公开(公告)号：US20030216037A1

公开(公告)日：2003-11-20

申请号：US10409406

申请日：2003-04-07

申请人： Applied Materials, Inc.

发明人： Hong Zhang ,  Xianmin Tang ,  Praburam Gopalraja ,  John C. Forster ,  Jick M. Yu

IPC分类号： C23C014/00 ,  C23C014/32 ,  H01L021/4763

CPC分类号： H01L21/76843 ,  C23C14/046 ,  C23C14/0641 ,  C23C14/185 ,  C23C14/5873 ,  H01L21/2855 ,  H01L21/76844 ,  H01L21/76846 ,  H01L21/76865

摘要： A first method is provided for forming a barrier layer on a substrate by sputter-depositing a tantalum nitride layer on a substrate having (1) a metal feature formed on the substrate; (2) a dielectric layer formed over the metal feature; and (3) a via formed in the dielectric layer so as to expose the metal feature. The via has side walls and a bottom, and a width of about 0.18 microns or less. The tantalum nitride layer is deposited on the side walls and bottom of the via and on a field region of the dielectric layer; and has a thickness of at least about 200 angstroms on the field region. The first method also includes sputter-depositing a tantalum layer on the substrate, in the same chamber. The tantalum layer having a thickness of less than about 100 angstroms on the field region. Other aspects are provided.

摘要翻译： 提供了第一种方法，用于通过在（1）形成在基底上的金属特征的衬底上溅射沉积氮化钽层，在衬底上形成阻挡层; （2）形成在所述金属特征上的电介质层; 和（3）形成在电介质层中的通孔以暴露金属特征。 通孔具有侧壁和底部，宽度为约0.18微米或更小。 氮化钽层沉积在通孔的侧壁和底部以及电介质层的场区上; 并且在场区域具有至少约200埃的厚度。 第一种方法还包括在相同的室中在衬底上溅射沉积钽层。 该钽层的厚度在场区域上小于约100埃。 提供其他方面。

公开(公告)号：US20040094402A1

公开(公告)日：2004-05-20

申请号：US10632882

申请日：2003-07-31

申请人： APPLIED MATERIALS, INC.

发明人： Praburam Gopalraja ,  Jianming Fu ,  Xianmin Tang ,  John C. Forster ,  Umesh Kelkar

IPC分类号： C23C014/35

CPC分类号： C23C14/345 ,  C23C14/35 ,  H01J37/32706 ,  H01J37/3408 ,  H01J37/3455

摘要： A DC magnetron sputter reactor for sputtering deposition materials such as tantalum and tantalum nitride, for example, and its method of use, in which self-ionized plasma (SIP) sputtering and capacitively coupled plasma (CCP) sputtering are promoted, either together or alternately, in the same chamber. Also, bottom coverage may be thinned or eliminated by inductively-coupled plasma (ICP) resputtering. SIP is promoted by a small magnetron having poles of unequal magnetic strength and a high power applied to the target during sputtering. CCP is provided by a pedestal electrode which capacitively couples RF energy into a plasma. The CCP plasma is preferably enhanced by a magnetic field generated by electromagnetic coils surrounding the pedestal which act to confine the CCP plasma and increase its density.

摘要翻译： 例如，用于溅射诸如钽和氮化钽的沉积材料的DC磁控溅射反应器及其使用的自离子等离子体（SIP）溅射和电容耦合等离子体（CCP）溅射的方法，其一起或交替地被促进 ，在同一个房间。 此外，可以通过电感耦合等离子体（ICP）再溅射来减薄或消除底部覆盖。 SIP由在溅射期间施加到靶的不均匀磁强度和高功率的磁极的小磁控管促进。 CCP由将电能耦合到等离子体中的RF能量的基座电极提供。 CCP等离子体优选由围绕基座的电磁线圈产生的磁场增强，其作用是限制CCP等离子体并增加其密度。

公开(公告)号：US20030116427A1

公开(公告)日：2003-06-26

申请号：US10202778

申请日：2002-07-25

申请人： Applied Materials, Inc.

发明人： Peijun Ding ,  Zheng Xu ,  Roderick C. Mosely ,  Suraj Rengarajan ,  Nirmalya Maity ,  Daniel A. Carl ,  Barry Chin ,  Paul F. Smith ,  Darryl Angelo ,  Anish Tolia ,  Jianming Fu ,  Fusen Chen ,  Praburam Gopalraja ,  Xianmin Tang ,  John C. Forster

IPC分类号： C23C014/32 ,  C23C014/34

CPC分类号： H01L21/76844 ,  C23C14/046 ,  C23C14/345 ,  C23C14/3457 ,  C23C14/358 ,  H01J37/321 ,  H01J37/3408 ,  H01J2237/3327 ,  H01L21/2855 ,  H01L21/76805 ,  H01L21/76846 ,  H01L21/76862 ,  H01L21/76864 ,  H01L21/76865 ,  H01L21/76868 ,  H01L21/76873 ,  H01L21/76877 ,  H01L2221/1089

摘要： A magnetron sputter reactor for sputtering deposition materials such as tantalum, tantalum nitride and copper, for example, and its method of use, in which self-ionized plasma (SIP) sputtering and inductively coupled plasma (ICP) sputtering are promoted, either together or alternately, in the same chamber. Also, bottom coverage may be thinned or eliminated by ICP resputtering. SIP is promoted by a small magnetron having poles of unequal magnetic strength and a high power applied to the target during sputtering. ICP is provided by one or more RF coils which inductively couple RF energy into a plasma. The combined SIP-ICP layers can act as a liner or barrier or seed or nucleation layer for hole. In addition, an RF coil may be sputtered to provide protective material during ICP resputtering.

摘要翻译： 用于溅射诸如钽，氮化钽和铜的沉积材料的磁控溅射反应器及其使用方法，其中促进了自离子等离子体（SIP）溅射和电感耦合等离子体（ICP）溅射，其一起或者 交替地，在同一个房间。 此外，底部覆盖可以通过ICP再溅射而变薄或消除。 SIP由在溅射期间施加到靶的不均匀磁强度和高功率的磁极的小磁控管促进。 ICP由一个或多个将RF能量感应耦合到等离子体中的RF线圈提供。 组合的SIP-ICP层可以作为孔的衬垫或屏障或种子或成核层。 此外，可以在ICP溅射期间溅射RF线圈以提供保护材料。

公开(公告)号：US20040222082A1

公开(公告)日：2004-11-11

申请号：US10429941

申请日：2003-05-05

申请人： APPLIED MATERIALS, INC.

发明人： Praburam Gopalraja ,  Xianmin Tang ,  Jianming Fu ,  Mark A. Perrin ,  Jean Yue (Phillip) Wang ,  Arvind Sundarrajan ,  Hong Zhang ,  Jick Yu ,  Umesh Kelkar ,  Zheng Xu ,  Fusen Chen

IPC分类号： C23C014/32 ,  G21G005/00

CPC分类号： H01J37/34 ,  C23C14/046 ,  C23C14/3442 ,  C23C14/5833 ,  H01J37/3053 ,  H01L21/2855 ,  H01L21/76843 ,  H01L21/76862 ,  H01L21/76865

摘要： In conjunction with sputtering a metal, especially copper, into high aspect-ratio holes in a wafer, an oblique ion milling method in which argon ions or other particles having energies in the range of 200 to 1500 eV are directed to the wafer at between 10 and 35null to the wafer surface to sputter etch material sputter deposited preferentially on the upper corners of the holes. The milling may be performed in the sputter deposition chamber either simultaneously with the deposition or after it or performed afterwards in a separate milling reactor. A plurality of ion sources arranged around the chamber improve angular uniformity or arranged axially improve radial uniformity or vary the angle of incidence. An annular ion source about the chamber axis allows a plasma current loop. Anode layer ion sources and sources composed of copper are advantageous.

摘要翻译： 结合将金属，特别是铜溅射到晶片中的高纵横比孔中，其中具有在200至1500eV范围内的能量的氩离子或其它颗粒的倾斜离子研磨方法在10 并且与晶片表面成35°的溅射蚀刻材料溅射沉积优先在孔的上角上。 铣削可以在溅射沉积室中同时进行沉积，或在其之后或之后在单独的研磨反应器中进行。 围绕腔室布置的多个离子源提高了角度均匀性或者轴向地改变径向均匀性或改变入射角。 围绕腔室轴线的环形离子源允许等离子体电流回路。 阳极层离子源和由铜组成的源是有利的。

公开(公告)号：US20040140196A1

公开(公告)日：2004-07-22

申请号：US10346974

申请日：2003-01-17

申请人： Applied Materials, Inc.

发明人： Praburam Gopalraja ,  Jianming Fu ,  Xianmin Tang ,  Fusen Chen

IPC分类号： C23C014/00 ,  C23C014/32

CPC分类号： H01L21/76844 ,  C23C14/046 ,  C23C14/3492 ,  C23C14/35 ,  C23C14/54 ,  H01L21/2855 ,  H01L21/76805 ,  H01L21/76865 ,  H01L21/76873 ,  H01L21/76877 ,  H01L23/53238 ,  H01L2221/1089 ,  H01L2924/0002 ,  H01L2924/00

摘要： A sputter deposition method is performed in a sputtering chamber having a sputtering target facing a substrate support. A substrate is placed on the support in the chamber and, in a first sputtering stage, a first layer of sputtered material is deposited on the substrate by maintaining a first pressure of a sputtering gas in the chamber, and maintaining the substrate support at a first bias power level. In a second sputtering stage, a second layer of sputtered material is deposited on the substrate by maintaining a second pressure of the sputtering gas that is lower than the first pressure, and maintaining the substrate support at a second bias power level that is higher than the first bias power level.

摘要翻译： 在具有面向衬底支撑体的溅射靶的溅射室中进行溅射沉积方法。 将衬底放置在腔室中的支撑体上，并且在第一溅射阶段中，通过在腔室中保持溅射气体的第一压力将第一层溅射材料沉积在衬底上，并将衬底支撑件保持在第一 偏置功率电平。 在第二溅射阶段，通过保持低于第一压力的溅射气体的第二压力将第二溅射材料层沉积在衬底上，并且将衬底支撑件保持在高于第一压力的第二偏压功率水平 第一偏置功率电平。

公开(公告)号：US20040055880A1

公开(公告)日：2004-03-25

申请号：US10608306

申请日：2003-06-26

申请人： APPLIED MATERIALS, INC.

发明人： Tza-Jing Gung ,  Xianmin Tang ,  John Forster ,  Peijun Ding ,  Marc Schweitzer ,  Keith A. Miller ,  Ilya Lavitsky

IPC分类号： C23C014/34

CPC分类号： H01J37/3402 ,  C23C14/046 ,  C23C14/345 ,  C23C14/3457 ,  C23C14/358 ,  H01J37/321 ,  H01J37/32623 ,  H01J37/3408 ,  H01J37/3411 ,  H01J37/3441 ,  H01J2237/3327 ,  H01L21/2855 ,  H01L21/76843 ,  H01L21/76877

摘要： One aspect of the invention includes an auxiliary magnet ring positioned outside of the chamber wall of a plasma sputter reactor and being disposed at least partially radially outwardly of an RF coil used to inductively generate a plasma, particularly for sputter etching the substrate being sputter deposited. Thereby, a magnetic barrier prevents the plasma from leaking outwardly to the coil and improves the uniformity of sputter etching. The magnetic field also acts as a magnetron when the coil, when made of the same material as the primary target, is being used as a secondary target. Another aspect of the invention includes a one-piece inner shield extending from the target to the pedestal with a smooth inner surface and supported by an annular flange in a middle portion of the shield. The shield may be used to support the RF coil.

摘要翻译： 本发明的一个方面包括位于等离子体溅射反应器的室壁外部的辅助磁环，并且至少部分地设置在用于感应地产生等离子体的RF线圈的径向外侧，特别是用于溅射蚀刻被溅射沉积的衬底。 因此，磁屏障防止等离子体向外泄漏到线圈并提高溅射蚀刻的均匀性。 当线圈由与主要靶材相同的材料制成时，磁场也用作磁控管，作为次级靶。 本发明的另一方面包括从目标件延伸到具有光滑的内表面并由屏蔽件的中间部分中的环形凸缘支撑的一体式内屏蔽件。 屏蔽可用于支持RF线圈。

公开(公告)号：US20030089597A1

公开(公告)日：2003-05-15

申请号：US10246316

申请日：2002-09-17

申请人： APPLIED MATERIALS, INC.

发明人： Xianmin Tang ,  Praburam Gopalraja ,  Suraj Rengarajan ,  John C. Forster ,  Jianming Fu ,  Peijun Ding

IPC分类号： C23C014/14 ,  C23C014/34

CPC分类号： H01L21/2855 ,  C23C14/0641 ,  C23C14/165 ,  C23C14/541 ,  C23C14/5806 ,  H01L21/318 ,  H01L21/76846 ,  H01L21/76856 ,  H01L21/76862 ,  H01L21/76876

摘要： We have discovered a method of providing a thin approximately from about 20 null to about 100 null thick TaN seed layer, which can be used to induce the formation of alpha tantalum when tantalum is deposited over the TaN seed layer. Further, the TaN seed layer exhibits low resistivity, in the range of 30 nullnullcm and can be used as a low resistivity barrier layer in the absence of an alpha tantalum layer. In one embodiment of the method, a TaN film is altered on its surface form the TaN seed layer. In another embodiment of the method, a Ta film is altered on its surface to form the TaN seed layer.

摘要翻译： 我们已经发现了一种提供约20至约100个厚的TaN籽晶薄层的方法，当钽沉积在TaN种子层上时，可以用它来诱导形成α钽。 此外，TaN籽晶层的电阻率低于30μΩ·cm，可以在不存在α钽层的情况下用作低电阻率阻挡层。 在该方法的一个实施方案中，TaN膜在其表面上改变形成TaN种子层。 在该方法的另一个实施方案中，在其表面上改变Ta膜以形成TaN籽晶层