公开(公告)号：US4908933A

公开(公告)日：1990-03-20

申请号：US344608

申请日：1989-04-28

申请人： Katsumi Sagisaka ,  Atsushi Hiroi ,  Mitsuhiro Kondo ,  Takeshi Takeyama

发明人： Katsumi Sagisaka ,  Atsushi Hiroi ,  Mitsuhiro Kondo ,  Takeshi Takeyama

IPC分类号： H01L23/12 ,  H01L21/00 ,  H01L23/498 ,  H01L23/50 ,  H05K1/05 ,  H05K3/20 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC分类号： H01L21/67144 ,  H01L23/49861 ,  H05K3/4092 ,  H05K3/445 ,  H05K3/4641 ,  H01L2924/0002 ,  H05K1/056 ,  H05K2201/0352 ,  H05K2201/0397 ,  H05K2201/0919 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K2203/0264 ,  H05K3/202 ,  H05K3/427 ,  H05K3/429 ,  Y10T29/49121

摘要： A method of manufacturing a substrate for mounting electronic components according to this invention comprises the steps of forming a mask on a portion to be electrically connected to an exterior of a lead frame, of forming resin layers on both side surfaces of the lead frame by prepregs or the like, of removing the resin layer on the mask, and of removing the mask, and in the substrate for mounting electronic components manufactured according to this method, the substrate is integrally formed with the lead frame, and the electrical connection of the substrate to the lead frame is performed by through hole plating without using fine metal wiring.

摘要翻译： 根据本发明的用于安装电子部件的基板的制造方法包括以下步骤：在引线框架的外部电连接的部分上形成掩模，通过预浸料在引线框架的两个侧表面上形成树脂层 等等，除去掩模上的树脂层和除去掩模，并且在用于安装根据该方法制造的电子部件的基板中，基板与引线框架一体地形成，并且基板的电连接 通过通孔电镀而不使用精细的金属布线来进行引线框。

公开(公告)号：US5088008A

公开(公告)日：1992-02-11

申请号：US589522

申请日：1990-09-28

申请人： Takeshi Takeyama ,  Mitsuhiro Kondo

发明人： Takeshi Takeyama ,  Mitsuhiro Kondo

IPC分类号： H01L23/36 ,  B23K26/36 ,  H01L21/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40

CPC分类号： H05K3/4092 ,  B23K26/362 ,  H01L21/4803 ,  H01L23/49827 ,  H05K3/0035 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/157 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K2203/0264 ,  Y10T29/49121 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  Y10T428/24917

摘要： According to the present invention, a circuit board for mounting electronic components wherein a metal layer united with a substrate layer has a predetermined portion exposed is manufactured by:(1) arranging a mask between the substrate layer and a part of the metal layer to become the exposed part, and thereafter unitizing the substrate layer with the metal layer;(2) projecting a laser beam onto that part of the substrate layer on the metal layer which surrounds the mask, in a direction from a side of the substrate layer to a side of the metal layer, thereby to cut away the part of the substrate layer surrounding the mask; and(3) stripping off that part of the substrate layer which remains on the mask, together with the mask.

摘要翻译： 根据本发明，通过在衬底层和金属层之间设置掩模来制造包括金属层与包括暴露的金属层的预定部分的基底层结合在一起的金属层的电路板。 将基板层和金属层与其间的掩模进行曝光和结合，在掩模的周围将激光束投射到基板层上，以切除与掩模相邻的基板层，并剥离基板的该部分 保留在面罩和面具上的层。

公开(公告)号：US5022960A

公开(公告)日：1991-06-11

申请号：US460004

申请日：1990-01-02

申请人： Takeshi Takeyama ,  Mitsuhiro Kondo

发明人： Takeshi Takeyama ,  Mitsuhiro Kondo

IPC分类号： H01L23/36 ,  B23K26/36 ,  H01L21/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40

CPC分类号： H05K3/4092 ,  B23K26/362 ,  H01L21/4803 ,  H01L23/49827 ,  H05K3/0035 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/157 ,  H05K2201/09754 ,  H05K2201/10924 ,  H05K2203/0264 ,  Y10T29/49121 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24322 ,  Y10T428/24917

摘要： According to the present invention, a circuit board for mounting electronic components including a metal layer united with a substrate layer with a predetermined portion of the metal layer exposed is manufactured by disposing a mask between a substrate layer and a metal layer where the metal layer is to be exposed and uniting the substrate layer and the metal layer with the mask therebetween, projecting a laser beam onto the substrate layer at the periphery of the mask to cut away the substrate layer adjacent to the mask, and stripping off that part of the substrate layer which remains on the mask and the mask.

摘要翻译： 根据本发明，通过在衬底层和金属层之间设置掩模来制造包括金属层与包括暴露的金属层的预定部分的基底层结合在一起的金属层的电路板。 将基板层和金属层与其间的掩模进行曝光和结合，在掩模的周围将激光束投射到基板层上，以切除与掩模相邻的基板层，并剥离基板的该部分 保留在面罩和面具上的层。