-
公开(公告)号：US20170301897A1
公开(公告)日：2017-10-19
申请号：US15338950
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Michael Yu-Tak Young , Byung-Sung Kwak , Giback Park , Lizhong Sun , Jeffrey L. Franklin , Robert Jan Visser
IPC: H01M2/10 , H01M2/08 , H01M2/02 , H01M10/0525 , H01M10/0585
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: A thin film device, comprising: an active device region, the active device region having reversible motion at least along a first direction between a first device state and a second device state; and a thin film encapsulant disposed adjacent the selective expansion region, wherein the thin film encapsulant comprises a first thickness in the first device state and a second thickness in the second device state, the first thickness being greater than the second thickness by 10% or greater, wherein the thin film encapsulant comprises a laser-etchable material.
-
公开(公告)号：US20170301928A1
公开(公告)日：2017-10-19
申请号：US15339153
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Michael Yu-Tak Young , Jeffrey L. Franklin
IPC: H01M6/40 , B23K26/00 , B23K26/362 , B23K26/142 , H01M6/18 , B29C59/16 , H01M6/00 , B23K101/36 , B23K103/16 , B29L31/34 , B23K101/34
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: A device for maskless thin film etching, including an ablation tool adapted to emit an ablative output for etching a surface, a gas jet associated with a source of carrier gas and adapted to emit a stream of the carrier gas at an area of the surface where the output of the ablation tool impinges, and a suction member associated with a vacuum source and adapted to collect ablated particulate from the area of the surface where the output of the ablation tool impinges, wherein the ablation tool, the gas jet, and the suction member are mounted adjacent one another.
-
公开(公告)号：US20170301894A1
公开(公告)日：2017-10-19
申请号：US15462209
申请日：2017-03-17
Applicant: Applied Materials, Inc.
Inventor： Byung-Sung Kwak , Lizhong Sun , Giback Park , Michael Yu-Tak Young , Jeffrey L. Franklin , Miaojun Wang , Dimitrios Argyris
IPC: H01M2/02
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: A thin film device. The thin film device may include: an active device region, the active device region comprising a diffusant; and a thin film encapsulant disposed adjacent to the active device region and encapsulating at least a portion of the active device region, the thin film encapsulant comprising: a first layer, the first layer disposed immediately adjacent the active device region and comprising a soft and pliable material; and a second layer disposed on the first layer, the second layer comprising a rigid dielectric material or rigid metal material.
-
公开(公告)号：US20170301955A1
公开(公告)日：2017-10-19
申请号：US15338977
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Byung-Sung Kwak , Lizhong Sun , Giback Park , Dimitrios Argyris , Michael Yu-Tak Young , Jeffrey L. Franklin
IPC: H01M10/0585 , H01M2/08 , H01M2/02 , H01M10/04 , H01M10/0525
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: A thin film battery may include: a contact layer, the contact layer disposed in a first plane and comprising a cathode current collector and an anode current collector pad; a device stack disposed on the cathode current collector, the device stack comprising a cathode and solid state electrolyte; an anode current collector disposed on the device stack; a thin film encapsulant, the thin film encapsulant disposed over the device stack, wherein the solid state electrolyte encapsulates the cathode.
-
公开(公告)号：US20170301895A1
公开(公告)日：2017-10-19
申请号：US15339121
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Michael Yu-Tak Young , Jeffrey L. Franklin , Byung-Sung Kwak
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: Approaches herein provide improved encapsulation of an energy storage device. In one approach, a thin film storage device stack is formed atop a first side of a substrate, and an encapsulant is formed over the thin film storage device stack. A recess formed in the substrate adjacent the thin film storage device stack provides an anchoring point for the encapsulant. In some approaches, the recess is provided partially through a depth of the substrate, and has a geometry to promote physical coupling between the encapsulant and the substrate.
-
Patent Agency Ranking
公开(公告)号：US20170301893A1
公开(公告)日：2017-10-19
申请号：US15339007
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Michael Yu-Tak Young , Jeffrey L. Franklin
IPC: H01M2/02 , H01M10/0585 , H01M2/08 , H01M10/04 , H01M10/0525
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: Approaches herein provide encapsulation of a micro battery cell of a cell matrix. The micro battery cell includes an active device, such as a thin film device, formed atop a first side of a substrate. An encapsulant may be formed over the active device, wherein the encapsulant adheres to the active device and to a second side of the substrate. In some approaches, the encapsulant penetrates a plurality of openings provided through the substrate, thus allowing the encapsulant to form along the second side of the substrate to fully envelope the micro battery cell.
-
公开(公告)号：US20170301892A1
公开(公告)日：2017-10-19
申请号：US15338958
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Byung-Sung Kwak , Lizhong Sun , Giback Park , Michael Yu-Tak Young , Jeffrey L. Franklin , Miaojun Wang
IPC: H01M2/02 , H01M2/08 , H01M10/0525 , H01M10/0585
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: A thin film device. The thin film device may include: an active device region, the active device region comprising a diffusant; and a thin film encapsulant disposed adjacent to the active device region and encapsulating at least a portion of the active device region, the thin film encapsulant comprising: a first layer, the first layer disposed immediately adjacent the active device region and comprising a soft and pliable material; and a second layer disposed on the first layer, the second layer comprising a rigid dielectric material or rigid metal material.
-
公开(公告)号：US20170301891A1
公开(公告)日：2017-10-19
申请号：US15462220
申请日：2017-03-17
Applicant: Applied Materials, Inc.
Inventor： Byung-Sung Kwak , Lizhong Sun , Giback Park , Michael Yu-Tak Young , Jeffrey L. Franklin , Miaojun Wang , Dimitrios Argyris
CPC classification number: H01M2/0275 , H01M2/0287 , H01M4/131 , H01M4/134 , H01M4/366 , H01M4/382 , H01M4/525 , H01M2010/0495 , H01M2300/0065
Abstract: A thin film device may include an active device region, where the active device region comprises a selective expansion region. The thin film device may further include a polymer layer disposed adjacent to the active device region and encapsulating the active device region, the polymer layer comprising a plurality of polymer sub-layers. A first polymer sub-layer of the plurality of polymer sub-layers may have a first hardness, while a second polymer sub-layer of the plurality of polymer sub-layers has a second hardness, the second hardness being different from the first hardness.
-
公开(公告)号：US20180040860A1
公开(公告)日：2018-02-08
申请号：US15338989
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Michael Yu-Tak Young , Jeffrey L. Franklin
IPC: H01M2/02 , H01M4/525 , H01M10/0562 , H01M4/13 , H01M10/0525 , H01M10/0585
CPC classification number: H01M2/0267 , H01M2/0292 , H01M4/13 , H01M4/525 , H01M6/40 , H01M10/0525 , H01M10/0562 , H01M10/0585 , H01M2002/0297 , H01M2010/0495
Abstract: A thin film device. The thin film device may include: an active device region; a thin film encapsulant disposed adjacent to the active device region and encapsulating at least a portion of the active device region. The thin film encapsulant may include an outer layer, wherein the outer layer is disposed adjacent ambient and comprises a hydrophobic layer.
-
公开(公告)号：US20170301956A1
公开(公告)日：2017-10-19
申请号：US15338996
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Michael Yu-Tak Young , Byung-Sung Kwak
IPC: H01M10/0585 , H01M2/08 , H01M2/02 , H01M10/04 , H01M10/0525
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: A device. The device may include: a substrate, the substrate comprising: an upper surface; and a recess extending from the upper surface into the substrate; an active device region, the active device region disposed within the recess and having a first thickness; and an encapsulant, the encapsulant disposed over the recess and over the active device region, wherein the encapsulant has a second thickness, wherein the encapsulant extends above the upper surface of the substrate to a first distance, and wherein the first distance is less than a sum of the first thickness and second thickness.
-
-
-
-
-
-
-
-
-
Search Results
11
records
(took 0.023 seconds)
