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1.发明申请SYSTEM AND METHOD FOR MONITORING AND MANAGING DATA CENTER RESOURCES IN REAL TIME 有权实时监控和管理数据中心资源的系统和方法公开(公告)号：US20140025968A1
公开(公告)日：2014-01-23
申请号：US13877513
申请日：2011-09-30
申请人： Bharat A. Khuti , Steven Geffin , Richard Williams , Joe Kutner , Jack Basiaago , Sheldon Altman , Brian Williams , Juarez Carvalho , Michael Browner , Mitesh Patel , Kenneth L. Harper , James H. Shelton , Steven Clark , Donald A. Sturgeon , David John Cowen , Mark Kershner , Steven R. Blackwell , Karl Mills , Yang Pu , Dai Jun , Richard M. Tobin , Aman Khan , Roy D. Pestone , Jean-Maxime Lachapelle
发明人： Bharat A. Khuti , Steven Geffin , Richard Williams , Joe Kutner , Jack Basiaago , Sheldon Altman , Brian Williams , Juarez Carvalho , Michael Browner , Mitesh Patel , Kenneth L. Harper , James H. Shelton , Steven Clark , Donald A. Sturgeon , David John Cowen , Mark Kershner , Steven R. Blackwell , Karl Mills , Yang Pu , Dai Jun , Richard M. Tobin , Aman Khan , Roy D. Pestone , Jean-Maxime Lachapelle
IPC分类号： G06F1/32
CPC分类号： G06F1/3206 , G06F1/206 , G06F1/3203 , G06F8/24 , G06F11/3006 , G06F11/3044 , G06F11/3051 , G06F11/3058 , G06F11/3072 , G06F11/3409 , H04L41/0226 , H04L41/0253 , H04L41/04 , H04L41/50 , H05K7/20836 , Y02D10/16 , Y02D10/34
摘要： A system for monitoring, controlling and optimizing power usage and cooling utilization within a data center infrastructure. The system may make use of a subsystem which is adapted to obtain real time information on both facility devices and information technology (IT) devices. The subsystem may be used to evaluate the real time information to provide an alert and diagnostic information with respect to at least one of the facility devices or at least one of the IT devices. The subsystem may also make use of a mechanism that provides real time control over at least one of the facility devices or at least one of the IT devices to optimize at least one of cooling utilization, power usage or performance of at least one of the facility devices or at least one of the IT devices.
摘要翻译： 一种用于在数据中心基础设施内监控，控制和优化电力使用和冷却利用的系统。 该系统可以利用适于在设备设备和信息技术（IT）设备上获得实时信息的子系统。 该子系统可以用于评估实时信息，以提供关于设备设备或至少一个IT设备中的至少一个的警报和诊断信息。 该子系统还可以利用这样一种机制，该机制可以对至少一个设备设备或IT设备中的至少一个提供实时控制，以优化至少一个设施的冷却利用，功率使用或性能中的至少一个 设备或至少一个IT设备。
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2.发明授权System and method for monitoring and managing data center resources in real time 有权实时监控和管理数据中心资源的系统和方法公开(公告)号：US09568974B2
公开(公告)日：2017-02-14
申请号：US13877513
申请日：2011-09-30
申请人： Bharat A. Khuti , Steven Geffin , Joe Kutner , Jack Basiago , Sheldon Altman , Brian Williams , Juarez Carvalho , Michael Browner , Mitesh Patel , Kenneth L. Harper , James H. Shelton , Steven Clark , Donald A. Sturgeon , David John Cowen , Mark Kershner , Steven R. Blackwell , Karl Mills , Yang Pu , Dai Jun , Richard M. Tobin , Aman Khan , Roy D. Pestone , Jean-Maxime Lachapelle
发明人： Bharat A. Khuti , Steven Geffin , Richard Williams , Joe Kutner , Jack Basiago , Sheldon Altman , Brian Williams , Juarez Carvalho , Michael Browner , Mitesh Patel , Kenneth L. Harper , James H. Shelton , Steven Clark , Donald A. Sturgeon , David John Cowen , Mark Kershner , Steven R. Blackwell , Karl Mills , Yang Pu , Dai Jun , Richard M. Tobin , Aman Khan , Roy D. Pestone , Jean-Maxime Lachapelle
CPC分类号： G06F1/3206 , G06F1/206 , G06F1/3203 , G06F8/24 , G06F11/3006 , G06F11/3044 , G06F11/3051 , G06F11/3058 , G06F11/3072 , G06F11/3409 , H04L41/0226 , H04L41/0253 , H04L41/04 , H04L41/50 , H05K7/20836 , Y02D10/16 , Y02D10/34
摘要： A system for monitoring, controlling and optimizing power usage and cooling utilization within a data center infrastructure. The system may make use of a subsystem which is adapted to obtain real time information on both facility devices and information technology (IT) devices. The subsystem may be used to evaluate the real time information to provide an alert and diagnostic information with respect to at least one of the facility devices or at least one of the IT devices. The subsystem may also make use of a mechanism that provides real time control over at least one of the facility devices or at least one of the IT devices to optimize at least one of cooling utilization, power usage or performance of at least one of the facility devices or at least one of the IT devices.
摘要翻译： 一种用于在数据中心基础设施内监控，控制和优化电力使用和冷却利用的系统。 该系统可以利用适于在设备设备和信息技术（IT）设备上获得实时信息的子系统。 该子系统可以用于评估实时信息，以提供关于设备设备或至少一个IT设备中的至少一个的警报和诊断信息。 该子系统还可以利用这样一种机制，该机制可以对至少一个设备设备或IT设备中的至少一个提供实时控制，以优化至少一个设施的冷却利用，功率使用或性能中的至少一个 设备或至少一个IT设备。
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公开(公告)号：US20110003025A1
公开(公告)日：2011-01-06
申请号：US12662087
申请日：2010-03-30
申请人： Mitesh Patel
发明人： Mitesh Patel
IPC分类号： B29C51/36
CPC分类号： B29C51/10 , B29C51/08 , B29C51/46 , B29C2791/006 , B29L2031/7536 , B29L2031/768
摘要： The system for vacuum formation of a dental appliance is a fully automated vacuum formation machine for dental appliances, such as retainers and the like. The system includes a base having a perforated top vacuum plate in communication with a vacuum source. A heating unit is positioned above the perforated top vacuum plate, and a controller is in communication with the heating unit and the vacuum source for selective actuation thereof. A holder releasably receives a thermoplastic plate. The holder is selectively positionable vertically over the perforated top vacuum plate and a dental impression cast mounted thereon. The holder is positioned by a linear actuator or the like, in communication with the controller. A sensor is positioned adjacent the perforated top vacuum plate for measuring the thermoplastic plate's thickness as it is molded about the dental impression cast, and is communication with the controller.
摘要翻译： 用于真空形成牙科器具的系统是用于诸如保持器等的牙科器具的全自动真空成形机。 该系统包括具有与真空源连通的穿孔顶部真空板的底座。 加热单元位于穿孔顶部真空板上方，并且控制器与加热单元和真空源连通，用于选择性地致动它。 保持器可释放地容纳热塑性板。 保持器可选择性地垂直定位在穿孔的顶部真空板上并安装在其上的牙印模。 保持器通过与控制器通信的线性致动器等定位。 传感器定位在穿孔顶部真空板附近，用于测量热塑性板的厚度，因为它是模制在牙印模上，并且与控制器通信。
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4.发明授权Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same 有权具有用于体偏置的电介质障碍物的芯片封装热界面材料，其使用方法以及含有它们的体系公开(公告)号：US07776657B2
公开(公告)日：2010-08-17
申请号：US11935597
申请日：2007-11-06
IPC分类号： H01L21/00
CPC分类号： H01L23/3737 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29486 , H01L2224/2949 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.
摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。
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公开(公告)号：US20060219715A1
公开(公告)日：2006-10-05
申请号：US11449262
申请日：2006-06-07
申请人： Shalabh Tandon , Mitesh Patel
发明人： Shalabh Tandon , Mitesh Patel
CPC分类号： H05B6/806
摘要： A system and method is provided in which a radio frequency transmitter and/or a microwave frequency transmitter applies radio and/or microwave frequency energy, respectively, to an imprinted material to cure the imprinted material. In some embodiments, an oven may be used to apply thermal energy to the imprinted material in conjunction with the radio and/or microwave frequency energy to cure the imprinted material. In other embodiments, an oven is not used. The imprinted material may also include a susceptor that absorbs radio and/or microwave frequency energy and responsive thereto emits thermal energy to aid in curing the imprinted material. Further, at least one susceptor may be located externally and adjacent to the imprinted material. The external susceptor may absorb radio and/or microwave frequency energy, respectively, and responsive thereto emits thermal energy towards the imprinted material to aid in curing the imprinted material.
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公开(公告)号：US08226393B2
公开(公告)日：2012-07-24
申请号：US12662087
申请日：2010-03-30
申请人： Mitesh Patel
发明人： Mitesh Patel
IPC分类号： B29C43/06
CPC分类号： B29C51/10 , B29C51/08 , B29C51/46 , B29C2791/006 , B29L2031/7536 , B29L2031/768
摘要： The system for vacuum formation of a dental appliance is a fully automated vacuum formation machine for dental appliances, such as retainers and the like. The system includes a base having a perforated top vacuum plate in communication with a vacuum source. A heating unit is positioned above the perforated top vacuum plate, and a controller is in communication with the heating unit and the vacuum source for selective actuation thereof. A holder releasably receives a thermoplastic plate. The holder is selectively positionable vertically over the perforated top vacuum plate and a dental impression cast mounted thereon. The holder is positioned by a linear actuator or the like, in communication with the controller. A sensor is positioned adjacent the perforated top vacuum plate for measuring the thermoplastic plate's thickness as it is molded about the dental impression cast, and is communication with the controller.
摘要翻译： 用于真空形成牙科器具的系统是用于诸如保持器等的牙科器具的全自动真空成形机。 该系统包括具有与真空源连通的穿孔顶部真空板的底座。 加热单元位于穿孔顶部真空板上方，并且控制器与加热单元和真空源连通，用于选择性地致动它。 保持器可释放地容纳热塑性板。 保持器可选择性地垂直定位在穿孔的顶部真空板上并安装在其上的牙印模。 保持器通过与控制器通信的线性致动器等定位。 传感器定位在穿孔顶部真空板附近，用于测量热塑性板的厚度，因为它是模制在牙印模上，并且与控制器通信。
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7.发明申请STRESS-RELIEF LAYERS AND STRESS-COMPENSATION COLLARS WITH LOW-TEMPERATURE SOLDERS FOR BOARD-LEVEL JOINTS, AND PROCESSES OF MAKING SAME 有权用于板级接头的低温焊料的应力缓和层和应力补偿胶料及其制造方法公开(公告)号：US20070190772A1
公开(公告)日：2007-08-16
申请号：US11736280
申请日：2007-04-17
申请人： Daewoong Suh , Saikumar Jayaraman , Stephen Lehman , Mitesh Patel , Tiffany Byrne , Eward Martin , Mohd Erwan Basiron , Wei Loh , Sheau Lim , Yoong Tatt Chin
发明人： Daewoong Suh , Saikumar Jayaraman , Stephen Lehman , Mitesh Patel , Tiffany Byrne , Eward Martin , Mohd Erwan Basiron , Wei Loh , Sheau Lim , Yoong Tatt Chin
IPC分类号： H01L21/44
CPC分类号： H05K3/3436 , H01L23/562 , H01L24/16 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2924/00014 , H01L2924/01012 , H01L2924/01025 , H01L2924/01046 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H05K1/0271 , H05K3/3463 , H05K2201/10977 , H05K2203/0126 , Y02P70/613 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.
摘要翻译： 通过在基底下表面上分配聚合物以部分地嵌入设置在下表面上的低熔点焊料凸点的条件来形成应力消除层。 应力消除层流向低熔点焊料凸块。 应力补偿轴环形成在与基板相配合的基板上，并且应力补偿套环部分嵌入低熔点焊料凸块。 还包括展示应力消除层和应力补偿套环的物品。 还包括包括低熔点焊料，应力消除层和应力补偿环的计算系统。
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公开(公告)号：US07253088B2
公开(公告)日：2007-08-07
申请号：US10954999
申请日：2004-09-29
申请人： Daewoong Suh , Saikumar Jayaraman , Stephen E. Lehman , Mitesh Patel , Tiffany A. Byrne , Edward L. Martin , Mohd Erwan B. Basiron , Wei Keat Loh , Sheau Hooi Lim , Yoong Tatt P. Chin
发明人： Daewoong Suh , Saikumar Jayaraman , Stephen E. Lehman , Mitesh Patel , Tiffany A. Byrne , Edward L. Martin , Mohd Erwan B. Basiron , Wei Keat Loh , Sheau Hooi Lim , Yoong Tatt P. Chin
IPC分类号： H01L21/44
CPC分类号： H05K3/3436 , H01L23/562 , H01L24/16 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2924/00014 , H01L2924/01012 , H01L2924/01025 , H01L2924/01046 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H05K1/0271 , H05K3/3463 , H05K2201/10977 , H05K2203/0126 , Y02P70/613 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.
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9.发明授权Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same 有权具有用于体偏置的电介质障碍物的芯片封装热界面材料，其使用方法以及含有它们的体系公开(公告)号：US07332807B2
公开(公告)日：2008-02-19
申请号：US11323512
申请日：2005-12-30
CPC分类号： H01L23/3737 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/2929 , H01L2224/293 , H01L2224/29486 , H01L2224/2949 , H01L2224/29499 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/16152 , H01L2924/00 , H01L2224/05599
摘要： A chip package includes a thermal interface material disposed between a die backside and a heat sink. The thermal interface material includes a first metal particle that is covered by a dielectric film. The dielectric film is selected from an inorganic compound of the first metal or an inorganic compound coating of a second metal. The dielectric film diminishes overall heat transfer from the first metal particle in the thermal interface material by a small fraction of total possible heat transfer without the dielectric film. A method of operating the chip includes biasing the chip with the dielectric film in place.
摘要翻译： 芯片封装包括设置在模具背面和散热器之间的热界面材料。 热界面材料包括由电介质膜覆盖的第一金属颗粒。 电介质膜选自第一金属的无机化合物或第二金属的无机化合物涂层。 电介质膜减少热界面材料中的第一金属颗粒的总传热量，而不需要电介质膜的总可能传热的一小部分。 一种操作该芯片的方法包括：将该电介质膜的芯片偏压就位。
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10.发明申请公开(公告)号：US20070257360A1
公开(公告)日：2007-11-08
申请号：US11827705
申请日：2007-07-13
申请人： Gregory Clemons , Mitesh Patel
发明人： Gregory Clemons , Mitesh Patel
CPC分类号： B65B7/285 , H01L21/50 , Y10T29/4913 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178 , Y10T29/53248 , Y10T29/53252 , Y10T29/53261 , Y10T29/53265
摘要： The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.
摘要翻译： 本说明书公开了一种装置，其包括其中具有多个凹陷的对准板，每个凹陷的尺寸被设计成在其中容纳包装盖并防止其移动，并且施力器施加力以将包装盖和基板牢固地压在一起 。 还公开了一种方法，包括将多个包装帽插入对准板上的多个凹陷中，每个凹陷的尺寸被设计成接收包装盖并防止其移动，使多个包装盖与基板上的各个装置对准，放置 所述基板与所述包装盖接触，并且施加力以将所述盖压靠在所述基板上。 公开和要求保护其他实施例。
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