Abstract:
Methods for processing a substrate are described herein. A method for removing a layer from a substrate, can include positioning a substrate within a processing chamber, wherein the substrate can include an upper surface, and one or more metal features with a separation energy formed on the upper surface; forming a layer over the one or more metal features and the exposed portion of the upper surface; focusing a source of transmissive radiant energy at the layer; pulsing transmissive radiant energy at the upper surface of the substrate creating a separated portion and an attached portion of the layer; and removing the separated portion of the layer.
Abstract:
Methods for processing a substrate are described herein. A method for removing a layer from a substrate, can include positioning a substrate within a processing chamber, wherein the substrate can include an upper surface, and one or more metal features with a separation energy formed on the upper surface; forming a layer over the one or more metal features and the exposed portion of the upper surface; focusing a source of transmissive radiant energy at the layer; pulsing transmissive radiant energy at the upper surface of the substrate creating a separated portion and an attached portion of the layer; and removing the separated portion of the layer.
Abstract:
Method and apparatus for forming free-standing, substantially monocrystalline semiconductor substrates is described. A template substrate is subjected to a process of forming a porous layer on each major surface of the template substrate. The porous layer is smoothed, and then an epitaxial layer is formed on each porous layer. Mechanical energy is used to separate the epitaxial layers from the template substrate, which is recycled by removing any remaining porous and epitaxial material.
Abstract:
An electro discharge machining system, and manufacturing method therefor, including: providing an electro discharge machining unit and control; providing a workpiece holder; providing a tool holder for a tool having an electrode array; and operatively connecting the workpiece holder and the tool holder to the electro discharge machining unit and control for batch electro-discharge machining of a workpiece to a configuration compatible with the electrode array.
Abstract:
An electro discharge machining system, and manufacturing method therefor, including: providing an electro discharge machining unit and control; providing a workpiece holder; providing a tool holder for a tool having an electrode array; and operatively connecting the workpiece holder and the tool holder to the electro discharge machining unit and control for batch electro-discharge machining of a workpiece to a configuration compatible with the electrode array.
Abstract:
An electro discharge machining system, and method of manufacture therefor, providing: an electro discharge machining unit and control; a workpiece holder; a tool having an electrode array formed of a plurality of geometrically shaped electrodes; and wherein the workpiece holder and the tool holder are operatively connected to the electro discharge machining unit and control for batch electro discharge machining of a workpiece to a configuration having a plurality of geometrically shaped structures.