公开(公告)号：US20100243311A1

公开(公告)日：2010-09-30

申请号：US12607666

申请日：2009-10-28

申请人： Ayao NIKI ,  Atsushi Ishida ,  Ryojiro Tominaga

发明人： Ayao NIKI ,  Atsushi Ishida ,  Ryojiro Tominaga

IPC分类号： H01R12/04 ,  H01K3/10

CPC分类号： H05K3/4661 ,  H05K3/0035 ,  H05K3/387 ,  H05K3/422 ,  H05K3/4682 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2203/1168

摘要： A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer.

摘要翻译： 一种用金属膜制造衬底的方法包括制备具有第一和第二表面的第一绝缘层，在第一绝缘层的第一表面上形成第一导电电路，在第一绝缘层的第一表面上形成第一绝缘层， 第一导电电路，具有第一和第二表面的第二绝缘层，在所述第二绝缘层中形成从所述第一表面向所述第一导电电路渐缩的穿透孔，在所述穿透孔的内壁上形成含有聚合引发剂和 聚合性化合物，通过照射该组合物，在该聚合物上涂布电镀催化剂，在该贯通孔的内壁上形成聚合物，在该贯通孔的内壁上形成电镀金属膜。 第一绝缘层的第一表面面向第二绝缘层的第二表面。

公开(公告)号：US20100243305A1

公开(公告)日：2010-09-30

申请号：US12732635

申请日：2010-03-26

申请人： Ayao NIKI ,  Atsushi Ishida ,  Ryojiro Tominaga

发明人： Ayao NIKI ,  Atsushi Ishida ,  Ryojiro Tominaga

IPC分类号： H05K1/00 ,  C08F2/48 ,  B05D3/06

CPC分类号： H05K3/0032 ,  C25D5/02 ,  C25D7/12 ,  C25D7/123 ,  H05K3/387 ,  H05K3/422 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2203/095 ,  H05K2203/1572 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method for manufacturing a substrate with a metal film includes preparing an insulative substrate having the first surface and the second surface on the opposite side of the first surface, forming in the insulative substrate a penetrating hole having the inner wall tapering from the first surface of the insulative substrate toward the second surface, forming a layer of a composition containing a polymerization initiator and a polymerizable compound on the inner wall of the penetrating hole, irradiating the layer of the composition with energy such that a polymer is formed on the inner wall of the penetrating hole, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole.

摘要翻译： 一种用金属膜制造衬底的方法包括制备在第一表面的相对侧具有第一表面和第二表面的绝缘衬底，在绝缘衬底中形成具有从第一表面的第一表面逐渐变细的内壁的穿透孔 所述绝缘基板朝向所述第二表面，在所述穿透孔的内壁上形成含有聚合引发剂和可聚合化合物的组合物层，用能量照射所述组合物层，使得聚合物形成在所述聚合物的内壁上 穿孔，在聚合物上涂布电镀催化剂，在贯通孔的内壁上形成电镀金属膜。

公开(公告)号：US20110085306A1

公开(公告)日：2011-04-14

申请号：US12901104

申请日：2010-10-08

申请人： Ayao NIKI

发明人： Ayao NIKI

IPC分类号： H05K1/02

CPC分类号： H05K1/115 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49162

摘要： A coreless multilayer printed wiring board including a coreless layer having an opening, a conductive film formed on an upper surface of the coreless layer and closing one end of the opening of the coreless layer, a via-hole formed in the opening of the coreless layer, a first resin layer formed on the coreless layer and the conductive film and having an opening reaching to the conductive film, a via-hole formed in the opening of the first resin layer, a second resin layer formed on the upper surface of the first resin layer and having an opening, a via-hole formed in the opening of the second resin layer. The via-holes formed in the first and second resin layers are open in the direction opposite to the direction in which the via-hole formed in the coreless layer is open.

摘要翻译： 一种无芯多层印刷线路板，包括具有开口的无芯层，形成在无芯层的上表面上并封闭无芯层的开口的一端的导电膜，形成在无芯层的开口中的通孔 形成在无芯层和导电膜上并具有到达导电膜的开口的第一树脂层，形成在第一树脂层的开口中的通孔，形成在第一树脂层的上表面上的第二树脂层 树脂层并具有开口，形成在第二树脂层的开口中的通孔。 形成在第一和第二树脂层中的通孔在与形成在无芯层中的通孔开放的方向相反的方向上是开放的。

公开(公告)号：US20110302779A1

公开(公告)日：2011-12-15

申请号：US13216305

申请日：2011-08-24

申请人： Ayao NIKI ,  Kazuhisa Kitajima

发明人： Ayao NIKI ,  Kazuhisa Kitajima

IPC分类号： H01K3/10

CPC分类号： H05K3/4682 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/06 ,  H05K3/108 ,  H05K2201/096 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A method for manufacturing a printed wiring board including providing a support member having a metal surface, securing a metal foil to the metal surface such that the metal foil is joined or bonded to a peripheral portion of the metal surface, forming a resin insulation layer on the metal foil secured on the metal surface, forming an opening for a via conductor in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the opening a via conductor electrically connecting the conductive circuit and the metal foil such that a laminated sheet body is formed, and cutting a portion of the laminated sheet body inside the peripheral portion of the metal surface of the support member such that the metal foil releases the portion of the laminated sheet body from the support member.

摘要翻译： 一种制造印刷线路板的方法，包括：提供具有金属表面的支撑构件，将金属箔固定到金属表面，使得金属箔接合或结合到金属表面的周边部分，形成树脂绝缘层 金属箔固定在金属表面上，在树脂绝缘层中形成通孔导体的开口，在树脂绝缘层上形成导电电路，在开口中形成电连接导电电路和金属箔的通孔导体，使得 形成层压片体，并且在支撑构件的金属表面的周边部分内切割层压片体的一部分，使得金属箔从支撑构件释放层压片体的部分。

公开(公告)号：US20100095523A1

公开(公告)日：2010-04-22

申请号：US12640076

申请日：2009-12-17

申请人： Ayao NIKI

发明人： Ayao NIKI

IPC分类号： H05K3/10

CPC分类号： H05K1/115 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49162

摘要： A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes.

摘要翻译： 多层印刷线路板包括一个或多个具有通孔的树脂层和具有通孔的芯层。 在一个或多个树脂层中形成的通孔在与芯层中形成的通路孔打开的方向相反的方向上开口。 一种制造多层印刷线路板的方法包括制备单面或双面覆铜层压板的步骤; 通过加工覆铜层压板来形成焊盘的步骤; 在覆铜层压板的上表面上形成树脂层的步骤，在树脂层中形成通孔的开口，然后形成通孔; 以及在覆铜层压板的下表面中形成用于通孔的开口，然后形成通孔的步骤。

公开(公告)号：US20120181072A1

公开(公告)日：2012-07-19

申请号：US13434960

申请日：2012-03-30

申请人： Ayao NIKI ,  Kazuhisa Kitajima

发明人： Ayao NIKI ,  Kazuhisa Kitajima

IPC分类号： H05K1/09 ,  H05K3/42 ,  H05K3/28

CPC分类号： H05K3/4682 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/06 ,  H05K3/108 ,  H05K2201/096 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer.

摘要翻译： 印刷布线板包括具有导电电路的多个导电层，具有开口的多个树脂绝缘层，并且包括位于树脂绝缘层的最外层的最上层的树脂绝缘层，分别形成在开口中的多个通孔导体，并将导电 导电层中的电路，以及由铜箔形成并定位成装载电子元件的多个元件负载焊盘。 交替层叠树脂绝缘层和导电层，并且在最上层的树脂绝缘层上形成元件负荷垫。

公开(公告)号：US20110296681A1

公开(公告)日：2011-12-08

申请号：US13209483

申请日：2011-08-15

申请人： Ayao NIKI ,  Kazuhisa KITAJIMA

发明人： Ayao NIKI ,  Kazuhisa KITAJIMA

IPC分类号： H01K3/10

CPC分类号： H05K3/4682 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/06 ,  H05K3/108 ,  H05K2201/096 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming openings in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the openings via conductors to electrically connect the conductive circuit and the metal foil, separating the support board and the metal foil, and forming from the metal foil external terminals to electrically connect to another substrate or electronic component.

摘要翻译： 一种印刷电路板的制造方法，其特征在于，具备：金属箔固定在所述支撑基板上的支撑板，在所述金属箔上形成树脂绝缘层，在所述树脂绝缘层上形成开口，在所述树脂绝缘层上形成导电电路 层，通过导体在开口中形成以电连接导电电路和金属箔，分离支撑板和金属箔，以及从金属箔外部端子形成以电连接到另一基板或电子部件。

公开(公告)号：US20110220399A1

公开(公告)日：2011-09-15

申请号：US13114693

申请日：2011-05-24

申请人： Ayao NIKI

发明人： Ayao NIKI

IPC分类号： H05K1/00

CPC分类号： H05K1/115 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2203/0554 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49162

摘要： A multilayer printed wiring board includes one or more resin layers having via-holes and a core layer having via-holes. The via-holes formed in the one or more resin layers are open in the direction opposite to the direction in which the via-holes formed in the core layer are open. A method for manufacturing a multilayer printed wiring board includes a step of preparing a single- or double-sided copper-clad laminate; a step of forming lands by processing the copper-clad laminate; a step of forming a resin layer on the upper surface of the copper-clad laminate, forming openings for via-holes in the resin layer, and then forming the via-holes; and a step of forming openings for via-holes in the lower surface of the copper-clad laminate and then forming the via-holes.

摘要翻译： 多层印刷线路板包括一个或多个具有通孔的树脂层和具有通孔的芯层。 在一个或多个树脂层中形成的通孔在与芯层中形成的通路孔打开的方向相反的方向上开口。 一种制造多层印刷线路板的方法包括制备单面或双面覆铜层压板的步骤; 通过加工覆铜层压板来形成焊盘的步骤; 在覆铜层压板的上表面上形成树脂层的步骤，在树脂层中形成通孔的开口，然后形成通孔; 以及在覆铜层压板的下表面中形成用于通孔的开口，然后形成通孔的步骤。