公开(公告)号：US20080289664A1

公开(公告)日：2008-11-27

申请号：US12119878

申请日：2008-05-13

申请人： Anthony L. Rockwell ,  Phil Johnson ,  Clint Frysinger ,  Albert W. Chan

发明人： Anthony L. Rockwell ,  Phil Johnson ,  Clint Frysinger ,  Albert W. Chan

IPC分类号： B08B7/00 ,  A47L15/42

CPC分类号： B08B17/00 ,  A47L15/4209 ,  A47L15/421 ,  A47L15/4212 ,  A47L15/4251 ,  A47L15/4274 ,  A47L2401/09 ,  A47L2501/32

摘要： A dishwasher for receiving and cleansing soiled kitchenware includes a tub defining a washing chamber, a movable door for selectively exposing the washing chamber, and a modular, slidably mounted drip pan and component mounting assembly or base member positioned below the tub. One or more of a plurality of wash system components, including a wash pump, an inlet valve and a drain valve, is mounted to the modular base member. The modular base member includes connection points for household utilities, a peripheral lip or rim so as to contain any liquid that may fall from the dishwasher tub and a float and cut-off system that serves to terminate operation of the dishwasher upon detecting a water leak. In addition, the modular base member may also contain a system for heating washing fluid to a desired temperature, along with related control components.

摘要翻译： 用于接收和清洁污染的厨具的洗碗机包括限定洗涤室的桶，用于选择性地暴露洗涤室的可移动门，以及定位在桶下方的模块化的，可滑动地安装的滴水盘和部件安装组件或基座构件。 多个洗涤系统组件中的一个或多个，包括洗涤泵，入口阀和排水阀，被安装到模块化底座部件上。 模块化底座部件包括用于家用电器的连接点，周缘唇缘或边缘，以便容纳可能从洗碗机桶中掉落的任何液体以及用于在检测到漏水时终止洗碗机操作的浮子和切断系统 。 此外，模块化底座部件还可以包含用于将洗涤流体加热到期望温度的系统以及相关的控制部件。

公开(公告)号：US6047637A

公开(公告)日：2000-04-11

申请号：US335389

申请日：1999-06-17

申请人： Albert W. Chan ,  Michael G. Lee

发明人： Albert W. Chan ,  Michael G. Lee

IPC分类号： B41M1/12 ,  H05K3/12 ,  H05K3/34

CPC分类号： H05K3/3484 ,  B41M1/12 ,  H05K2201/0989 ,  H05K2203/0577 ,  H05K3/1216 ,  H05K3/3452

摘要： A method for depositing a solder paste or other conductive or non-conductive material on a contact pad or other designated region of a substrate. A layer of resist is applied over the boundary of a region in which a bump of a deposited material is to be formed. The resist layer is applied by a screen printing process in which the portion of the screen overlying the region is blocked so that no resist is deposited where the bump is to be formed. The screen is open in the areas surrounding the blocked portion, permitting resist to be deposited over any non-planar surfaces surrounding the intended bump location. This provides a substantially planar surface which may be used as a mask for direct paste deposition into the region where the bump is to be formed, or the planar surface may be used as a flat surface upon which a stencil may be supported. After formation of the bump of conductive or non-conductive paste, the sacrificial resist layer is removed.

摘要翻译： 一种用于在焊盘或衬底的其他指定区域上沉积焊膏或其它导电或非导电材料的方法。 将抗蚀剂层施加在要形成沉积材料的凸块的区域的边界上。 通过丝网印刷工艺施加抗蚀剂层，其中覆盖该区域的屏幕的部分被阻挡，使得在要形成凸块的地方不会沉积抗蚀剂。 屏幕在围绕封闭部分的区域是开放的，允许抗蚀剂沉积在围绕预定的凸起位置的任何非平面表面上。 这提供了一个基本平坦的表面，其可以用作用于将直接浆料沉积到要形成凸块的区域中的掩模，或者平面表面可以用作可以支撑模板的平坦表面。 在形成导电或非导电浆料的凸起之后，去除牺牲抗蚀剂层。

公开(公告)号：US06866741B2

公开(公告)日：2005-03-15

申请号：US09757364

申请日：2001-01-08

申请人： Albert W. Chan ,  Michael G. Lee ,  Mark Thomas McCormack ,  Solomon I. Beilin

发明人： Albert W. Chan ,  Michael G. Lee ,  Mark Thomas McCormack ,  Solomon I. Beilin

IPC分类号： H01L21/60 ,  B32B7/12 ,  H01L21/58 ,  H01L21/68 ,  H05K3/34 ,  H05K3/46 ,  H01L21/46

CPC分类号： H01L21/6835 ,  B32B7/12 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73253 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K3/3489 ,  H05K3/4614 ,  H05K2203/0759 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/00012

摘要： A method for joining large area semiconductor substrates, a liquid thermoset polymer. Two large area substrates, such as wafers or circuit boards (e.g., rigid or flexible), can be joined together by dispensing a liquid polymer inwardly from the edges of the semiconductor substrates. The substrates can then be pressed together so that the liquid thermoset flows in an outwardly direction ward the edges of the semiconductor substrates. Conducting surfaces on the first and second substrates may contact each other after pressing the liquid thermoset polymer. The liquid thermoset polymer in the formed structure may then be cured to a hardened state. The liquid thermoset polymer preferable has a low viscosity, low levels of ionic contaminants, good adhesion to the substrates, low moisture absorbing properties and favorable thermal expansion properties.

摘要翻译： 一种用于连接大面积半导体衬底，液体热固性聚合物的方法。 通过从半导体衬底的边缘向内分配液体聚合物，可以将诸如晶片或电路板（例如刚性或柔性）的两个大面积衬底接合在一起。 然后可以将基板压在一起，使得液体热固性材料沿着朝向半导体基板边缘的向外方向流动。 在压制液态热固性聚合物之后，第一和第二基底上的导电表面可以彼此接触。 然后可以将所形成的结构中的液态热固性聚合物固化至硬化状态。 液体热固性聚合物优选具有低粘度，低水平的离子污染物，对基材的良好粘附性，低吸湿性和良好的热膨胀性能。

公开(公告)号：US06592943B2

公开(公告)日：2003-07-15

申请号：US09757057

申请日：2001-01-08

申请人： Albert W. Chan ,  Michael G. Lee ,  Theresa M. Larson

发明人： Albert W. Chan ,  Michael G. Lee ,  Theresa M. Larson

IPC分类号： B05D132

CPC分类号： H01L23/49883 ,  H01L2924/0002 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2203/0425 ,  Y10T428/24273 ,  H01L2924/00

摘要： A method of depositing solder on a conductive region of a substrate comprising providing a substrate having a substrate aperture and a coefficient of thermal expansion. A polymeric stencil is also provided such as to have a stencil aperture and a coefficient of thermal expansion which is approximately equal to the coefficient of thermal expansion of the substrate. The method also includes disposing the polymeric stencil on the substrate such that the stencil aperture is aligned with a conductive region; and reflowing the solder paste while the polymeric stencil remains disposed on the substrate. The polymeric stencil is then removed from the substrate essentially without any solder-paste being removed with the polymeric stencil. A method of forming a polymeric stencil for solder-paste printing comprising forming in a polymeric sheet of plurality of apertures having wrinkles in the polymeric sheet in proximity to the plurality of apertures, and compressing opposing surfaces of the apertured polymeric sheet toward each other. The compressed apertured polymeric sheet is then heated and rapidly cooled to remove wrinkles in proximity to the apertures. A stencil for use in a fine pitch bumping process comprising a releasable polymeric sheet having a coefficient of thermal expansion of less than about 4.0 ppm/°C. and a structure defining a pair of apertures spaced from each other at a distance less than about 0.20 mm.

摘要翻译： 一种在衬底的导电区域上沉积焊料的方法，包括提供具有衬底孔径和热膨胀系数的衬底。 还提供聚合物模板，例如具有模板孔和热膨胀系数，其大致等于衬底的热膨胀系数。 该方法还包括将聚合物模版设置在基底上，使得模版孔与导电区对齐; 并且当聚合物模板保持设置在基底上时回流焊膏。 然后，聚合物模板基本上从基材上除去，而不用聚合物模板去除任何焊膏。 一种形成用于焊膏印刷的聚合物模板的方法，包括在聚合物片材中具有多个孔隙的多个孔的聚合物片材中形成，并且将多孔聚合物片材的相对表面压向彼此。 然后将压缩的有孔聚合物片材加热并快速冷却以除去孔附近的褶皱。 用于细间距凸起工艺的模版，其包括具有小于约4.0ppm /℃的热膨胀系数的可释放聚合物片材。 以及限定一对彼此以小于约0.20mm的距离彼此隔开的孔的结构。

公开(公告)号：US06518096B2

公开(公告)日：2003-02-11

申请号：US09757005

申请日：2001-01-08

申请人： Albert W. Chan ,  Michael G. Lee

发明人： Albert W. Chan ,  Michael G. Lee

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13007 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/27013 ,  H01L2224/45124 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3651 ,  H05K3/4614 ,  H05K3/4626 ,  H05K2203/0733 ,  H05K2203/0759 ,  H05K2203/1189 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05647

摘要： An interconnect assembly and a fluxless method for forming the interconnect assembly. The fluxless method includes providing a first semiconductor substrate having a first pad connected thereto. A post is connected to the first pad and includes a length greater than a thickness of the first pad, and a metallic solder disposed on an associated end of the post. A second semiconductor substrate is provided as having a second pad connected thereto. The fluxless method further includes depositing an unfilled polymeric liquid on the second pad, aligning and contacting the metallic solder with the unfilled polymeric liquid, and forcing by pressure the first and second semiconductor substrate toward each while simultaneously heating the metallic solder and the unfilled polymeric liquid to form a metallurgical joint between the second pad and the metallic solder.

摘要翻译： 用于形成互连组件的互连组件和无助焊剂方法。 无助焊剂方法包括提供具有连接到其上的第一焊盘的第一半导体衬底。 柱连接到第一焊盘并且包括大于第一焊盘的厚度的长度，以及设置在柱的相关联的端部上的金属焊料。 第二半导体衬底被设置为具有连接到其上的第二焊盘。 无助焊剂方法还包括在第二焊盘上沉积未填充的聚合物液体，使金属焊料与未填充的聚合物液体对准和接触，并且通过将第一和第二半导体衬底朝向每个压力迫使金属焊料和未填充的聚合物液体同时加热 以在第二焊盘和金属焊料之间形成冶金接头。