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1.发明授权公开(公告)号：US09281458B2
公开(公告)日：2016-03-08
申请号：US14127049
申请日：2012-06-20
申请人： Christina Keith , Bert Braune , Michael Kruppa
发明人： Christina Keith , Bert Braune , Michael Kruppa
CPC分类号： H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： An optoelectronic semiconductor device including a carrier substrate and at least one semiconductor chip arranged thereon, wherein the semiconductor chip includes an active layer that generates radiation, conductor tracks electrically contacting the semiconductor chip arranged on the carrier substrate, the semiconductor chip is enclosed in a potting material, and the potting material includes at least a first potting layer, a second potting layer and a third potting layer, which differ from one another in at least one of: their material composition, their optical properties and their chemical properties.
摘要翻译： 一种光电子半导体器件，包括载体衬底和布置在其上的至少一个半导体芯片，其中半导体芯片包括产生辐射的有源层，与布置在载体衬底上的半导体芯片电接触的导体迹线，半导体芯片封装在封装 材料，并且灌封材料至少包括第一灌封层，第二灌封层和第三灌封层，它们的材料组成，它们的光学性质和它们的化学性质中的至少一个彼此不同。
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2.发明申请公开(公告)号：US20140217444A1
公开(公告)日：2014-08-07
申请号：US14127049
申请日：2012-06-20
申请人： Christina Keith , Bert Braune , Michael Kruppa
发明人： Christina Keith , Bert Braune , Michael Kruppa
CPC分类号： H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： An optoelectronic semiconductor device including a carrier substrate and at least one semiconductor chip arranged thereon, wherein the semiconductor chip includes an active layer that generates radiation, conductor tracks electrically contacting the semiconductor chip arranged on the carrier substrate, the semiconductor chip is enclosed in a potting material, and the potting material includes at least a first potting layer, a second potting layer and a third potting layer, which differ from one another in at least one of: their material composition, their optical properties and their chemical properties.
摘要翻译： 一种光电子半导体器件，包括载体衬底和布置在其上的至少一个半导体芯片，其中半导体芯片包括产生辐射的有源层，与布置在载体衬底上的半导体芯片电接触的导体迹线，半导体芯片封装在封装 材料，并且灌封材料至少包括第一灌封层，第二灌封层和第三灌封层，它们的材料组成，它们的光学性质和它们的化学性质中的至少一个彼此不同。
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3.发明申请公开(公告)号：US20120193669A1
公开(公告)日：2012-08-02
申请号：US13500685
申请日：2010-09-27
CPC分类号： H01L33/507 , H01L33/38 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01L2933/0033 , H01L2933/0041 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing an optoelectronic semiconductor component, comprising: providing a semiconductor chip in a composite wafer, comprising an active side for emitting a primary radiation and a contact terminal which is arranged on the active side; depositing a coupling element on the active side; attaching a luminescence conversion element, for converting part of the primary radiation into a secondary radiation, to the coupling element.
摘要翻译： 一种制造光电子半导体部件的方法，包括：在复合晶片中提供半导体芯片，其包括用于发射初级辐射的有源侧和布置在所述有源侧的接触端子; 在活动侧上沉积耦合元件; 附接用于将一次辐射的一部分转换成二次辐射的发光转换元件连接到耦合元件。
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4.发明授权公开(公告)号：US09368699B2
公开(公告)日：2016-06-14
申请号：US13703180
申请日：2011-05-25
申请人： Michael Kruppa , Simon Jerebic
发明人： Michael Kruppa , Simon Jerebic
IPC分类号： H01L33/00 , H01L33/50 , H01L33/48 , H01L33/52 , B29D11/00 , G02B1/04 , H01L33/54 , H01L33/56 , H01L33/58
CPC分类号： H01L33/58 , B29D11/00442 , G02B1/04 , G02B27/095 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/501 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2933/005 , H01L2933/0058 , C08L75/00 , C08L63/00 , C08L83/04 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor component includes an optoelectronic semiconductor chip and an optical element arranged on a radiation passage area of the semiconductor chip, wherein the optical element is based on a highly refractive polymer material.
摘要翻译： 半导体部件包括光电子半导体芯片和布置在半导体芯片的辐射通道区域上的光学元件，其中光学元件基于高折射聚合物材料。
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5.发明授权公开(公告)号：US08841159B2
公开(公告)日：2014-09-23
申请号：US13500685
申请日：2010-09-27
CPC分类号： H01L33/507 , H01L33/38 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48465 , H01L2933/0033 , H01L2933/0041 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing an optoelectronic semiconductor component, comprising: providing a semiconductor chip in a composite wafer, comprising an active side for emitting a primary radiation and a contact terminal which is arranged on the active side; depositing a coupling element on the active side; attaching a luminescence conversion element, for converting part of the primary radiation into a secondary radiation, to the coupling element.
摘要翻译： 一种制造光电子半导体部件的方法，包括：在复合晶片中提供半导体芯片，其包括用于发射初级辐射的有源侧和布置在所述有源侧的接触端子; 在活动侧上沉积耦合元件; 附接用于将一次辐射的一部分转换成二次辐射的发光转换元件连接到耦合元件。
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6.发明申请公开(公告)号：US20130240929A1
公开(公告)日：2013-09-19
申请号：US13703180
申请日：2011-05-25
申请人： Michael Kruppa , Simon Jerebic
发明人： Michael Kruppa , Simon Jerebic
IPC分类号： H01L33/50
CPC分类号： H01L33/58 , B29D11/00442 , G02B1/04 , G02B27/095 , H01L33/483 , H01L33/486 , H01L33/50 , H01L33/501 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/56 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2933/005 , H01L2933/0058 , C08L75/00 , C08L63/00 , C08L83/04 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor component includes an optoelectronic semiconductor chip and an optical element arranged on a radiation passage area of the semiconductor chip, wherein the optical element is based on a highly refractive polymer material.
摘要翻译： 半导体部件包括光电子半导体芯片和布置在半导体芯片的辐射通道区域上的光学元件，其中光学元件基于高折射聚合物材料。
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