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1.发明申请Antenna Array for Transmission/Reception Device for Signals with a Wavelength of the Microwave, Millimeter or Terahertz Type 有权用于具有微波，毫米波或太赫兹波长的信号的发射/接收装置的天线阵列公开(公告)号：US20120086608A1
公开(公告)日：2012-04-12
申请号：US13242591
申请日：2011-09-23
申请人： Andreia Cathelin , Mathieu Egot , Romain Pilard , Daniel Gloria
发明人： Andreia Cathelin , Mathieu Egot , Romain Pilard , Daniel Gloria
CPC分类号： H01Q21/061 , H01Q3/24 , H01Q3/34 , H01Q21/293
摘要： Transmission/reception device for signals having a wavelength of the microwaves, millimeter or terahertz type, comprising an antenna array. The antenna array comprises a first group of first omni-directional antennas and a second group of second directional antennas disposed around the first group of antennas.
摘要翻译： 具有微波，毫米波或太赫兹波长的信号的发射/接收装置，包括天线阵列。 天线阵列包括第一组第一全向天线和围绕第一组天线布置的第二组第二定向天线。
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2.发明授权Antenna array for transmission/reception device for signals with a wavelength of the microwave, millimeter or terahertz type 有权用于具有微波，毫米波或太赫兹波长的信号的发射/接收装置的天线阵列公开(公告)号：US08860628B2
公开(公告)日：2014-10-14
申请号：US13242591
申请日：2011-09-23
申请人： Andreia Cathelin , Mathieu Egot , Romain Pilard , Daniel Gloria
发明人： Andreia Cathelin , Mathieu Egot , Romain Pilard , Daniel Gloria
CPC分类号： H01Q21/061 , H01Q3/24 , H01Q3/34 , H01Q21/293
摘要： Transmission/reception device for signals having a wavelength of the microwaves, millimeter or terahertz type, comprising an antenna array. The antenna array comprises a first group of first omni-directional antennas and a second group of second directional antennas disposed around the first group of antennas.
摘要翻译： 具有微波，毫米波或太赫兹波长的信号的发射/接收装置，包括天线阵列。 天线阵列包括第一组第一全向天线和围绕第一组天线布置的第二组第二定向天线。
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公开(公告)号：US20110084398A1
公开(公告)日：2011-04-14
申请号：US12896558
申请日：2010-10-01
IPC分类号： H01L23/48
摘要： A semiconductor device includes a substrate. On at least one face of that substrate, integrated circuits are formed. At least one electromagnetic waveguide is also included, that waveguide including two metal plates that are placed on either side of at least one part of the thickness of the substrate and are located facing each other. Two longitudinal walls are placed facing each other and are formed by metal vias made in holes passing through the substrate in its thickness direction. The metal vias electrically connect the two metal plates.
摘要翻译： 半导体器件包括衬底。 在该基板的至少一个面上形成集成电路。 还包括至少一个电磁波导，该波导包括两个金属板，这两个金属板被放置在基板厚度的至少一部分的任一侧上并且彼此相对定位。 两个纵向壁彼此相对地放置并且由在其厚度方向上穿过基板的孔中形成的金属通孔形成。 金属通孔电连接两个金属板。
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公开(公告)号：US08581412B2
公开(公告)日：2013-11-12
申请号：US12896558
申请日：2010-10-01
IPC分类号： H01L23/48
摘要： A semiconductor device includes a substrate. On at least one face of that substrate, integrated circuits are formed. At least one electromagnetic waveguide is also included, that waveguide including two metal plates that are placed on either side of at least one part of the thickness of the substrate and are located facing each other. Two longitudinal walls are placed facing each other and are formed by metal vias made in holes passing through the substrate in its thickness direction. The metal vias electrically connect the two metal plates.
摘要翻译： 半导体器件包括衬底。 在该基板的至少一个面上形成集成电路。 还包括至少一个电磁波导，该波导包括两个金属板，这两个金属板被放置在基板厚度的至少一部分的任一侧上并且彼此相对定位。 两个纵向壁彼此相对地放置并且由在其厚度方向上穿过基板的孔中形成的金属通孔形成。 金属通孔电连接两个金属板。
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5.发明申请ELECTRONIC DEVICE COMPRISING A SEMICONDUCTOR COMPONENT INTEGRATING AN ANTENNA 审中-公开包含天线集成的半导体元件的电子器件公开(公告)号：US20110109521A1
公开(公告)日：2011-05-12
申请号：US12941292
申请日：2010-11-08
IPC分类号： H01Q1/48
CPC分类号： G06K19/07749 , G06K19/07771 , H01L23/481 , H01L23/66 , H01L2223/6616 , H01L2223/6677 , H01L2224/13025 , H01L2224/131 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2924/014
摘要： An electronic device includes a semiconductor component having a support substrate in the form of a wafer. On one side of this substrate integrated circuits including an RF circuit and an antenna connected to this RF circuit are formed. A metal layer is situated on the other side of the substrate, facing the antenna. At least on metal via is provided in a through-hole in the substrate, this via being connected at one end to the metal layer and at the other end to the RF circuit, at the same reference potential node as the antenna.
摘要翻译： 电子器件包括具有晶片形式的支撑衬底的半导体部件。 在该衬底的一侧形成包括RF电路和连接到该RF电路的天线的集成电路。 金属层位于基板的另一侧，面向天线。 至少在金属通孔中设置在基板的通孔中，该通孔在一端与金属层连接，另一端连接到与RF天线相同的参考电位节点。
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6.发明授权公开(公告)号：US07876283B2
公开(公告)日：2011-01-25
申请号：US11640108
申请日：2006-12-14
CPC分类号： H01Q9/44 , H01Q1/38 , H01Q9/0485
摘要： An antenna is formed with a self-supporting structure (1), a dielectric structure (2), and a conducting structure (3), each structure being formed from at least one structural element (10; 21, 22; 31-34). The structural elements of the different structures (1, 2, 3) constitute a stack in which these elements (10; 21, 22; 31-34) are connected to each other, and the dielectric structure (2) is formed in the stack by nano-imprinting.
摘要翻译： 天线形成有自支撑结构（1），电介质结构（2）和导电结构（3），每个结构由至少一个结构元件（10; 21,22; 31-34）形成， 。 不同结构（1,2,3）的结构元件构成了这些元件（10; 21,22; 31-34）彼此连接的叠层，并且电介质结构（2）形成在堆叠 通过纳米压印。
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7.发明授权Multilayer semiconductor device for transmitting microwave signals and associated methods 有权用于传输微波信号和相关方法的多层半导体器件公开(公告)号：US06876076B2
公开(公告)日：2005-04-05
申请号：US10184027
申请日：2002-06-27
申请人： Daniel Gloria , André Perrotin
发明人： Daniel Gloria , André Perrotin
IPC分类号： H01L23/528 , H01L23/66 , H01L23/34
CPC分类号： H01L23/66 , H01L23/5283 , H01L2223/6622 , H01L2924/0002 , H01L2924/00
摘要： A multilayer semiconductor device includes at least one structure for transmitting electrical signals, and in particular, microwave signals. The device includes at least one electrically conductive enclosure that includes a bottom plate and a top plate in two different layers. Lateral walls connect the bottom and top plates. Electrically conductive connecting strips extend into the enclosure and are in an intermediate layer, and are electrically insulated from the enclosure. The enclosure has at least one passage through which extends electrical connections of the connecting strips, which are also electrically insulated from the enclosure.
摘要翻译： 多层半导体器件包括用于传输电信号，特别是微波信号的至少一种结构。 该装置包括至少一个导电外壳，其包括底板和两个不同层中的顶板。 侧壁连接底板和顶板。 导电连接条延伸到外壳中并处于中间层，并与外壳电绝缘。 外壳具有至少一个通道，通过该通道延伸连接条的电连接，其也与外壳电绝缘。
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公开(公告)号：US09006851B2
公开(公告)日：2015-04-14
申请号：US13198458
申请日：2011-08-04
IPC分类号： H01L31/0203 , H01L25/16 , H01L31/0224 , H01L21/768 , H01L23/48 , H01L25/065
CPC分类号： H01L25/16 , H01L21/76838 , H01L23/481 , H01L25/0652 , H01L31/02245 , H01L2223/6677 , H01L2224/16145 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/15192 , Y02E10/50 , H01L2224/81
摘要： A stand-alone device comprising a silicon wafer having its front surface including a first layer of a first conductivity type and a second layer of a second conductivity type forming a photovoltaic cell; first vias crossing the wafer from the rear surface of the first layer and second vias crossing the wafer from the rear surface of the second layer; metallization levels on the rear surface of the wafer, the external level of these metallization levels defining contact pads; an antenna formed in one of the metallization levels; and one or several chips assembled on said pads; the metallization levels being shaped to provide selected interconnects between the different elements of the device.
摘要翻译： 一种独立装置，包括具有其前表面的硅晶片，该硅晶片包括形成光伏电池的第一导电类型的第一层和第二导电类型的第二层; 从第一层的后表面穿过晶片的第一通孔和从第二层的后表面穿过晶片的第二过孔; 在晶片的后表面上的金属化水平，这些金属化水平的外部水平限定接触垫; 形成在金属化层之一中的天线; 以及组装在所述垫上的一个或多个芯片; 金属化水平被成形为在装置的不同元件之间提供选定的互连。
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公开(公告)号：US07180450B2
公开(公告)日：2007-02-20
申请号：US11071596
申请日：2005-03-03
CPC分类号： H01Q1/48 , H01Q1/526 , H01Q7/00 , H01Q9/065 , H01Q13/106
摘要： A semiconductor device includes a substrate, for example made of silicon, and layers, deposited on this substrate. Within at least one of these layers a radio signal transmission/reception antenna is formed. Located between the antenna and the substrate, a screen for collecting induced currents between this antenna and this substrate is formed within at least one of the layers. The screen includes at least one main branch connected to a fixed potential, for example a ground reference, and a plurality of secondary branches connected to the main branch at one of their extremities. The collector screen accordingly presents a tree-like structure.
摘要翻译： 半导体器件包括例如由硅制成的衬底和沉积在该衬底上的层。 在这些层中的至少一个层内形成无线电信号发送/接收天线。 位于天线和基板之间，在至少一个层内形成用于收集该天线与该基板之间的感应电流的屏幕。 屏幕包括连接到固定电位的至少一个主分支，例如接地参考，以及在其四肢之一连接到主分支的多个次级分支。 收集器屏幕因此呈现出树状结构。
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公开(公告)号：US08963559B2
公开(公告)日：2015-02-24
申请号：US13601904
申请日：2012-08-31
CPC分类号： H03F3/193 , G01R31/2626 , H03F1/565 , H03F3/601 , H03F2200/294 , H03F2200/378 , H03F2200/381 , H03F2200/387 , H03F2200/423
摘要： A variable impedance device includes a passive tuner that includes at least one variable component, which is controllable to apply a variable impedance value to an input signal of the passive tuner. A low noise amplifier is configured to supply the input signal to the passive tuner by amplifying an input RF (radio frequency) signal.
摘要翻译： 可变阻抗装置包括无源调谐器，其包括至少一个可变分量，可变分量可控制以将可变阻抗值施加到无源调谐器的输入信号。 低噪声放大器被配置为通过放大输入RF（射频）信号将输入信号提供给无源调谐器。
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