公开(公告)号：US09670445B1

公开(公告)日：2017-06-06

申请号：US13793541

申请日：2013-03-11

申请人： Amkor Technology, Inc.

发明人： Bob Shih-Wei Kuo ,  Russell Scott Shumway

IPC分类号： B01L3/00 ,  C12M1/40 ,  H05K3/10

CPC分类号： B01L3/502707 ,  B01L3/502715 ,  B01L7/52 ,  B01L2300/0636 ,  B01L2300/0645 ,  B01L2400/0406 ,  G01N29/00 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/1815 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/13099

摘要： A microfluidics sensor package includes a microfluidics sensor die having an active surface, bond pads on the active surface, and an active area on the active surface. A standoff pattern is formed on the active surface to extend to a precise height above the active surface. A lid is mounted to the standoff pattern by a lid adhesive. By using the standoff pattern to precisely space the lid above the active surface, a microfluidics cavity between the lid and the active surface is precisely created allowing for precise control of fluid flowing through the microfluidics cavity. By precisely controlling the flow of fluid through the microfluidics cavity, accurate results, e.g., of the laboratory functions performed on the fluid, are provided.

公开(公告)号：US09776855B2

公开(公告)日：2017-10-03

申请号：US15174911

申请日：2016-06-06

申请人： Amkor Technology, Inc.

发明人： David Bolognia ,  Bob Shih-Wei Kuo ,  Bud Troche

IPC分类号： H01L23/00 ,  H01L23/552 ,  B81B7/00 ,  H01L25/16

CPC分类号： B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/095 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.

公开(公告)号：US09758372B1

公开(公告)日：2017-09-12

申请号：US13766171

申请日：2013-02-13

申请人： Amkor Technology, Inc.

发明人： Bob Shih-Wei Kuo ,  Shaun Michael Bowers ,  Russell Scott Shumway

IPC分类号： H01L23/02 ,  H01L23/34 ,  H01L23/04 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00333 ,  B81B7/0077 ,  B81B2201/042 ,  B81B2207/012 ,  B81C1/00825 ,  B81C2201/05 ,  B81C2203/0118 ,  G02B26/0833 ,  H01L2224/16225 ,  H01L2924/15151

摘要： A method includes mounting a window substrate to a carrier tape. The window substrate has a window extending between an upper surface of the window substrate and a lower surface of the window substrate, the carrier tape sealing the window at the lower surface. Bond pads on an active surface of a MEMS die are flip chip mounted to terminals on the upper surface of the window substrate, a MEMS active area of the MEMS die being aligned with the window of the window substrate. A magnet is mounted to an inactive surface of the MEMS die.

公开(公告)号：US20160355395A1

公开(公告)日：2016-12-08

申请号：US15174911

申请日：2016-06-06

申请人： Amkor Technology, Inc.

发明人： David Bolognia ,  Bob Shih-Wei Kuo ,  Bud Troche

IPC分类号： B81B7/00 ,  H01L23/00 ,  H01L23/552

CPC分类号： B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/095 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A semiconductor device has a base substrate having a plurality of metal traces and a plurality of base vias. An opening is formed through the base substrate. At least one die is attached to the first surface of the substrate and positioned over the opening. A cover substrate has a plurality of metal traces. A cavity in the cover substrate forms side wall sections around the cavity. The cover substrate is attached to the base substrate so the at least one die is positioned in the interior of the cavity. Ground planes in the base substrate are coupled to ground planes in the cover substrate to form an RF shield around the at least one die.

摘要翻译： 半导体器件具有具有多个金属迹线和多个基极通孔的基底基板。 通过基底基板形成开口。 至少一个模具附接到基板的第一表面并且定位在开口上方。 盖基板具有多个金属迹线。 盖衬底中的空腔形成围绕腔的侧壁部分。 覆盖基板被附接到基底基底，使得至少一个管芯位于空腔的内部。 基底衬底中的接地平面耦合到覆盖衬底中的接地平面，以在至少一个管芯周围形成RF屏蔽。

公开(公告)号：US10327076B1

公开(公告)日：2019-06-18

申请号：US15214567

申请日：2016-07-20

申请人： Amkor Technology, Inc.

发明人： Ahmer Raza Syed ,  Bob Shih-Wei Kuo ,  Louis B. Troche, Jr.

IPC分类号： B81B7/00 ,  B81C1/00 ,  H04R1/28 ,  H04R19/04

摘要： A top port MEMS microphone package includes a substrate having a back volume expanding aperture therein. A MEMS microphone electronic component is mounted to the substrate directly above the back volume expanding aperture such that an aperture of the MEMS microphone electronic component is in fluid communication with the back volume expanding aperture. A lid having a lid cavity is mounted to the substrate. The back volume expanding aperture couples the aperture of the MEMS microphone electronic component to the lid cavity. By coupling the lid cavity to the aperture with the back volume expanding aperture, the resulting back volume is essentially the size of the entire top port MEMS microphone package. In this manner, the noise to signal ratio is minimized thus maximizing the sensitivity of the top port MEMS microphone package as well as the range of applications.

公开(公告)号：US09359191B2

公开(公告)日：2016-06-07

申请号：US14659693

申请日：2015-03-17

申请人： Amkor Technology, Inc.

发明人： David Bolognia ,  Bob Shih-Wei Kuo ,  Bud Troche

IPC分类号： H01L23/10 ,  H01L23/34 ,  B81B7/00 ,  H01L23/552 ,  H01L23/00 ,  H01L25/16

CPC分类号： B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/095 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Methods and systems for a reversible top/bottom MEMS package may comprise a base substrate comprising metal traces, an opening through the base substrate, a die coupled to a first surface of the substrate and positioned over the opening, a frame member coupled to the first surface of the substrate wherein the die is positioned interior of the frame member, a cover substrate coupled to the frame member, and conductive plating on the frame member that electrically couples the base substrate to the cover substrate, wherein the conductive plating is exposed. The conductive plating may couple a ground plane in the base substrate to a ground plane in the cover substrate. The conductive plating may be exposed at an outer surface of the frame member and/or at an inner perimeter of the frame member. Conductive vias within the frame member may be coupled to the metal traces in the base substrate.

摘要翻译： 用于可逆的顶部/底部MEMS封装的方法和系统可以包括基底衬底，其包括金属迹线，通过基底衬底的开口，与衬底的第一表面连接并定位在开口上的模具，耦合到第一 基板的表面，其中模具位于框架构件的内部，连接到框架构件的盖基板和在框架构件上的导电电镀，其将基底基板电耦合到盖基板，其中导电电镀被暴露。 导电电镀可以将基底衬底中的接地平面耦合到覆盖衬底中的接地平面。 导电电镀可以在框架构件的外表面和/或在框架构件的内周边处露出。 框架构件内的导电孔可以连接到基底衬底中的金属迹线。

公开(公告)号：US09162871B1

公开(公告)日：2015-10-20

申请号：US13969052

申请日：2013-08-16

申请人： Amkor Technology, Inc.

发明人： Bob Shih-Wei Kuo ,  Russell Shumway ,  Louis B. Troche, Jr.

IPC分类号： H01L29/84 ,  B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0032 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/0074 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/09 ,  B81C1/00261 ,  B81C1/00269 ,  B81C2203/01 ,  B81C2203/0109 ,  B81C2203/0154 ,  B81C2203/0163 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/16151 ,  H01L2924/16152 ,  H01L2924/00

摘要： A metal mesh lid MEMS package includes a substrate, a MEMS electronic component coupled to the substrate, and a metal mesh lid coupled to the substrate with a lid adhesive. The metal mesh lid includes a polymeric lid body having a top port formed therein and a metal mesh cap coupled to the lid body. The metal mesh cap covers the top port and serves as both a particulate filter and a continuous conductive shield for EMI/RF interferences. Further, the metal mesh cap provides a locking feature for the lid adhesive to maximize the attach strength of the metal mesh lid to the substrate.

摘要翻译： 金属网盖MEMS封装包括衬底，耦合到衬底的MEMS电子部件和用盖粘合剂耦合到衬底的金属网盖。 金属网盖包括聚合物盖体，其具有形成在其中的顶部端口和联接到盖体的金属网罩。 金属网罩覆盖顶部端口，既用于颗粒过滤器又可用于EMI / RF干扰的连续导电屏蔽。 此外，金属网盖为盖粘合剂提供了锁定特征，以最大化金属网盖对基底的附着强度。

公开(公告)号：US20150191346A1

公开(公告)日：2015-07-09

申请号：US14659693

申请日：2015-03-17

申请人： Amkor Technology, Inc.

发明人： David Bolognia ,  Bob Shih-Wei Kuo ,  Bud Troche

IPC分类号： B81B7/00

CPC分类号： B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/095 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

摘要： Methods and systems for a reversible top/bottom MEMS package may comprise a base substrate comprising metal traces, an opening through the base substrate, a die coupled to a first surface of the substrate and positioned over the opening, a frame member coupled to the first surface of the substrate wherein the die is positioned interior of the frame member, a cover substrate coupled to the frame member, and conductive plating on the frame member that electrically couples the base substrate to the cover substrate, wherein the conductive plating is exposed. The conductive plating may couple a ground plane in the base substrate to a ground plane in the cover substrate. The conductive plating may be exposed at an outer surface of the frame member and/or at an inner perimeter of the frame member. Conductive vias within the frame member may be coupled to the metal traces in the base substrate.

摘要翻译： 用于可逆的顶部/底部MEMS封装的方法和系统可以包括基底衬底，其包括金属迹线，通过基底衬底的开口，与衬底的第一表面连接并定位在开口上的模具，耦合到第一 基板的表面，其中模具位于框架构件的内部，连接到框架构件的盖基板和在框架构件上的导电电镀，其将基底基板电耦合到盖基板，其中导电电镀被暴露。 导电电镀可以将基底衬底中的接地平面耦合到覆盖衬底中的接地平面。 导电电镀可以在框架构件的外表面和/或在框架构件的内周边处露出。 框架构件内的导电孔可以连接到基底衬底中的金属迹线。