公开(公告)号：US08588629B2

公开(公告)日：2013-11-19

申请号：US13274986

申请日：2011-10-17

申请人： Atsushi Hiroi ,  Katsuya Saito ,  Toshihiko Mitsuhashi

发明人： Atsushi Hiroi ,  Katsuya Saito ,  Toshihiko Mitsuhashi

IPC分类号： G03G15/20 ,  H01H37/00

CPC分类号： G03G15/2039 ,  G03G2215/0135 ,  H01H37/54 ,  H01H2037/549

摘要： A thermally-actuated switch includes a movable member that is provided between a second electrode and a displacement member so as to be movable in a first direction, is pushed at one end by the displacement member in a concave state to push the second electrode at the other end to bring a second contact into contact with a first contact, and is moved in the first direction by an urging force acting on the second electrode due to convex displacement of the displacement member, and a regulating member that regulates movement of the movable member in a second direction orthogonal to the first direction from a transmittable position where a pushing force from the displacement member is capable of being transmitted to the second electrode, and releases the regulation such that the movable member moved in the first direction by the urging force is removed from the transmittable position.

摘要翻译： 一种热致动开关，包括设置在第二电极和位移构件之间以可沿第一方向移动的可动构件，其一端被位移构件以凹状推动，以将第二电极推向 另一端使第二接触件与第一接触件接触，并且由于位移构件的凸起位移而由作用在第二电极上的作用力沿第一方向移动;调节构件，其调节可动构件的运动 在来自所述位移构件的推力能够被传递到所述第二电极的可传递位置的与所述第一方向正交的第二方向上，并且释放所述限制，使得所述可动构件通过所述推动力沿所述第一方向移动， 从可传输位置移除。

公开(公告)号：US08626006B2

公开(公告)日：2014-01-07

申请号：US13267349

申请日：2011-10-06

申请人： Tomohiro Masumura ,  Katsuya Saito ,  Atsushi Hiroi ,  Toshihiko Mitsuhashi

发明人： Tomohiro Masumura ,  Katsuya Saito ,  Atsushi Hiroi ,  Toshihiko Mitsuhashi

IPC分类号： G03G15/20 ,  H01H37/00 ,  H01H37/52

CPC分类号： G03G15/2017 ,  G03G21/1652 ,  H01H37/5409 ,  H01H2037/549

摘要： A heat-responsive switch includes a case member, a deformation member deformed from a shape concave to an inside of the case member to a convex shape in response to a temperature variation, a first electrode having a first contact, a second electrode having a second contact and bringing the second contact into contact with the first contact with the first contact impelled to the deformation member, a first pressing member pressing the first electrode to separate the first contact from the second contact by having an end pressed by the deformation of the deformation member into the convex shape, and a second pressing member pressing the deformation member to restore the deformation member to the concave shape and pressing the second electrode to keep the first contact and the second contact separated by having the end pressed to the deformation member from an outside of the case member.

摘要翻译： 热响应开关包括壳体构件，响应于温度变化从壳体的形状凹入到内部变形为凸形的变形构件，具有第一接触的第一电极，具有第二接触的第二电极 使所述第二触点与所述第一触点接触，所述第一触点与所述第一触点相接触，所述第一触点被推动到所述变形构件;第一按压构件，其按压所述第一电极，以通过使所述第一触点与所述第二触点的变形 以及第二按压部件，其按压所述变形部件，使所述变形部件恢复到所述凹形状，并且通过使所述第一接触部和所述第二接触部的端部从所述变形部件压向所述第二接触部而被分离 外壳成员外。

公开(公告)号：US5151771A

公开(公告)日：1992-09-29

申请号：US646355

申请日：1991-01-28

申请人： Atsushi Hiroi ,  Mitsuhiro Kondo ,  Kinya Ohshima

发明人： Atsushi Hiroi ,  Mitsuhiro Kondo ,  Kinya Ohshima

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H01L23/50

CPC分类号： H01L24/49 ,  H01L23/49827 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165

摘要： A circuit board for mounting an electronic component comprises an electrically insulating substrate having a recess for mounting the electronic component therein, a plurality of first leads disposed in the substrate side-by-side with a space therebetween and a plurality of second leads disposed between the first leads. Each first lead has an outer end projecting outwardly from the substrate and an inner end embedded within the substrate. Each second lead has an outer end outwardly extending from the substrate and an inner end exposed within the recess so that an electrical connection to the electronic component can be provided. One surface of the substrate has attached thereto a plurality of conductors, each having an outer end and an inner end disposed close to the recess for electrical connection to the electronic component. The inner end of the first leads are connected to the outer ends of the conductors by through-hole conductors which penetrate the substrate.

摘要翻译： 用于安装电子部件的电路板包括具有用于将电子部件安装在其中的凹部的电绝缘基板，并排设置在基板中的多个第一引线和设置在该基板之间的多个第二引线 第一线 每个第一引线具有从基板向外突出的外端和嵌入基板内的内端。 每个第二引线具有从基板向外延伸的外端和露出在凹槽内的内端，使得可以提供与电子部件的电连接。 衬底的一个表面附接有多个导体，每个导体具有外端和靠近凹部设置的内端，用于与电子部件电连接。 第一引线的内端通过穿透基板的通孔导体连接到导体的外端。

公开(公告)号：US5203078A

公开(公告)日：1993-04-20

申请号：US707627

申请日：1991-05-30

申请人： Chiaki Nakanishi ,  Atsushi Hiroi ,  Yoji Yanagawa

发明人： Chiaki Nakanishi ,  Atsushi Hiroi ,  Yoji Yanagawa

IPC分类号： B42D15/10 ,  G06K19/077 ,  H05K3/24 ,  H05K3/28 ,  H05K3/40

CPC分类号： G06K19/077 ,  B42D25/00 ,  B42D25/30 ,  G06K19/07743 ,  H05K3/4007 ,  H05K3/4015 ,  B42D2033/46 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09845 ,  H05K2203/1572 ,  H05K3/243 ,  H05K3/281 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49149

摘要： This invention relates to a printed wiring board (10) for IC cards to be built in or fitted to a contact type IC card, that is, an IC card having external contact terminals. The present invention is to provide a printed wiring board (10) for IC cards wherein bumps (20) are formed in a part of a conductor circuit (13) of this printed wiring board (10) for IC cards and are made external contact terminals, futhermore wherein only the contact surfaces of the external contact terminals are exposed on the surface of the IC card (30) and the surfaces of the external contact terminals and the surface of an over sheet (14) are made to be on the same plane level, so that, in case the IC card (30) is bent, an IC module (12) may be perfectly prevented from springing out and further the electric contact reliability of the external contact terminal may be also high.

摘要翻译： 本发明涉及一种用于IC卡的印刷电路板（10），该印刷电路板（10）将内置于接触型IC卡中或装配到接触型IC卡中，即具有外部接触端子的IC卡。 本发明提供一种用于IC卡的印刷电路板（10），其中凸起（20）形成在用于IC卡的该印刷线路板（10）的导体电路（13）的一部分中，并且被制成外部接触端子 另外，其中只有外部接触端子的接触表面暴露在IC卡（30）的表面上，并且外部接触端子的表面和覆盖片（14）的表面被制成在同一平面上 使得在IC卡（30）弯曲的情况下，可以完全防止IC模块（12）弹出，并且进一步地，外部接触端子的电接触可靠性也可能高。

公开(公告)号：US5530204A

公开(公告)日：1996-06-25

申请号：US116699

申请日：1993-09-07

申请人： Mitsuhiro Kondo ,  Atsushi Hiroi ,  Kinya Ohshima

发明人： Mitsuhiro Kondo ,  Atsushi Hiroi ,  Kinya Ohshima

IPC分类号： H01L23/50 ,  H01L23/495 ,  H01L23/498 ,  H05K3/40 ,  H01L23/02

CPC分类号： H05K3/4092 ,  H01L23/49531 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181

摘要： An electronic-parts mounting board frame is formed by assembling a plurality of electronic-parts mounting boards into a single frame. The mounting boards may be electrically connected to the frame by separate inner and outer lead frames, the former being formed in the mounting boards and the latter being integral with the frame.

摘要翻译： 通过将多个电子部件安装板组装成单个框架来形成电子部件安装板框架。 安装板可以通过分开的内部和外部引线框架电连接到框架，前者形成在安装板中，后者与框架成一体。

公开(公告)号：US5252784A

公开(公告)日：1993-10-12

申请号：US888812

申请日：1992-05-27

申请人： Takuji Asai ,  Mitsuhiro Kondo ,  Atsushi Hiroi ,  Kinya Ohshima

发明人： Takuji Asai ,  Mitsuhiro Kondo ,  Atsushi Hiroi ,  Kinya Ohshima

IPC分类号： H01L23/495 ,  H01L23/498 ,  H05K3/40 ,  H05K1/00

CPC分类号： H01L23/49861 ,  H01L23/49531 ,  H01L23/49811 ,  H01L23/49822 ,  H05K3/4092 ,  H01L2224/48091 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181

摘要： An electronic-parts mounting board frame sheet includes a plurality of electronic-parts mounting board frames serially coupled into a single sheet. Each frame includes an electronic-parts mounting board with an insulating substrate, grouped leads protruding from the insulating substrate, an outer frame integrally formed with the grouped leads, and pilot holes, located in the outer frame, for indicating the positions of the grouped leads of the electronic-parts mounting board. Further, the grouped leads and the outer frame of each electronic-parts mounting board frame are integrally formed.

摘要翻译： 电子部件安装板框架板包括串联连接到单个片材中的多个电子部件安装板框架。 每个框架包括具有绝缘基板的电子部件安装板，从绝缘基板突出的分组引线，与分组引线一体形成的外框架和位于外框架中的引导孔，用于指示分组引线的位置 的电子部件安装板。 此外，每个电子部件安装板框架的分组引线和外框架一体形成。

公开(公告)号：US4908933A

公开(公告)日：1990-03-20

申请号：US344608

申请日：1989-04-28

申请人： Katsumi Sagisaka ,  Atsushi Hiroi ,  Mitsuhiro Kondo ,  Takeshi Takeyama

发明人： Katsumi Sagisaka ,  Atsushi Hiroi ,  Mitsuhiro Kondo ,  Takeshi Takeyama

IPC分类号： H01L23/12 ,  H01L21/00 ,  H01L23/498 ,  H01L23/50 ,  H05K1/05 ,  H05K3/20 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC分类号： H01L21/67144 ,  H01L23/49861 ,  H05K3/4092 ,  H05K3/445 ,  H05K3/4641 ,  H01L2924/0002 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/0397 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K2203/0264 ,  H05K3/202 ,  H05K3/427 ,  H05K3/429 ,  Y10T29/49121

摘要： A method of manufacturing a substrate for mounting electronic components according to this invention comprises the steps of forming a mask on a portion to be electrically connected to an exterior of a lead frame, of forming resin layers on both side surfaces of the lead frame by prepregs or the like, of removing the resin layer on the mask, and of removing the mask, and in the substrate for mounting electronic components manufactured according to this method, the substrate is integrally formed with the lead frame, and the electrical connection of the substrate to the lead frame is performed by through hole plating without using fine metal wiring.

摘要翻译： 根据本发明的用于安装电子部件的基板的制造方法包括以下步骤：在引线框架的外部电连接的部分上形成掩模，通过预浸料在引线框架的两个侧表面上形成树脂层 等等，除去掩模上的树脂层和除去掩模，并且在用于安装根据该方法制造的电子部件的基板中，基板与引线框架一体地形成，并且基板的电连接 通过通孔电镀而不使用精细的金属布线来进行引线框。

公开(公告)号：US5274197A

公开(公告)日：1993-12-28

申请号：US797032

申请日：1991-11-25

申请人： Mitsuhiro Kondo ,  Atsushi Hiroi ,  Kinya Ohshima

发明人： Mitsuhiro Kondo ,  Atsushi Hiroi ,  Kinya Ohshima

IPC分类号： H01L23/50 ,  H01L23/495 ,  H01L23/498 ,  H05K3/40 ,  H05K1/00

CPC分类号： H05K3/4092 ,  H01L23/49531 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181

摘要： An electronic-parts mounting board frame is formed by assembling a plurality of electronic-parts mounting boards into a single frame. The mounting boards may be electrically connected to the frame by separate inner and outer lead frames, the former being formed in the mounting boards and the latter being integral with the frame.

摘要翻译： 通过将多个电子部件安装板组装成单个框架来形成电子部件安装板框架。 安装板可以通过分开的内部和外部引线框架电连接到框架，前者形成在安装板中，后者与框架成一体。

公开(公告)号：US5206188A

公开(公告)日：1993-04-27

申请号：US700251

申请日：1991-05-15

申请人： Atsushi Hiroi ,  Mitsuhiro Kondo ,  Kinya Ohshima

发明人： Atsushi Hiroi ,  Mitsuhiro Kondo ,  Kinya Ohshima

IPC分类号： H01L23/498

CPC分类号： H01L23/49827 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  Y10T29/49121 ,  Y10T29/49158

摘要： A method for mounting an electronic component comprising providing an electrically insulating substrate having a recess for mounting the electronic component therein, a plurality of first leads disposed in the substrate side-by-side with a space therebetween and a plurality of second leads disposed between the first leads. Each first lead has an outer end projecting outwardly from the substrate and an inner end embedded within the substrate. Each second lead has an outer end outwardly extending from the substrate and an inner end exposed within the recess so that an electrical connection to the electronic component can be provided. One surface of the substrate has attached thereto a plurality of conductors, each having an outer end and an inner end disposed close to the recess for electrical connection to the electronic component. The inner ends of the first leads are connected to the outer ends of the conductors by through-hole conductors which penetrate the substrate.

摘要翻译： 一种用于安装电子部件的方法，包括提供具有用于将所述电子部件安装在其中的凹部的电绝缘基板，多个第一引线并排设置在所述基板中，并且多个第二引线设置在所述第一引线之间， 第一线 每个第一引线具有从基板向外突出的外端和嵌入基板内的内端。 每个第二引线具有从基板向外延伸的外端和露出在凹槽内的内端，使得可以提供与电子部件的电连接。 衬底的一个表面附接有多个导体，每个导体具有外端和靠近凹部设置的内端，用于与电子部件电连接。 第一引线的内端通过穿透基板的通孔导体连接到导体的外端。