公开(公告)号：US08232144B2

公开(公告)日：2012-07-31

申请号：US12560640

申请日：2009-09-16

申请人： Bernhard P Lange ,  Anthony L Coyle ,  Jeffrey G Holloway

发明人： Bernhard P Lange ,  Anthony L Coyle ,  Jeffrey G Holloway

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  H01L21/4821 ,  H01L23/3121 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/10689 ,  H05K2201/10931 ,  H05K2201/10969 ,  H05K2201/10984 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed herein is a method of manufacturing a semiconductor package with a solder standoff on lead pads that reach to the edge of the package (non-pullback leads). It includes encapsulating a plurality of die on a lead frame strip. The lead frame strip comprises a plurality of package sites, which further comprises a plurality of lead pads and a die pad. The method also includes forming a channel between the lead pads of nearby package sites without singulating the packages. Another step in the method includes disposing solder on the lead pads, the die pad, or the lead pads and the die pads without substantially covering the channel with solder. The manufacturing method further includes singulating the packages.

摘要翻译： 本文公开了一种制造半导体封装的方法，该半导体封装在引线焊盘上具有焊接位置，该焊盘抵达封装的边缘（非拉回引线）。 它包括将多个管芯封装在引线框架条上。 引线框架条包括多个封装位置，其还包括多个引线焊盘和管芯焊盘。 该方法还包括在附近的封装位置的引线焊盘之间形成通道，而不需要对封装进行分离。 该方法的另一步骤包括在焊盘，芯片焊盘或引线焊盘和裸片焊盘上布置焊料，而基本上不用焊料覆盖焊道。 制造方法还包括将包装分离。

公开(公告)号：US07863098B2

公开(公告)日：2011-01-04

申请号：US12330728

申请日：2008-12-09

申请人： Bernhard P Lange ,  Anthony L Coyle

发明人： Bernhard P Lange ,  Anthony L Coyle

IPC分类号： H01L21/58

CPC分类号： H01L23/4334 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/5286 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2924/2076 ,  H01L2924/20754 ,  H01L2924/00012 ,  H01L2224/05099

摘要： A QFN package and method of making same is provided comprising a substrate having a metal line extending from a connection element on a perimeter region of the substrate to a high current contact pad on interior region of the substrate. A semiconductor chip having an active surface generally faces the interior region of the substrate, wherein a heat-dissipating patterned metal distribution layer is formed over the active surface and electrically connected to an active component thereon. A solder strip electrically and thermally connects the high current contact pad and the metal distribution layer, and a mold compound generally encapsulates the semiconductor chip. The solder strip is generally uniform in depth and surface area, wherein low electrical resistance and inductance is provided between the high current contact pad and the metal distribution layer. An integrated heat sink may be further formed or placed on a passive surface of the chip.

摘要翻译： 提供了一种QFN封装及其制造方法，包括：具有从衬底的周边区域上的连接元件延伸到衬底的内部区域上的高电流接触焊盘的金属线的衬底。 具有活性表面的半导体芯片大致面向衬底的内部区域，其中散热图案化的金属分布层形成在活性表面上并与其上的活性组分电连接。 焊接电极电连接高电流接触焊盘和金属分布层，并且模制化合物通常封装半导体芯片。 焊料条的深度和表面积通常是均匀的，其中在高电流接触焊盘和金属分布层之间提供低电阻和电感。 集成散热器可以进一步形成或放置在芯片的被动表面上。

公开(公告)号：US08053876B2

公开(公告)日：2011-11-08

申请号：US12573196

申请日：2009-10-05

申请人： Steven A Kummerl ,  Bernhard P Lange ,  Anthony L Coyle

发明人： Steven A Kummerl ,  Bernhard P Lange ,  Anthony L Coyle

IPC分类号： H01L23/495 ,  H01L21/00 ,  H05K7/20

CPC分类号： H01L23/4334 ,  H01L23/49537 ,  H01L23/49568 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P1/387 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.

摘要翻译： 根据本发明的实施例，可操作以便于散热的能量的系统包括模具化合物，模具，第一引线框架和第二引线框架。 模具设置在模具化合物内，并且在操作中产生热能。 第一引线框架至少部分地设置在模具化合物内，并且可操作以促进信号的传输。 第二引线框架至少部分地设置在化合物内，至少部分地与第一引线框架分离，并且可操作以便于散热热能。

公开(公告)号：US07808088B2

公开(公告)日：2010-10-05

申请号：US11757514

申请日：2007-06-04

申请人： Bernhard P Lange

发明人： Bernhard P Lange

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49537 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/49551 ,  H01L23/49572 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device comprises a die having a first surface and a second surface, a first leadframe connected to the first surface and the second surface, and a second leadframe connected to the first surface.

摘要翻译： 半导体器件包括具有第一表面和第二表面的管芯，连接到第一表面和第二表面的第一引线框架和连接到第一表面的第二引线框架。