摘要:
In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.
摘要:
In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.
摘要:
A module and a method for manufacturing a module are disclosed. An embodiment of a module comprises a first semiconductor device, a frame arranged on the first semiconductor device, the frame comprising a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
摘要:
A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
摘要:
A semiconductor device and a method of manufacturing a semiconductor device are disclosed. An embodiment comprises forming a bump on a die, the bump having a solder top, melting the solder top by pressing the solder top directly on a contact pad of a support substrate, and forming a contact between the die and the support substrate.
摘要:
A method of manufacturing a semiconductor package includes providing a carrier and attaching at least one semiconductor piece to the carrier. An encapsulant is deposited onto the at least one semiconductor piece to form an encapsulated semiconductor arrangement. The encapsulated semiconductor arrangement is then singulated in at least two semiconductor packages, wherein each package includes a semiconductor die separated from the semiconductor piece during singulation.
摘要:
A method of manufacturing a semiconductor package includes providing a carrier and attaching at least one semiconductor piece to the carrier. An encapsulant is deposited onto the at least one semiconductor piece to form an encapsulated semiconductor arrangement. The encapsulated semiconductor arrangement is then singulated in at least two semiconductor packages, wherein each package includes a semiconductor die separated from the semiconductor piece during singulation.
摘要:
A method of manufacturing a sensor module includes providing a substrate comprising a magnetically sensitive sensor element. The sensor element and the substrate are encapsulated with at least one mold material that is configured to apply a bias magnetic field to the sensor element.
摘要:
An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.
摘要:
A micro-optical module includes a housing, at least one optoelectronic component, and an optoelectronic unit assigned thereto. The housing is partly embodied as an MID body, having a cavity and having a three-dimensional conductor structure in the cavity. The MID body includes an optical channel filled with a plastic waveguide.