公开(公告)号：US06503368B1

公开(公告)日：2003-01-07

申请号：US09607533

申请日：2000-06-29

申请人： Arnold Kholodenko ,  Vijay Parkhe ,  Shamouil Shamouilian ,  You Wang ,  Wing L. Cheng ,  Alexander M. Veytser

发明人： Arnold Kholodenko ,  Vijay Parkhe ,  Shamouil Shamouilian ,  You Wang ,  Wing L. Cheng ,  Alexander M. Veytser

IPC分类号： C23C1600

CPC分类号： H01L21/67103 ,  C23C16/4581 ,  C23C16/4586 ,  H01J2237/2001

摘要： A substrate support 55 comprises first, second and third sections 88, 90, 92 connected to one another by first and second bonds 106, 108, one of the sections comprises a surface 75 adapted to receive a substrate 25. The first bond 106 comprises a first bonding material and the second bond 108 comprises a second bonding material. In one version, the first bonding material is capable of bonding surfaces when heated to a first temperature and the second bonding material is capable of bonding surfaces when heated to a second temperature.

摘要翻译： 衬底支撑件55包括通过第一和第二键106,108彼此连接的第一，第二和第三部分88,90,92，其中一个部分包括适于接收衬底25的表面75.第一结合106包括 第一接合材料和第二接合108包括第二接合材料。 在一个版本中，第一接合材料能够在被加热到第一温度时粘合表面，并且第二接合材料能够在被加热到第二温度时粘合表面。

公开(公告)号：US06217655B1

公开(公告)日：2001-04-17

申请号：US08791941

申请日：1997-01-31

申请人： Ananda H. Kumar ,  Shamouil Shamouilian ,  Hyman J. Levinstein ,  Vijay Parkhe

发明人： Ananda H. Kumar ,  Shamouil Shamouilian ,  Hyman J. Levinstein ,  Vijay Parkhe

IPC分类号： B05C1300

CPC分类号： H01L21/6833 ,  H01L21/6875

摘要： A stand-off pad, and method of fabricating the same, for supporting a workpiece in a spaced apart relation to a workpiece support chuck. More specifically, the wafer stand-off pad is fabricated of a polymeric material, such as polyimide, which is disposed upon the support surface of the chuck. The stand-off pad maintains a wafer, or other workpiece, in a spaced apart relation to the support surface of the chuck. The distance between the underside surface of the wafer and the chuck is defined by the thickness of the stand-off pad. This distance should be larger than the expected diameter of contaminant particles that may lie on the surface of the chuck. In this manner, the contaminant particles do not adhere to the underside of the wafer during processing and the magnitude of the chucking voltage is maintained between the workpiece and the chuck.

摘要翻译： 支撑垫及其制造方法，用于以与工件支撑卡盘间隔开的关系支撑工件。 更具体地说，晶片支座由诸如聚酰亚胺的聚合材料制成，其设置在卡盘的支撑表面上。 支座将保持晶片或其它工件与卡盘的支撑表面间隔开。 晶片的下表面和卡盘之间的距离由支座的厚度限定。 该距离应大于可能位于卡盘表面上的污染物颗粒的预期直径。 以这种方式，污染物颗粒在处理期间不粘附到晶片的下侧，并且夹持电压的幅度保持在工件和卡盘之间。

公开(公告)号：US20150340255A1

公开(公告)日：2015-11-26

申请号：US14282503

申请日：2014-05-20

申请人： Vijay Parkhe ,  Konstantin Makhratchev

发明人： Vijay Parkhe ,  Konstantin Makhratchev

IPC分类号： H01L21/67 ,  F28F3/12 ,  H01L21/683

CPC分类号： H01L21/67109 ,  F28F3/12 ,  H01L21/6831

摘要： An electrostatic chuck is described with independent zone cooling that leads to reduced crosstalk. In one example, the chuck includes a puck to carry a substrate for fabrication processes, and a cooling plate fastened to and thermally coupled to the ceramic puck, the cooling plate having a plurality of different independent cooling channels to carry a heat transfer fluid to transfer heat from the cooling plate.

摘要翻译： 使用独立的区域冷却来描述静电卡盘，导致减少的串扰。 在一个示例中，卡盘包括用于承载用于制造工艺的基底的圆盘，以及紧固到陶瓷盘并且热耦合到陶瓷盘的冷却板，冷却板具有多个不同的独立冷却通道，以承载传热流体以传递 来自冷却板的热量。

公开(公告)号：US20060008660A1

公开(公告)日：2006-01-12

申请号：US10888798

申请日：2004-07-09

申请人： Vijay Parkhe

发明人： Vijay Parkhe

IPC分类号： B32B13/04

CPC分类号： H01L21/67051 ,  B08B1/00 ,  B08B7/0028 ,  Y10T428/24777 ,  Y10T428/252 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/269 ,  Y10T428/31507 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

摘要： A cleaning wafer cleans process residues from a support surface used in the processing of a substrate in an energized gas. The cleaning wafer has a disc having a liquid precursor derived polyimide layer formed directly on the disc by applying a liquid polyimide precursor to the disc. The polyimide layer has a thickness of less than about 50 microns, and a cleaning surface shaped to match a contour of the support surface. Process residues adhere to the cleaning surface and are cleaned from the support surface upon removal of the cleaning wafer therefrom.

摘要翻译： 清洁晶片从用于在通电气体中的衬底的加工中使用的支撑表面清洗工艺残留物。 清洁晶片具有通过将液体聚酰亚胺前体施加到盘上而具有直接形成在盘上的液体前体衍生的聚酰亚胺层的盘。 聚酰亚胺层具有小于约50微米的厚度，以及成形为匹配支撑表面轮廓的清洁表面。 工艺残留物粘附到清洁表面上，并从其上清除清洁晶片，并从支撑表面清洗。

公开(公告)号：US6125789A

公开(公告)日：2000-10-03

申请号：US16241

申请日：1998-01-30

申请人： Anand Gupta ,  Vijay Parkhe

发明人： Anand Gupta ,  Vijay Parkhe

IPC分类号： G01N15/06 ,  C23C16/52 ,  G01N15/02 ,  H01L21/205 ,  H01L21/66 ,  H05H1/00 ,  C23C16/00

CPC分类号： G01N15/0205

摘要： A method and apparatus for increasing the sensitivity of an in situ particle monitor. A light scattering technique, preferably using laser light, is employed to monitor particle concentrations within the processing chamber of a plasma-based substrate processing system. Particle concentrations are increased in the light field of the sensor by creating an electric or magnetic field in the processing chamber to concentrate the particles suspended therein.

摘要翻译： 一种提高原位粒子监测仪灵敏度的方法和装置。 采用优选使用激光的光散射技术来监测等离子体基底处理系统的处理室内的颗粒浓度。 通过在处理室中产生电场或磁场来浓缩悬浮在其中的颗粒，在传感器的光场中颗粒浓度增加。

公开(公告)号：US06190037B1

公开(公告)日：2001-02-20

申请号：US09253220

申请日：1999-02-19

申请人： Ashok Das ,  Nety Krishna ,  Marc Schweitzer ,  Nalin Patadia ,  Wei Yang ,  Umesh Kelkar ,  Vijay Parkhe ,  Scot Petitt ,  Nitin Khurana

发明人： Ashok Das ,  Nety Krishna ,  Marc Schweitzer ,  Nalin Patadia ,  Wei Yang ,  Umesh Kelkar ,  Vijay Parkhe ,  Scot Petitt ,  Nitin Khurana

IPC分类号： G01J500

CPC分类号： G01J5/041 ,  G01J5/0022

摘要： The present invention provides an apparatus and method for measuring the temperature of a moving radiant object. A probe, such as a pyrometer, is disposed in an opening of a vacuum chamber adjacent a radiation transparent window. The probe defines an optical path which intercepts the radiant object entering or exiting a processing chamber. The radiant object is moved through the optical path and emits electromagnetic waves. The electromagnetic waves are collected by the probe and transmitted to a signal processing unit where the waves are detected and converted to a temperature reading. If desired, the accumulated data may then be used to generate a cooling curve representing the thermal effects experienced by the radiant object. Extrapolation or correlation methods may be used to extend the cooling curve to points in time prior to or after the data collected by the probe.

摘要翻译： 本发明提供了一种用于测量运动辐射物体的温度的装置和方法。 诸如高温计的探针设置在与辐射透明窗相邻的真空室的开口中。 探针限定了拦截进入或离开处理室的辐射物体的光路。 辐射物体通过光路移动并发射电磁波。 电磁波由探头收集并传输到信号处理单元，在该信号处理单元检测波并将其转换为温度读数。 如果需要，则可以使用累积的数据来产生表示辐射物体经历的热效应的冷却曲线。 可以使用外推法或相关方法将冷却曲线延伸到由探针收集的数据之前或之后的时间点。

公开(公告)号：US6117246A

公开(公告)日：2000-09-12

申请号：US200196

申请日：1998-11-25

申请人： Vijay Parkhe ,  Gilbert Hausmann

发明人： Vijay Parkhe ,  Gilbert Hausmann

IPC分类号： B23Q3/15 ,  H01L21/683 ,  C23C16/00

CPC分类号： H01L21/6833

摘要： This invention relates to an apparatus comprising a Johnsen-Rahbek electrostatic chuck having a conductive stand-off pad and a method of fabricating the chuck. More specifically, the stand-off pad is made of a conductive polymeric material, such as a polyimide, which is disposed upon a semiconducting or partially conducting layer of the chuck. The polymeric material has a controlled resistivity within a range of about 10.sup.7 -10.sup.12 ohm-cm, which allows a wafer, or other workpiece, to be supported and retained upon the electrostatic chuck via the Johnsen-Rahbek effect.

摘要翻译： 本发明涉及一种包括具有导电支座的约翰森 - 拉贝克静电卡盘和制造卡盘的方法的装置。 更具体地，支座由诸如聚酰亚胺的导电聚合材料制成，其设置在卡盘的半导体或部分导电层上。 聚合物材料具有约107-1012欧姆 - 厘米范围内的受控电阻率，这允许晶片或其它工件通过约翰森 - 拉贝克效应被支撑并保持在静电卡盘上。

公开(公告)号：US5908334A

公开(公告)日：1999-06-01

申请号：US881528

申请日：1997-06-24

申请人： Aihua Chen ,  Vijay Parkhe ,  Sergio Edelstein

发明人： Aihua Chen ,  Vijay Parkhe ,  Sergio Edelstein

IPC分类号： B23Q3/15 ,  H01L21/683 ,  H02N13/00 ,  H01R13/24

CPC分类号： H01L21/6831 ,  H01L21/6833

摘要： In accordance with the present invention, two types of polymeric dielectric systems useful in construction of a high-temperature electrostatic chuck are disclosed. Further, a high temperature power connection for transmitting power from a supply source to a conductive extension from the electrostatic chuck conductive layer is described. The first polymeric dielectric system provides for the use of polyimide films which do not require an adhesive to adhere to an underlying substrate support platen. The self-adhering polyimide film comprises from one to three layers of polyimide material, wherein at least one outer layer of polyimide material is thermoplastic in nature, for the purpose of adhesion and/or encapsulation. When the film comprises two layers, one of the layers is a non-thermoplastic polyimide having an increased glass transition temperature of about 350.degree. C. or greater. When the film comprises three layers, typically the center layer is the non-thermoplastic polyimide, with the upper and lower layers being a thermoplastic polyimide. The thermoplastic polyimide is placed in contact with a substrate to which it is to bond (such as the surface of a conductive platen used to support a semiconductor workpiece) and heat and pressure are applied to cause the thermoplastic polyimide to flow and bond to the substrate. The second polymeric dielectric system provides for the use of a liquid polyamic acid or modified polyimide precursor which is cured in place against a substrate to provide a polyimide-comprising film adhered to the substrate. Depending on the composition of the polyamic acid or modified polyimide precursor, various degrees of crystallinity can be achieved in the cured, solid polyimide.

摘要翻译： 根据本发明，公开了可用于构建高温静电卡盘的两种类型的聚合介电系统。 此外，描述了用于从静电卡盘导电层将电源从电源传输到导电延伸部分的高温电源连接。 第一聚合物介电系统提供使用不需要粘合剂的聚酰亚胺膜粘附到下面的基底支撑台板上。 自粘聚酰亚胺膜包含一层至三层聚酰亚胺材料，其中至少一层聚酰亚胺材料本质上是热塑性的，用于粘合和/或封装。 当膜包含两层时，其中一层是玻璃化转变温度升高约350℃或更高的非热塑性聚酰亚胺。 当膜包括三层时，通常中心层是非热塑性聚酰亚胺，上层和下层是热塑性聚酰亚胺。 将热塑性聚酰亚胺与要与其键合的基底（例如用于支撑半导体工件的导电平台的表面）接触，并施加热和压力以使热塑性聚酰亚胺流动并结合到基底 。 第二聚合物介电系统提供使用液体聚酰胺酸或改性的聚酰亚胺前体，其固化在基底上以提供粘附到基底上的含聚酰亚胺的膜。 根据聚酰胺酸或改性聚酰亚胺前体的组成，可以在固化的固体聚酰亚胺中获得不同程度的结晶度。

公开(公告)号：US20050252454A1

公开(公告)日：2005-11-17

申请号：US11065702

申请日：2005-02-23

申请人： Vijay Parkhe ,  Matthew Leopold ,  Timothy Ronan ,  Todd Martin ,  Edward Ng ,  Nitin Khurana ,  Song-Moon Suh ,  Richard Fay ,  Christopher Hagerty ,  Michael Rice ,  Darryl Angelo ,  Kurt Ahman ,  Matthew Tsai ,  Steve Sansoni

发明人： Vijay Parkhe ,  Matthew Leopold ,  Timothy Ronan ,  Todd Martin ,  Edward Ng ,  Nitin Khurana ,  Song-Moon Suh ,  Richard Fay ,  Christopher Hagerty ,  Michael Rice ,  Darryl Angelo ,  Kurt Ahman ,  Matthew Tsai ,  Steve Sansoni

IPC分类号： H01L21/683 ,  H01L21/687 ,  C23C16/00

CPC分类号： C23C16/463 ,  H01L21/6831 ,  H01L21/6875 ,  H01L21/68757 ,  Y10T279/23

摘要： A lifting assembly can lift a substrate from a substrate support and transport the substrate. The lift assembly has a hoop sized to fit about a periphery of the substrate support, and a pair of arcuate fins mounted on the hoop, each arcuate fin comprising a pair of opposing ends having ledges that extend radially inward, each ledge having a raised protrusion to lift a substrate so that the substrate contacts substantially only the raised protrusion, thereby minimizing contact with the ledge, when the pair of fins is used to lift the substrate off the substrate support. The lifting assembly and other process chamber components can have a diamond-like coating having interlinked networks of (i) carbon and hydrogen, and (ii) silicon and oxygen. The diamond-like coating has a contact surface having a coefficient of friction of less than about 0.3, a hardness of at least about 8 GPa, and a metal concentration level of less than about 5×1012 atoms/cm2 of metal. The contact surface reduces contamination of a substrate when directly or indirectly contacting a substrate.

摘要翻译： 提升组件可以从衬底支撑件提起衬底并输送衬底。 提升组件具有适合围绕基板支撑件的周边的环形尺寸，以及安装在环上的一对弓形翅片，每个弓形翅片包括一对相对的端部，其具有径向向内延伸的凸缘，每个凸缘具有凸起突起 以提升衬底，使得衬底基本上仅接触凸起突起，从而当使用一对翅片将衬底从衬底支撑件提起时，使与凸缘的接触最小化。 提升组件和其它处理室组件可以具有类似金刚石的涂层，其具有（i）碳和氢的互连网络，和（ii）硅和氧。 类金刚石涂层具有摩擦系数小于约0.3，硬度至少约8GPa，金属浓度小于约5×10 12原子/ cm的接触表面 金属的<2> 2。 当直接或间接接触基底时，接触表面减少了基底的污染。

公开(公告)号：US20050183669A1

公开(公告)日：2005-08-25

申请号：US10786876

申请日：2004-02-24

申请人： Vijay Parkhe ,  Kurt Ahmann ,  Matthew Tsai ,  Steve Sansoni

发明人： Vijay Parkhe ,  Kurt Ahmann ,  Matthew Tsai ,  Steve Sansoni

IPC分类号： H01L21/683 ,  H01L21/687 ,  C23C16/00

CPC分类号： C23C16/463 ,  H01L21/6831 ,  H01L21/6875 ,  H01L21/68757 ,  Y10T279/23

摘要： A substrate support has a support structure and a coating on the support structure having a carbon-hydrogen network. The coating has a contact surface having a coefficient of friction of less than about 0.3 and a hardness of at least about 8 GPa. The contact surface of the coating is capable of reducing abrasion and contamination of a substrate that contacts the contact surface. In one version, the support structure has a dielectric covering an electrode. A plurality of mesas on the dielectric have a coating with the contact surface thereon.

摘要翻译： 衬底支撑件具有支撑结构，并且在具有碳 - 氢网络的支撑结构上具有涂层。 涂层具有摩擦系数小于约0.3，硬度至少约8GPa的接触表面。 涂层的接触表面能够减少与接触表面接触的基底的磨损和污染。 在一个版本中，支撑结构具有覆盖电极的电介质。 电介质上的多个台面具有其上具有接触表面的涂层。