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公开(公告)号：US08749056B2
公开(公告)日：2014-06-10
申请号：US13116285
申请日：2011-05-26
申请人： Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
发明人： Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
IPC分类号： H01L23/34
CPC分类号： H01L23/495 , H01L23/3107 , H01L23/315 , H01L23/49548 , H01L23/49575 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/83 , H01L25/16 , H01L2223/6611 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01047 , H01L2924/01322 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
摘要翻译： 公开了一种用于制造模块的模块和方法。 模块的实施例包括第一半导体器件，布置在第一半导体器件上的框架，包括空腔的框架和布置在框架上的第二半导体器件，其中第二半导体器件密封空腔。
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公开(公告)号：US20120273935A1
公开(公告)日：2012-11-01
申请号：US13097851
申请日：2011-04-29
申请人： Stefan Martens , Tze Yang Hin , Kian Pin Queck , Kathleen Ong , Chin Wei Ronnie Tan , Beng Keh See , Ulrich Krumbein , Horst Theuss
发明人： Stefan Martens , Tze Yang Hin , Kian Pin Queck , Kathleen Ong , Chin Wei Ronnie Tan , Beng Keh See , Ulrich Krumbein , Horst Theuss
IPC分类号： H01L23/498 , H01L21/50 , H01L21/78
CPC分类号： H01L24/13 , H01L21/6836 , H01L24/11 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/11002 , H01L2224/11009 , H01L2224/11622 , H01L2224/13007 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/1312 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13181 , H01L2224/16225 , H01L2224/16245 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81455 , H01L2224/81464 , H01L2224/8182 , H01L2224/92125 , H01L2224/94 , H01L2924/07802 , H01L2924/12042 , H01L2924/15747 , H01L2924/181 , H01L2924/01047 , H01L2224/11 , H01L2924/00
摘要： A semiconductor device and a method of manufacturing a semiconductor device are disclosed. An embodiment comprises forming a bump on a die, the bump having a solder top, melting the solder top by pressing the solder top directly on a contact pad of a support substrate, and forming a contact between the die and the support substrate.
摘要翻译： 公开了半导体器件和制造半导体器件的方法。 一个实施例包括在模具上形成凸块，凸块具有焊料顶部，通过将焊料顶部直接压在支撑衬底的接触焊盘上并在模具和支撑衬底之间形成接触来熔化焊料顶部。
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公开(公告)号：US20120309130A1
公开(公告)日：2012-12-06
申请号：US13152021
申请日：2011-06-02
申请人： Tze Yang Hin , Stefan Martens , Werner Simbuerger , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
发明人： Tze Yang Hin , Stefan Martens , Werner Simbuerger , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
CPC分类号： H01L21/6836 , H01L21/568 , H01L23/3114 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68327 , H01L2221/68368 , H01L2221/68372 , H01L2224/03002 , H01L2224/03003 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16245 , H01L2224/94 , H01L2224/96 , H01L2924/07802 , H01L2924/12042 , H01L2924/1461 , H01L2924/181 , H01L2224/81 , H01L2224/81815 , H01L2924/00014 , H01L2224/81203 , H01L2224/11 , H01L2924/00
摘要： In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.
摘要翻译： 在一个实施例中，制造半导体器件的方法包括将晶片布置在载体上，所述晶片包括单片化芯片; 将分割的芯片接合到支撑晶片，并移除载体。
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公开(公告)号：US20110241190A1
公开(公告)日：2011-10-06
申请号：US12750917
申请日：2010-03-31
申请人： Klaus Elian , Beng-Keh See , Horst Theuss
发明人： Klaus Elian , Beng-Keh See , Horst Theuss
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L21/56 , H01L21/561 , H01L23/49562 , H01L23/5389 , H01L24/24 , H01L24/48 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/18 , H01L2224/32225 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/83191 , H01L2224/92244 , H01L2224/92247 , H01L2224/93 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/1461 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing a semiconductor package includes providing a carrier and attaching at least one semiconductor piece to the carrier. An encapsulant is deposited onto the at least one semiconductor piece to form an encapsulated semiconductor arrangement. The encapsulated semiconductor arrangement is then singulated in at least two semiconductor packages, wherein each package includes a semiconductor die separated from the semiconductor piece during singulation.
摘要翻译： 制造半导体封装的方法包括提供载体并将至少一个半导体片附接到载体上。 密封剂沉积在至少一个半导体部件上以形成封装的半导体装置。 封装的半导体布置然后在至少两个半导体封装中被分割，其中每个封装包括在分割期间与半导体块分离的半导体管芯。
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公开(公告)号：US20120299170A1
公开(公告)日：2012-11-29
申请号：US13116285
申请日：2011-05-26
申请人： Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
发明人： Daniel Kehrer , Stefan Martens , Tze Yang Hin , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/495 , H01L23/3107 , H01L23/315 , H01L23/49548 , H01L23/49575 , H01L23/66 , H01L24/45 , H01L24/48 , H01L24/83 , H01L25/16 , H01L2223/6611 , H01L2224/16145 , H01L2224/16245 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01047 , H01L2924/01322 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A module and a method for manufacturing a module are disclosed. An embodiment of a module comprises a first semiconductor device, a frame arranged on the first semiconductor device, the frame comprising a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity.
摘要翻译： 公开了一种用于制造模块的模块和方法。 模块的实施例包括第一半导体器件，布置在第一半导体器件上的框架，框架包括空腔，以及布置在框架上的第二半导体器件，其中第二半导体器件密封空腔。
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公开(公告)号：US08053280B2
公开(公告)日：2011-11-08
申请号：US12234192
申请日：2008-09-19
申请人： Chau Fatt Chiang , Chwee Lan Lai , Beng Keh See
发明人： Chau Fatt Chiang , Chwee Lan Lai , Beng Keh See
CPC分类号： H01L24/97 , H01L21/4842 , H01L21/561 , H01L21/6835 , H01L23/3107 , H01L23/544 , H01L24/27 , H01L24/48 , H01L24/85 , H01L24/94 , H01L2221/68327 , H01L2221/68331 , H01L2221/68377 , H01L2223/54486 , H01L2224/274 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/85001 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/10253 , H01L2924/10329 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/1815 , H01L2924/19042 , H01L2224/85 , H01L2224/78 , H01L2924/00 , H01L2924/01031 , H01L2924/3512 , H01L2224/45099 , H01L2924/00012
摘要： A method for producing multiple semiconductor devices. An electrically conductive layer is applied onto a semiconductor wafer. The semiconductor wafer is structured to produce multiple semiconductor chips. The electrically conductive layer is structured to produce multiple semiconductor devices.
摘要翻译： 一种用于制造多个半导体器件的方法。 将导电层施加到半导体晶片上。 半导体晶片被构造成产生多个半导体芯片。 导电层被构造成产生多个半导体器件。
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公开(公告)号：US20090134512A1
公开(公告)日：2009-05-28
申请号：US12234192
申请日：2008-09-19
申请人： Chau Fatt Chiang , Chwee Lan Lai , Beng Keh See
发明人： Chau Fatt Chiang , Chwee Lan Lai , Beng Keh See
CPC分类号： H01L24/97 , H01L21/4842 , H01L21/561 , H01L21/6835 , H01L23/3107 , H01L23/544 , H01L24/27 , H01L24/48 , H01L24/85 , H01L24/94 , H01L2221/68327 , H01L2221/68331 , H01L2221/68377 , H01L2223/54486 , H01L2224/274 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/85001 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/10253 , H01L2924/10329 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/1815 , H01L2924/19042 , H01L2224/85 , H01L2224/78 , H01L2924/00 , H01L2924/01031 , H01L2924/3512 , H01L2224/45099 , H01L2924/00012
摘要： A method for producing multiple semiconductor devices. An electrically conductive layer is applied onto a semiconductor wafer. The semiconductor wafer is structured to produce multiple semiconductor chips. The electrically conductive layer is structured to produce multiple semiconductor devices.
摘要翻译： 一种用于制造多个半导体器件的方法。 将导电层施加到半导体晶片上。 半导体晶片被构造成产生多个半导体芯片。 导电层被构造成产生多个半导体器件。
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公开(公告)号：US08722462B2
公开(公告)日：2014-05-13
申请号：US12750917
申请日：2010-03-31
申请人： Klaus Elian , Beng-Keh See , Horst Theuss
发明人： Klaus Elian , Beng-Keh See , Horst Theuss
IPC分类号： H01L21/00
CPC分类号： H01L21/56 , H01L21/561 , H01L23/49562 , H01L23/5389 , H01L24/24 , H01L24/48 , H01L24/82 , H01L24/97 , H01L2224/04105 , H01L2224/18 , H01L2224/32225 , H01L2224/32245 , H01L2224/45014 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/73267 , H01L2224/76155 , H01L2224/82102 , H01L2224/83191 , H01L2224/92244 , H01L2224/92247 , H01L2224/93 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12041 , H01L2924/1461 , H01L2924/181 , H01L2224/83 , H01L2224/85 , H01L2224/82 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacturing a semiconductor package includes providing a carrier and attaching at least one semiconductor piece to the carrier. An encapsulant is deposited onto the at least one semiconductor piece to form an encapsulated semiconductor arrangement. The encapsulated semiconductor arrangement is then singulated in at least two semiconductor packages, wherein each package includes a semiconductor die separated from the semiconductor piece during singulation.
摘要翻译： 制造半导体封装的方法包括提供载体并将至少一个半导体片附接到载体上。 密封剂沉积在至少一个半导体部件上以形成封装的半导体装置。 封装的半导体布置然后在至少两个半导体封装中被分割，其中每个封装包括在分割期间与半导体块分离的半导体管芯。
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公开(公告)号：US08535983B2
公开(公告)日：2013-09-17
申请号：US13152021
申请日：2011-06-02
申请人： Tze Yang Hin , Stefan Martens , Werner Simbuerger , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
发明人： Tze Yang Hin , Stefan Martens , Werner Simbuerger , Helmut Wietschorke , Horst Theuss , Beng Keh See , Ulrich Krumbein
IPC分类号： H01L21/56
CPC分类号： H01L21/6836 , H01L21/568 , H01L23/3114 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68327 , H01L2221/68368 , H01L2221/68372 , H01L2224/03002 , H01L2224/03003 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/16245 , H01L2224/94 , H01L2224/96 , H01L2924/07802 , H01L2924/12042 , H01L2924/1461 , H01L2924/181 , H01L2224/81 , H01L2224/81815 , H01L2924/00014 , H01L2224/81203 , H01L2224/11 , H01L2924/00
摘要： In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier.
摘要翻译： 在一个实施例中，制造半导体器件的方法包括将晶片布置在载体上，所述晶片包括单片化芯片; 将分割的芯片接合到支撑晶片，并移除载体。
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