公开(公告)号：US20100019266A1

公开(公告)日：2010-01-28

申请号：US12523487

申请日：2008-01-23

申请人： Bert Braune ,  Gertrud Kraeuter

发明人： Bert Braune ,  Gertrud Kraeuter

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L33/507 ,  H01L33/483 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： An arrangement and a method for producing such an arrangement serve for generating mixed light. In this case, a semiconductor chip that emits an electromagnetic primary radiation has a luminescence conversion element in the beam path of the primary radiation. Furthermore, the arrangement includes a connecting element and a carrier element, wherein the carrier element carries and shapes the luminescence conversion element and the connecting element.

摘要翻译： 用于制造这种布置的布置和方法用于产生混合光。 在这种情况下，发射电磁一次辐射的半导体芯片在一次辐射的光束路径中具有发光转换元件。 此外，该装置包括连接元件和载体元件，其中载体元件承载和成形发光转换元件和连接元件。

公开(公告)号：US08368101B2

公开(公告)日：2013-02-05

申请号：US12523487

申请日：2008-01-23

申请人： Bert Braune ,  Gertrud Kraeuter

发明人： Bert Braune ,  Gertrud Kraeuter

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/507 ,  H01L33/483 ,  H01L33/58 ,  H01L2924/0002 ,  H01L2924/00

摘要： An arrangement and a method for producing such an arrangement serve for generating mixed light. In this case, a semiconductor chip that emits an electromagnetic primary radiation has a luminescence conversion element in the beam path of the primary radiation. Furthermore, the arrangement includes a connecting element and a carrier element, wherein the carrier element carries and shapes the luminescence conversion element and the connecting element.

摘要翻译： 用于制造这种布置的布置和方法用于产生混合光。 在这种情况下，发射电磁一次辐射的半导体芯片在一次辐射的光束路径中具有发光转换元件。 此外，该装置包括连接元件和载体元件，其中载体元件承载和成形发光转换元件和连接元件。

公开(公告)号：US09055655B2

公开(公告)日：2015-06-09

申请号：US13377593

申请日：2010-08-10

申请人： Bert Braune

发明人： Bert Braune

IPC分类号： H01L33/50 ,  H05B33/14 ,  H05B33/10 ,  H01L23/00

CPC分类号： H05B33/145 ,  C09K11/08 ,  H01L24/24 ,  H01L33/501 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/351 ,  H01L2933/0041 ,  H05B33/10 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of producing an optoelectronic semiconductor chip includes providing a semiconductor layer sequence with at least one active layer, providing a one-piece conversion medium body, wherein a matrix material is incompletely crosslinked and/or cured, and wherein the conversion medium body exhibits at room temperature a hardness of Shore A 0 to Shore A 35 and/or a viscosity of 10 Pa·s to 150 Pa·s, placing the conversion medium body onto the semiconductor layer sequence such that they are in direct contact with one another, and curing the conversion medium body wherein after curing the hardness of the conversion medium body is Shore A 30 to Shore D 80.

摘要翻译： 一种制造光电子半导体芯片的方法包括提供具有至少一个活性层的半导体层序列，提供一体的转换介质体，其中基质材料不完全交联和/或固化，并且其中转化介质体表现出 室温下的肖氏A 0至肖氏A 35的硬度和/或10Pa·s至150Pa·s的粘度，将转化介质体放置在半导体层序列上使得它们彼此直接接触，以及 固化转化介质体，其中固化后的转化介质体的硬度为肖氏A 30至肖氏D 80。

公开(公告)号：US20120146076A1

公开(公告)日：2012-06-14

申请号：US13377593

申请日：2010-08-10

申请人： Bert Braune

发明人： Bert Braune

IPC分类号： H01L33/50 ,  B32B9/04 ,  B32B33/00 ,  G02B1/04

CPC分类号： H05B33/145 ,  C09K11/08 ,  H01L24/24 ,  H01L33/501 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/351 ,  H01L2933/0041 ,  H05B33/10 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of producing an optoelectronic semiconductor chip includes providing a semiconductor layer sequence with at least one active layer, providing a one-piece conversion medium body, wherein a matrix material is incompletely crosslinked and/or cured, and wherein the conversion medium body exhibits at room temperature a hardness of Shore A 0 to Shore A 35 and/or a viscosity of 10 Pa·s to 150 Pa·s, placing the conversion medium body onto the semiconductor layer sequence such that they are in direct contact with one another, and curing the conversion medium body wherein after curing the hardness of the conversion medium body is Shore A 30 to Shore D 80.

摘要翻译： 一种制造光电子半导体芯片的方法包括提供具有至少一个活性层的半导体层序列，提供一体的转换介质体，其中基质材料不完全交联和/或固化，并且其中转化介质体表现出 室温下的肖氏A 0至肖氏A 35的硬度和/或10Pa·s至150Pa·s的粘度，将转化介质体放置在半导体层序列上使得它们彼此直接接触，以及 固化转化介质体，其中固化后的转化介质体的硬度为肖氏A 30至肖氏D 80。

公开(公告)号：US20090213469A1

公开(公告)日：2009-08-27

申请号：US12086383

申请日：2006-11-06

申请人： Bert Braune ,  Simon Blümel ,  Manfred Wolf

发明人： Bert Braune ,  Simon Blümel ,  Manfred Wolf

IPC分类号： G02B3/00 ,  B29D11/00

CPC分类号： H01L33/58 ,  B29C45/1615 ,  B29L2011/00 ,  G02B7/022 ,  H01L33/483 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01067 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical element (14) is specified which is suitable for an optoelectronic component and has a carrier part (1) and a beam shaping part (12), wherein the beam shaping part is molded onto the carrier part, or vice versa. A corresponding production method and a composite device comprising the optical element are furthermore specified.

摘要翻译： 规定了适用于光电子部件并具有载体部件（1）和光束成形部件（12）的光学元件（14），其中光束成形部件模制在载体部件上，反之亦然。 进一步规定了相应的制造方法和包括光学元件的复合装置。

公开(公告)号：US07514279B2

公开(公告)日：2009-04-07

申请号：US11002326

申请日：2004-12-02

申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

IPC分类号： H01L21/00

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

摘要翻译： 一种光电元件，其具有基本壳体或框架（12）和至少一个半导体芯片（20），特别是辐射发射或接收半导体芯片，位于基本壳体的空腔（18）中。 为了提高光电子部件（10）的效率，在半导体芯片周围的区域的空腔内设置反射器。 这些反射器是由以下事实构成的：提供了至少部分地填充到空腔（18）中的填充化合物（28），填充化合物（28）的材料和数量被选择为使填充物 由于填充化合物和基本壳体之间的粘合力，复合物呈现在腔体中从底部到顶部基本上锥形化的形式，并且填充化合物的锥形内部区域（30）用作反射器。

公开(公告)号：US07427806B2

公开(公告)日：2008-09-23

申请号：US11179028

申请日：2005-07-18

申请人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Günter Waitl

发明人： Karlheinz Arndt ,  Georg Bogner ,  Bert Braune ,  Günter Waitl

IPC分类号： H01L23/20

CPC分类号： H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.

摘要翻译： 公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有 对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。 凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得 在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面 所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。 还公开了相应的壳体基体。

公开(公告)号：US20060078734A1

公开(公告)日：2006-04-13

申请号：US10544497

申请日：2004-02-20

申请人： Bert Braune ,  Torsten Fries ,  Rainer Schirmer ,  Martin Zachau ,  Franz Zwaschka

发明人： Bert Braune ,  Torsten Fries ,  Rainer Schirmer ,  Martin Zachau ,  Franz Zwaschka

IPC分类号： B32B1/00 ,  H05B33/00 ,  C09K11/08

CPC分类号： C09K11/7734 ,  C09K11/02 ,  H01L33/502 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  Y10S428/917 ,  Y10T428/2991 ,  H01L2924/00014 ,  H01L2924/00

摘要： A coated phosphor, formed by a powder of individual grains of a phosphor as base material, the grains being coated with a coating material. The layer comprises a plurality of individual layers and is particulate in form, the individual primary particles of the layer being at least 5 nm in size. The mean layer thickness is at least 20 nm.

摘要翻译： 由磷光体的单个颗粒的粉末作为基材形成的涂覆的荧光体，所述颗粒被涂覆材料涂覆。 该层包括多个单独的层，并且是颗粒形式，该层的单个初级颗粒的尺寸为至少5nm。 平均层厚度为至少20nm。

公开(公告)号：US20050093005A1

公开(公告)日：2005-05-05

申请号：US11002326

申请日：2004-12-02

申请人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

发明人： Marcus Ruhnau ,  Bert Braune ,  Patrick Kromotis ,  Georg Bogner

IPC分类号： H01L23/02 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/60 ,  H01L21/00 ,  H01L27/15 ,  H01L29/26 ,  H01L31/12

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

摘要翻译： 一种光电元件，其具有基本壳体或框架（12）和至少一个半导体芯片（20），特别是辐射发射或接收半导体芯片，位于基本壳体的空腔（18）中。 为了提高光电子部件（10）的效率，在半导体芯片周围的区域的空腔内设置反射器。 这些反射器是由以下事实构成的：提供了至少部分地填充到空腔（18）中的填充化合物（28），填充化合物（28）的材料和数量被选择为使填充物 由于填充化合物和基本壳体之间的粘合力，复合物呈现在腔体中从底部到顶部基本上锥形化的形式，并且填充化合物的锥形内部区域（30）用作反射器。

公开(公告)号：US09281458B2

公开(公告)日：2016-03-08

申请号：US14127049

申请日：2012-06-20

申请人： Christina Keith ,  Bert Braune ,  Michael Kruppa

发明人： Christina Keith ,  Bert Braune ,  Michael Kruppa

IPC分类号： H01L29/49 ,  H01L33/56 ,  H01L33/60

CPC分类号： H01L33/56 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： An optoelectronic semiconductor device including a carrier substrate and at least one semiconductor chip arranged thereon, wherein the semiconductor chip includes an active layer that generates radiation, conductor tracks electrically contacting the semiconductor chip arranged on the carrier substrate, the semiconductor chip is enclosed in a potting material, and the potting material includes at least a first potting layer, a second potting layer and a third potting layer, which differ from one another in at least one of: their material composition, their optical properties and their chemical properties.

摘要翻译： 一种光电子半导体器件，包括载体衬底和布置在其上的至少一个半导体芯片，其中半导体芯片包括产生辐射的有源层，与布置在载体衬底上的半导体芯片电接触的导体迹线，半导体芯片封装在封装 材料，并且灌封材料至少包括第一灌封层，第二灌封层和第三灌封层，它们的材料组成，它们的光学性质和它们的化学性质中的至少一个彼此不同。