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49 条记录 (耗时 0.019 秒)

    Method for producing integrated circuits and coils on carrier webs
    1.
    发明授权
    Method for producing integrated circuits and coils on carrier webs 失效
    在载体网上生产集成电路和线圈的方法

    公开(公告)号：US5943769A

    公开(公告)日：1999-08-31

    申请号：US7762

    申请日：1998-01-15

    申请人： Arno Hohmann ,  Joachim Hoppe ,  Yahya Haghiri-Tehrani

    发明人： Arno Hohmann ,  Joachim Hoppe ,  Yahya Haghiri-Tehrani

    IPC分类号： B42D15/10 ,  G06K19/04 ,  G06K19/077 ,  H05K3/02

    CPC分类号： G06K19/07718 ,  G06K19/041 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07781 ,  H01L2224/48091 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155

    摘要： A method for making integrated circuits electrically connected to conductive coil elements includes placing integrated circuits in recesses provided at precise locations along a foil carrier web and positioning coils also at designated locations on the foil web so that a coil is associated with each integrated circuit. The web is then cut to produce a planar coil electrically connected to an integrated circuit on a foil element. The integrated circuit and coils may be coated with a casting compound and the coils may be formed using various procedures, including pressing coils into the surface of the foil, sewing the coils to the foil and electrostatically forming the coils on the foil with fusion of the coil material directly onto the foil. Apparatus for carrying out the aforesaid process, including winding of the coils, is described.

    摘要翻译： 一种用于制造电连接到导电线圈元件的集成电路的方法包括将集成电路放置在沿着箔片承载片的精确位置处设置的凹部中，并且还在箔片上的指定位置处定位线圈，使得线圈与每个集成电路相关联。 然后将网片切割以产生电连接到箔元件上的集成电路的平面线圈。 集成电路和线圈可以涂覆有铸造复合物，并且线圈可以使用各种方法形成，包括将线圈压入箔的表面，将线圈缝合到箔上，并在箔上静电地形成线圈， 线圈材料直接在箔上。 描述了用于执行上述处理的装置，包括线圈的卷绕。

    Method and device for producing a portable data carrier
    6.
    发明授权
    Method and device for producing a portable data carrier 有权
    用于生产便携式数据载体的方法和装置

    公开(公告)号：US07150405B2

    公开(公告)日：2006-12-19

    申请号：US10478634

    申请日：2002-05-27

    申请人： Joachim Hoppe ,  Arno Hohmann

    发明人： Joachim Hoppe ,  Arno Hohmann

    IPC分类号： G06K19/02

    CPC分类号： B32B38/06 ,  B32B2425/00 ,  B32B2429/00 ,  G06K19/06046 ,  G06K19/077

    摘要： A method for producing a multilayer data carrier (1) having a surface structure (2) embossed at least in certain areas on one side. In the method, a first multilayer semifinished product (3) is first produced into which the surface structure (2) is embossed. The semifinished product (3) is then connected with a second multilayer semifinished product (4) or a further layer (17) with interposition of an adhesive layer (5). Furthermore, a corresponding manufacturing plant is described.

    摘要翻译： 一种用于制造具有至少在一侧的某些区域中压花的表面结构（2）的多层数据载体（1）的方法。 在该方法中，首先制造第一多层半成品（3），其中压花表面结构（2）。 然后将半成品（3）与插入粘合剂层（5）的第二多层半成品（4）或另一层（17）连接。 此外，描述了相应的制造工厂。

    Semifinished product with an electronic module
    8.
    发明授权
    Semifinished product with an electronic module 失效
    半成品与电子模块

    公开(公告)号：US5986890A

    公开(公告)日：1999-11-16

    申请号：US622874

    申请日：1996-03-29

    申请人： Joachim Hoppe ,  Arno Hohmann

    发明人： Joachim Hoppe ,  Arno Hohmann

    IPC分类号： G06K19/077 ,  H01L21/56 ,  H01L23/24 ,  H05K1/14

    CPC分类号： G06K19/07749 ,  H01L21/565 ,  H01L23/24 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181

    摘要： A semifinished product for an electronic module includes an integrated circuit and a coil electrically connected with the circuit, the coil being disposed between two carrier layers and the integrated circuit being disposed in a specially provided cavity in the two carrier layers. To achieve plane surfaces of the semifinished product, the remaining cavity between the carrier layers and the integrated circuit is filled with a filling material in such a way that plane surfaces of the semifinished product result in the area of the cavity which are flush with the surfaces of the carrier layers.

    摘要翻译： 用于电子模块的半成品包括集成电路和与该电路电连接的线圈，线圈设置在两个载体层之间，并且该集成电路设置在两个载体层中的特别提供的空腔中。 为了实现半成品的平面，载体层和集成电路之间的剩余空腔填充有填充材料，使得半成品的平面导致与表面齐平的空腔区域 的载体层。

    Apparatus and method for singling stacked cards
    10.
    发明授权
    Apparatus and method for singling stacked cards 失效
    用于单张堆叠卡的装置和方法

    公开(公告)号：US5695314A

    公开(公告)日：1997-12-09

    申请号：US539872

    申请日：1995-10-06

    申请人： Arno Hohmann ,  Joachim Hoppe

    发明人： Arno Hohmann ,  Joachim Hoppe

    IPC分类号： G07F7/08 ,  B65G59/06 ,  B65H1/04 ,  B65H3/00 ,  B65H3/08 ,  B65H3/30 ,  B65H3/32 ,  B65H3/54 ,  B65H29/00 ,  B65H31/08 ,  B65H33/06 ,  B65G59/02

    CPC分类号： B65H1/04 ,  B65G59/065 ,  B65H29/00 ,  B65H3/30 ,  B65H3/32 ,  B65H31/08 ,  B65H33/06

    摘要： An apparatus for singling cards, such as check cards, identity cards and the like, which consists of a magazine for storing the cards in a stack, a removing device and a retaining device. The cards are disposed in the magazine rotated at a defined angle from one another, resulting in protruding surfaces between two successive cards. For singling, the uppermost card is lifted off in an axis perpendicular to the card surface by means of a removing device. The card following the uppermost card is held back in the magazine by means of a retaining device, the retaining device acting on the protruding surface of the following card.

    摘要翻译： 一种用于单张卡的装置，例如支票卡，身份证等，其包括用于将卡存储在堆栈中的盒子，去除装置和保持装置。 这些卡片设置在盒子中以相互限定的角度旋转，导致两个连续卡片之间的突出表面。 对于单打，最上面的卡通过移除装置在与卡表面垂直的轴上被提起。 在最上面的卡之后的卡通过保持装置保持在盒中，保持装置作用在随后的卡的突出表面上。