摘要:
The present invention provides a method (100) of designing a circuit. The method comprises specifying (105) a design parameter for memory transistors and logic transistors and selecting (110) a test retention-mode bias voltage for the memory transistors. The method further comprises determining (115) a first relationship of a retention-mode leakage current and the design parameter at the test retention-mode bias voltage and obtaining (120) a second relationship of an active-mode drive current and the design parameter. The first and second relationships are used (125) to assess whether there is a range of values of the design parameter where the retention-mode leakage current and the active-mode drive current are within a predefined circuit specification. The method also includes adjusting (130) the test retention-mode bias voltage and repeating the determining and the using if the retention-mode total leakage current or the active-mode drive current is outside of the predefined circuit specification.
摘要:
An integrated circuit having an SRAM cell includes a pair of cross-coupled inverters with first driver and load transistors connected to provide a first storage node and second driver and load transistors connected to provide a second storage node. The SRAM cell also includes first and second pass gate transistors controlled by at least one word line and respectively connected between a first bit line and the first storage node and a second bit line and the second storage node; wherein a first driver transistor threshold voltage is different than a second driver transistor threshold voltage and one of the first and second driver threshold voltages is different than a pass gate transistor threshold voltage. Alternately, a threshold voltage of the first and second driver transistors is different than a symmetrical pass gate transistor threshold voltage. Additionally, methods of manufacturing an integrated circuit having an SRAM cell are provided.
摘要:
An integrated circuit having an SRAM cell includes a pair of cross-coupled inverters with first driver and load transistors connected to provide a first storage node and second driver and load transistors connected to provide a second storage node. The SRAM cell also includes first and second pass gate transistors controlled by at least one word line and respectively connected between a first bit line and the first storage node and a second bit line and the second storage node; wherein a first driver transistor threshold voltage is different than a second driver transistor threshold voltage and one of the first and second driver threshold voltages is different than a pass gate transistor threshold voltage. Alternately, a threshold voltage of the first and second driver transistors is different than a symmetrical pass gate transistor threshold voltage. Additionally, methods of manufacturing an integrated circuit having an SRAM cell are provided.
摘要:
An asymmetrical channel implant from source to drain improves short channel characteristics. The implant provides a relatively high VT net dopant adjacent to the source region and a relatively low VT net dopant in the remainder of the channel region. One way to achieve this arrangement with disposable gate processing is to add disposable sidewalls inside the gate opening (after removing the disposable gate), patterning to selectively remove the source or gate side sidewalls, implant the source and drain regions and remove the remaining sidewall and the proceed. According to a second embodiment, wherein the channel implant can be symmetrical, a relatively low net VT implant is provided in the central region of the channel and a relatively high net VT implant is provided in the channel regions adjacent to the source and drain regions.
摘要:
An asymmetrical channel implant from source to drain improves short channel characteristics. The implant provides a relatively high VT net dopant adjacent to the source region and a relatively low VT net dopant in the remainder of the channel region. One way to achieve this arrangement with disposable gate processing is to add disposable sidewalls inside the gate opening (after removing the disposable gate), patterning to selectively remove the source or gate side sidewalls, implant the source and drain regions and remove the remaining sidewall and the proceed. According to a second embodiment, wherein the channel implant can be symmetrical, a relatively low net VT implant is provided in the central region of the channel and a relatively high net VT implant is provided in the channel regions adjacent to the source and drain regions.
摘要:
A technique of producing a semiconductor device or integrated circuit produces a planarized refill layer which has a more uniform thickness after polishing, such as by chemical-mechanical polishing (CMP). Dummy active areas are inserted between active areas in that portion of the substrate which would normally be occupied by a field oxide in order to reduce to "dishing" that occurs during CMP in these areas. The dummy active areas can take the shape of a large block, a partially or completely formed ring structure or a plurality of pillars the area density of which can be adjusted to match the area density of the active areas in that region of the substrate. The design rule for the pillars can be such that no pillars are placed where polycrystalline silicon lines or first level metallization lines are to be placed in order to avoid parasitic capacitances.
摘要:
An SRAM array with a dummy cell row structure in which the SRAM array is divided into segments isolated by a row pattern of dummy cells. The dummy cell structure provides a continuous cell array at the lower cell patterning levels. The SRAM array includes a first and second array block each including an SRAM cell having a first layout configuration, one or more of the dummy cells having a second layout configuration arranged along the row pattern associated with a wordline of the SRAM array, a first power supply voltage line connected to the first array block, and a second different power supply voltage line connected to the second array block. The first and second power supply voltage lines of the array blocks are further connected to the one or more dummy cells.
摘要:
A body bias coordinator is provided for use with a transistor employing a body region. In one example, the body bias coordinator includes a control unit configured to control the transistor and make it operable to provide a virtual supply voltage from a source voltage during activation of the transistor. The body bias coordinator also includes a connection unit coupled to the control unit and configured to connect the body region to the virtual supply voltage during activation of the transistor. In an alternative embodiment, the connection unit is further configured to connect the body region to another voltage during non-activation of the transistor.
摘要:
A process of performing an SRAM single sided write operation including applying a positive bias increment to an isolated p-well containing a passgate in an addressed SRAM cell. A process of performing an SRAM single sided read operation including applying a negative bias increment to an isolated p-well containing a driver in an addressed SRAM cell. A process of performing an SRAM double sided write operation including applying a positive bias increment to an isolated p-well containing a passgate connected to a low data line in an addressed SRAM cell. A process of performing an SRAM double sided read operation including applying a negative bias increment to an isolated p-well containing a bit driver and applying a negative bias increment to an isolated p-well containing a bit-bar driver in an addressed SRAM cell.
摘要:
An integrated circuit containing logic transistors and an array of SRAM cells in which the logic transistors are formed in semiconductor material with one crystal orientation and the SRAM cells are formed in a second semiconductor layer with another crystal orientation. A process of forming an integrated circuit containing logic transistors and an array of SRAM cells in which the logic transistors are formed in a top semiconductor layer with one crystal orientation and the SRAM cells are formed in an epitaxial semiconductor layer with another crystal orientation. A process of forming an integrated circuit containing logic transistors and an array of SRAM cells in which the SRAM cells are formed in a top semiconductor layer with one crystal orientation and the logic transistors are formed in an epitaxial semiconductor layer with another crystal orientation.