公开(公告)号：US20100059870A1

公开(公告)日：2010-03-11

申请号：US12491096

申请日：2009-06-24

申请人： Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

发明人： Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/3735 ,  H01L23/49531 ,  H01L23/49586 ,  H01L23/62 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.

摘要翻译： 提供了包括基板，至少一个芯片，多个引线，散热装置，模塑料和至少一个绝缘片的芯片封装结构。 芯片设置在基板上。 引线电连接到基板。 具有顶表面的模制化合物封装芯片，衬底和引线的一部分。 散热装置设置在模塑料的顶表面上。 布置在散热装置与至少一个引线之间的绝缘片具有将绝缘片划分为设置在模制化合物上的主体和从主体延伸的弯曲部的弯曲线。

公开(公告)号：US08247891B2

公开(公告)日：2012-08-21

申请号：US12491096

申请日：2009-06-24

申请人： Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

发明人： Chau-Chun Wen ,  Da-Jung Chen ,  Bau-Ru Lu ,  Chun-Hsien Lu

IPC分类号： H01L23/495 ,  H01L23/10 ,  H01L23/34 ,  H01L23/28

CPC分类号： H01L23/4334 ,  H01L23/3735 ,  H01L23/49531 ,  H01L23/49586 ,  H01L23/62 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.

摘要翻译： 提供了包括基板，至少一个芯片，多个引线，散热装置，模塑料和至少一个绝缘片的芯片封装结构。 芯片设置在基板上。 引线电连接到基板。 具有顶表面的模制化合物封装芯片，衬底和引线的一部分。 散热装置设置在模塑料的顶表面上。 布置在散热装置与至少一个引线之间的绝缘片具有将绝缘片划分为设置在模制化合物上的主体和从主体延伸的弯曲部的弯曲线。

公开(公告)号：US07982304B2

公开(公告)日：2011-07-19

申请号：US12540021

申请日：2009-08-12

申请人： Bau-Ru Lu ,  Chau-Chun Wen ,  Da-Jung Chen ,  Chun-Hsien Lu

发明人： Bau-Ru Lu ,  Chau-Chun Wen ,  Da-Jung Chen ,  Chun-Hsien Lu

IPC分类号： H01L23/48

CPC分类号： H01L23/49811 ,  H01L23/36 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip package structure including a substrate, at least one chip, a heat dissipation device, at least one first conductive bar, a molding compound, and at least one second conductive bar is provided. The chip and the heat dissipation device are respectively disposed on a first and a second surface of the substrate. The first conductive bar has two opposite end surfaces, wherein one end surface is disposed on the first surface of the substrate, the other end surface is extended away from the substrate, and a fastening slot is disposed between the two end surfaces and passes through the other end surface. The molding compound encapsulates the substrate, the chip, part of the heat dissipation device, and the first conductive bar. The second conductive bar is disposed on one surface of the molding compound and has a protrusion portion fastened to the fastening slot of the first conductive bar.

摘要翻译： 提供一种芯片封装结构，包括基板，至少一个芯片，散热装置，至少一个第一导电棒，模塑料和至少一个第二导电棒。 芯片和散热装置分别设置在基板的第一和第二表面上。 第一导电棒具有两个相对的端面，其中一个端面设置在基板的第一表面上，另一端表面远离基板延伸，并且紧固槽设置在两个端面之间并穿过 另一端面。 模塑料封装基板，芯片，散热装置的一部分和第一导电棒。 第二导电棒设置在模制化合物的一个表面上，并且具有紧固到第一导电棒的紧固槽的突起部分。

公开(公告)号：US20100117216A1

公开(公告)日：2010-05-13

申请号：US12540021

申请日：2009-08-12

申请人： BAU-RU LU ,  Chau-Chun Wen ,  Da-Jung Chen ,  Chun-Hsien Lu

发明人： BAU-RU LU ,  Chau-Chun Wen ,  Da-Jung Chen ,  Chun-Hsien Lu

IPC分类号： H01L23/48

CPC分类号： H01L23/49811 ,  H01L23/36 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A chip package structure including a substrate, at least one chip, a heat dissipation device, at least one first conductive bar, a molding compound, and at least one second conductive bar is provided. The chip and the heat dissipation device are respectively disposed on a first and a second surface of the substrate. The first conductive bar has two opposite end surfaces, wherein one end surface is disposed on the first surface of the substrate, the other end surface is extended away from the substrate, and a fastening slot is disposed between the two end surfaces and passes through the other end surface. The molding compound encapsulates the substrate, the chip, part of the heat dissipation device, and the first conductive bar. The second conductive bar is disposed on one surface of the molding compound and has a protrusion portion fastened to the fastening slot of the first conductive bar.

摘要翻译： 提供一种芯片封装结构，包括基板，至少一个芯片，散热装置，至少一个第一导电棒，模塑料和至少一个第二导电棒。 芯片和散热装置分别设置在基板的第一和第二表面上。 第一导电棒具有两个相对的端面，其中一个端面设置在基板的第一表面上，另一端表面远离基板延伸，并且紧固槽设置在两个端面之间并穿过 另一端面。 模塑料封装基板，芯片，散热装置的一部分和第一导电棒。 第二导电棒设置在模制化合物的一个表面上，并且具有紧固到第一导电棒的紧固槽的突起部分。

公开(公告)号：US20080179722A1

公开(公告)日：2008-07-31

申请号：US11930183

申请日：2007-10-31

申请人： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

发明人： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

IPC分类号： H01L23/495

CPC分类号： H05K1/141 ,  H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0262 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/10166 ,  H05K2201/10924 ,  H05K2201/10969 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic package structure including a first carrier, at least one first electronic element, at least one second electronic element, and an encapsulant is provided. The first carrier has a first carrying surface and a second carrying surface opposite to the first carrying surface. The first electronic element is disposed on the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The encapsulant at least covers the first electronic element, the second electronic element, and a part of the first carrier. The space utilization rate of the first carrier of the electronic package structure is higher.

摘要翻译： 提供了包括第一载体，至少一个第一电子元件，至少一个第二电子元件和密封剂的电子封装结构。 第一载体具有与第一载体表面相对的第一载体表面和第二载体表面。 第一电子元件设置在第一承载表面上并电连接到第一载体。 第二电子元件设置在第二承载表面上并电连接到第一载体。 密封剂至少覆盖第一电子元件，第二电子元件和第一载体的一部分。 电子封装结构的第一载体的空间利用率更高。

公开(公告)号：US07551455B2

公开(公告)日：2009-06-23

申请号：US11482370

申请日：2006-07-07

申请人： Da-Jung Chen ,  Yi-Cheng Lin ,  Bau-Ru Lu ,  Yi-Min Fang ,  Chau-Chun Wen ,  Chun-Tiao Liu

发明人： Da-Jung Chen ,  Yi-Cheng Lin ,  Bau-Ru Lu ,  Yi-Min Fang ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC分类号： H05K7/00

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.

摘要翻译： 提供包括第一载体，第二载体，至少第一电子部件和至少第二电子部件的封装结构。 第二载体电连接到第一载体。 第一电子部件设置在第一载体上并电连接到第一载体。 第二电子部件设置在第二载体上并电连接到第二载体。

公开(公告)号：US20080180921A1

公开(公告)日：2008-07-31

申请号：US11684645

申请日：2007-03-12

申请人： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

发明人： Da-Jung Chen ,  Chung-Shiun Fang ,  Bau-Ru Lu ,  Yi-Cheng Lin ,  Chau-Chun Wen

IPC分类号： H05K7/00

CPC分类号： H01L23/49575 ,  H01L23/495 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic package structure including a first carrier, at least one first electronic element, and a second electronic element is provided. The first carrier has a first carrying surface and a second carrying surface opposite to each other. The first electronic element is disposed above the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The volume of the second electronic element is larger than that of the first electronic element.

摘要翻译： 提供包括第一载体，至少一个第一电子元件和第二电子元件的电子封装结构。 第一载体具有彼此相对的第一承载表面和第二承载表面。 第一电子元件设置在第一承载表面上方并电连接到第一载体。 第二电子元件设置在第二承载表面上并电连接到第一载体。 第二电子元件的体积大于第一电子元件的体积。

公开(公告)号：US20070257377A1

公开(公告)日：2007-11-08

申请号：US11482370

申请日：2006-07-07

申请人： Da-Jung Chen ,  Yi-Cheng Lin ,  Bau-Ru Lu ,  Yi-Min Fang ,  Chau-Chun Wen ,  Chun-Tiao Liu

发明人： Da-Jung Chen ,  Yi-Cheng Lin ,  Bau-Ru Lu ,  Yi-Min Fang ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC分类号： H01L23/48

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4911 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T29/49121 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.

摘要翻译： 提供包括第一载体，第二载体，至少第一电子部件和至少第二电子部件的封装结构。 第二载体电连接到第一载体。 第一电子部件设置在第一载体上并电连接到第一载体。 第二电子部件设置在第二载体上并电连接到第二载体。

公开(公告)号：US20080303125A1

公开(公告)日：2008-12-11

申请号：US11847351

申请日：2007-08-30

申请人： DA-JUNG CHEN ,  Chun-Tiao Liu ,  Chau-Chun Wen

发明人： DA-JUNG CHEN ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC分类号： H01L23/495

CPC分类号： H01L23/495 ,  H01L23/49555 ,  H01L23/49575 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A three-dimensional package structure includes an energy storage element, a semiconductor package body and a shielding layer. The semiconductor package body has a plurality of second conductive elements and at least one control device inside. The energy storage element is disposed on the semiconductor package body. The energy storage element including a magnetic body is electrically connected to the second conductive elements. The semiconductor package body or the energy storage element has a plurality of first conductive elements to be electrically connected to an outside device. The shielding layer is disposed between the control component and at least part of the magnetic body to inhibit or reduce EMI (Electro-Magnetic Interference) from the energy storage element and to get a tiny package structure. The three-dimensional package structure is applicable to a POL (Point of Load) converter.

摘要翻译： 三维封装结构包括能量存储元件，半导体封装体和屏蔽层。 半导体封装主体具有多个第二导电元件和至少一个控制装置。 储能元件设置在半导体封装主体上。 包括磁性体的能量存储元件电连接到第二导电元件。 半导体封装体或能量存储元件具有多个第一导电元件以与外部器件电连接。 屏蔽层设置在控制部件和磁体的至少一部分之间以抑制或减少来自能量存储元件的EMI（电磁干扰）并获得微小的封装结构。 三维封装结构适用于POL（负载点）转换器。

公开(公告)号：US09601412B2

公开(公告)日：2017-03-21

申请号：US13612852

申请日：2012-09-13

申请人： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

发明人： Da-Jung Chen ,  Chun-Tiao Liu ,  Chau-Chun Wen

IPC分类号： H01L23/495 ,  H01L23/552 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L25/162 ,  H01L23/04 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/49555 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L23/49861 ,  H01L23/552 ,  H01L23/645 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention discloses a three-dimensional package structure. The first conductive element comprises a top surface, a bottom surface and a lateral surface. The conductive pattern disposed on the top surface of the first conductive element. A second conductive element is disposed on the conductive pattern. The first conductive element is electrically connected to the conductive pattern, and the second conductive element is electrically connected to the conductive pattern. In one embodiment, the shielding layer is a portion of the patterned conductive layer.