头部（2）降低以将第一识别标记定位到第二识别标记（13）时，当两场识别装置（7）被移回时，用第三识别装置（20）识别两个标记，以便 校准和更新输入到两场识别装置（7）的运动控制系统中的先前控制参数。

公开(公告)号：US11138957B2

公开(公告)日：2021-10-05

申请号：US17256538

申请日：2019-10-21

申请人： Yoshitomo Arai ,  Yoshiyuki Arai

发明人： Yoshitomo Arai ,  Yoshiyuki Arai

IPC分类号： G10D3/01 ,  G10D1/02

摘要： A main body fixing member is disclosed. The main body fixing member fixes an endpin including a shaft portion having a first end housed in a musical instrument main body and a second end stood on a floor. The shaft portion is provided with a recess. The main body fixing member includes a fitting portion, a through hole through which the shaft portion of the endpin extends, an opening disposed orthogonal to the through hole and having a bottom surface, a columnar member, a biasing portion, and a pressing portion. The columnar member is provided with a hole through which the shaft portion extends, and an engagement protrusion engaged with the recess of the shaft portion. The engagement protrusion is formed on an inner surface of the hole. The pressing portion presses the shaft portion inserted into the through hole and the hole via the columnar member.

公开(公告)号：US07138706B2

公开(公告)日：2006-11-21

申请号：US10608295

申请日：2003-06-24

申请人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Kouichi Yamauchi ,  Yasutake Yaguchi

发明人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Kouichi Yamauchi ,  Yasutake Yaguchi

IPC分类号： H01L21/44

CPC分类号： H01L21/565 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/731 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device with excellent heat dissipation characteristics that can achieve a high reliability when mounted in electronic equipment such as a cellular phone or the like and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a plurality of semiconductor chips mounted on the substrate by stacking one on top of another, and an encapsulation resin layer made of encapsulation resin. Among the plurality of semiconductor chips, a first semiconductor chip as an uppermost semiconductor chip is mounted with a surface thereof on which a circuit is formed facing toward the substrate, and the encapsulation resin layer is formed so that at least a surface of the first semiconductor chip opposite to the surface on which the circuit is formed and a part of side surfaces of the first semiconductor chip are exposed to the outside of the encapsulation resin layer.

摘要翻译： 提供具有优异的散热特性的半导体器件，其在安装在诸如蜂窝电话等的电子设备中时可以实现高可靠性及其制造方法。 半导体器件包括基板，通过在其上顶层叠一个而安装在基板上的多个半导体芯片以及由密封树脂制成的封装树脂层。 在多个半导体芯片中，作为最上半导体芯片的第一半导体芯片的表面安装有面向基板的电路，并且形成密封树脂层，使得至少第一半导体 芯片与形成电路的表面相对，并且第一半导体芯片的一部分侧表面暴露于封装树脂层的外部。

公开(公告)号：US20060091563A1

公开(公告)日：2006-05-04

申请号：US11282726

申请日：2005-11-21

申请人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Yasutake Yaguchi

发明人： Yoshiyuki Arai ,  Takashi Yui ,  Yoshiaki Takeoka ,  Fumito Itou ,  Yasutake Yaguchi

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/85399 ,  H01L2224/92125 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a substrate having electrode pads, a first semiconductor chip mounted on the substrate with a first adhesion layer interposed therebetween, a second semiconductor chip mounted on the first semiconductor chip with a second adhesion layer interposed therebetween and having electrode pads on the upper surface thereof, wires for bonding the electrode pads of the substrate and the electrode pads of the second semiconductor chip to each other, and a mold resin sealing therein the first and second semiconductor chips and the wires. The peripheral edge portion of the first adhesion layer is protruding outwardly from the first semiconductor chip and the peripheral edge portion of the second semiconductor chip is protruding outwardly beyond the peripheral edge portion of the first semiconductor chip.

公开(公告)号：US20140035322A1

公开(公告)日：2014-02-06

申请号：US13955695

申请日：2013-07-31

申请人： Nilesh Ishwardas Sakhara ,  Toru Ishizaki ,  Yoshiyuki Arai

发明人： Nilesh Ishwardas Sakhara ,  Toru Ishizaki ,  Yoshiyuki Arai

IPC分类号： B62D25/02

CPC分类号： B62D25/02 ,  B60J5/0451 ,  B60R21/0428

摘要： An impact absorbing body for attachment to a door trim is capable of bearing a collision load from an exterior panel at the time of a side collision. The impact absorbing body has a top face portion with linear edge portions and sidewall portions extending from the linear edge portions toward the door trim to provide a hollow box. The impact absorbing body also includes base portions connected to edge portions of the sidewall portions. The base portions are open toward the door trim and are attached to the door trim. The impact absorbing body also includes slits between adjacent sidewall portions, and the sidewall portions have outwardly slanted portions. In addition, rib members extend from the top face portion toward the base portion, toward the inside of the hollow box, and connect the adjacent sidewall portions.

摘要翻译： 用于附接到门饰件的冲击吸收体能够在侧面碰撞时承受来自外部面板的碰撞负载。 冲击吸收体具有顶线部分，其具有线性边缘部分和从线性边缘部分朝向门饰件延伸的侧壁部分，以提供中空盒。 冲击吸收体还包括连接到侧壁部分的边缘部分的基部。 底座部分朝向门饰件敞开，并连接到门饰板上。 冲击吸收体还包括相邻侧壁部分之间的狭缝，并且侧壁部分具有向外倾斜的部分。 此外，肋构件从顶面部朝向基部朝向中空箱的内部延伸，并且连接相邻的侧壁部。