中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

54 records (took 0.021 seconds)

    LIGHT-EMITTING DIODE DEVICES AND METHODS FOR FABRICATING THE SAME
    4.
    发明申请
    LIGHT-EMITTING DIODE DEVICES AND METHODS FOR FABRICATING THE SAME 审中-公开
    发光二极管器件及其制造方法

    公开(公告)号：US20100127288A1

    公开(公告)日：2010-05-27

    申请号：US12323094

    申请日：2008-11-25

    Applicant: Wu-Cheng KUO ,  Tzu-Han Lin

    Inventor： Wu-Cheng KUO ,  Tzu-Han Lin

    IPC: H01L33/00

    CPC classification number: H01L33/483 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2933/005 ,  H01L2924/00014

    Abstract: An LED device including a support structure with at least one LED die mounted thereon, a recess formed in a part of the support structure from a side of the LED die, and a lens formed over the support structure to encapsulate the LED die and the recess, thereby forming a protrusion in the support structure is disclosed.

    Abstract translation: 一种LED装置，包括具有安装在其上的至少一个LED管芯的支撑结构，从所述LED管芯的一侧形成在所述支撑结构的一部分中的凹部，以及形成在所述支撑结构上的透镜，以封装所述LED管芯和所述凹部 从而在支撑结构中形成突起。

    WHITE LIGHT-EMITTING DIODE PACKAGES WITH TUNABLE COLOR TEMPERATURE
    5.
    发明申请
    WHITE LIGHT-EMITTING DIODE PACKAGES WITH TUNABLE COLOR TEMPERATURE 审中-公开
    白色发光二极管封装，带有可调色温

    公开(公告)号：US20110037081A1

    公开(公告)日：2011-02-17

    申请号：US12540145

    申请日：2009-08-12

    Applicant: Wu-Cheng Kuo ,  Tzu-Han Lin

    Inventor： Wu-Cheng Kuo ,  Tzu-Han Lin

    IPC: H01L33/00

    CPC classification number: H01L25/0753 ,  H01L33/504 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: A white light-emitting diode package with tunable color temperature is provided, including a package substrate with a first light emitting diode (first LED) disposed over a first portion of the substrate and a second light emitting diode (second LED) disposed over a second portion different from the first portion of the substrate. A phosphor layer is coated around the first and second LED, wherein the phosphor layer is formed by blending at least one colored phosphor grain with a transparent optical resin, and the at least one colored phosphor grain in the transparent optical resin is excited by light from the first and second LED to react and emit white light. In one embodiment, the first and second LED are both blue LEDs for emitting blue light of different wavelengths or ultraviolet (UV) LEDs for emitting UV light of different wavelengths.

    Abstract translation: 提供了具有可调色温的白色发光二极管封装，包括具有设置在衬底的第一部分上的第一发光二极管（第一LED）的封装衬底和设置在衬底的第二部分上的第二发光二极管（第二LED） 部分不同于基板的第一部分。 荧光体层被涂覆在第一和第二LED周围，其中荧光体层通过将至少一个着色荧光体晶粒与透明光学树脂共混而形成，并且透明光学树脂中的至少一个着色荧光体颗粒被来自 第一和第二LED反应并发出白光。 在一个实施例中，第一和第二LED都是用于发射不同波长的蓝光的蓝色LED或用于发射不同波长的UV光的紫外线（UV）LED。

    LIGHT EMITTING DEVICE
    6.
    发明申请
    LIGHT EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号：US20100237379A1

    公开(公告)日：2010-09-23

    申请号：US12407385

    申请日：2009-03-19

    Applicant: Wu-Cheng KUO ,  Jui-Ping Weng ,  Tzu-Han Lin

    Inventor： Wu-Cheng KUO ,  Jui-Ping Weng ,  Tzu-Han Lin

    IPC: H01L33/00

    CPC classification number: H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An embodiment of the invention provides a light emitting device, which includes: a first substrate made of a semiconductor material or a ceramic material; a first hole having extending direction from a first side toward an opposite second side and from a first surface toward an opposite second surface of the first substrate; a second hole having extending direction from the first side toward the second side and from the first surface toward the second surface; a light emitting element disposed overlying the first surface and having a first electrode and a second electrode; a first conducting layer overlying a first sidewall of the first hole and electrically connected to the first electrode; and a second conducting layer overlying a second sidewall of the second hole and electrically connected to the second electrode.

    Abstract translation: 本发明的实施例提供了一种发光器件，其包括：由半导体材料或陶瓷材料制成的第一衬底; 第一孔，其具有从第一侧朝向相反的第二侧的延伸方向以及从第一基板的第一表面朝向相反的第二表面; 第二孔，从第一侧向第二侧延伸，从第一面向第二面延伸; 设置在所述第一表面上并具有第一电极和第二电极的发光元件; 覆盖所述第一孔的第一侧壁并电连接到所述第一电极的第一导电层; 以及覆盖所述第二孔的第二侧壁并电连接到所述第二电极的第二导电层。

    Image sensing devices and methods for fabricating the same
    7.
    发明授权
    Image sensing devices and methods for fabricating the same 有权
    图像感测装置及其制造方法

    公开(公告)号：US08153458B2

    公开(公告)日：2012-04-10

    申请号：US12407115

    申请日：2009-03-19

    Applicant: Jui-Ping Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

    Inventor： Jui-Ping Weng ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

    IPC: H01L21/70 ,  H01L31/0232 ,  H01L31/14

    CPC classification number: H01L27/14687 ,  H01L27/14618 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/10 ,  H01L2924/00014 ,  Y10S257/911 ,  H01L2224/05599

    Abstract: Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.

    Abstract translation: 提供了图像感测装置及其制造方法。 示例性图像感测装置包括具有彼此相对的第一侧和第二侧的第一基板。 在第一侧的第一基板中形成多个图像感测元件。 通过第一基板形成导电通孔，其具有在第一侧被第一基板暴露的第一表面和在第二侧被第一基板暴露的第二表面。 导电焊盘在第一侧覆盖导电通孔并且电连接图像感测元件。 导电层位于第二侧的导电通孔上，并与导电焊盘电连接。 在导电层的一部分上形成导电凸块。 第二衬底在第一侧与第一衬底结合。

    Method of fabricating isolation structures for CMOS image sensor chip scale packages
    8.
    发明授权
    Method of fabricating isolation structures for CMOS image sensor chip scale packages 有权
    制造CMOS图像传感器芯片级封装的隔离结构的方法

    公开(公告)号：US07833810B2

    公开(公告)日：2010-11-16

    申请号：US12493758

    申请日：2009-06-29

    Applicant: Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

    Inventor： Tzu-Han Lin ,  Tzy-Ying Lin ,  Fang-Chang Liu ,  Kai-Chih Wang

    IPC: H01L21/00 ,  H01L23/544

    CPC classification number: H01L27/14618 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2924/01078 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

    Abstract: Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support structure for the package. The transparent substrate includes a first cutting edge and a second cutting edge. A CMOS image sensor die with a die circuitry is mounted on the transparent substrate. An encapsulant is disposed on the substrate encapsulating the CMOS image sensor die. A connection extends from the die circuitry to a plurality of terminal contacts for the package on the encapsulant, wherein the connection is exposed by the first cutting edge. An isolation structure is disposed on the first cutting edge passivating the exposed connection and co-planed with the second cutting edge.

    Abstract translation: CMOS图像传感器芯片级封装的隔离结构及其制造方法。 CMOS图像传感器芯片级封装包括被配置为用于封装的支撑结构的透明衬底。 透明基板包括第一切削刃和第二切削刃。 具有裸片电路的CMOS图像传感器芯片安装在透明基板上。 密封剂设置在封装有CMOS图像传感器芯片的基板上。 连接从管芯电路延伸到密封剂上的封装的多个端子触头，其中连接由第一切削刃暴露。 隔离结构设置在第一切削刃上，钝化暴露的连接并与第二切削刃共同设计。

    Electronic assembly for image sensor device
    9.
    发明授权
    Electronic assembly for image sensor device 有权
    电子组装图像传感器装置

    公开(公告)号：US07829966B2

    公开(公告)日：2010-11-09

    申请号：US11944558

    申请日：2007-11-23

    Applicant: Jui-Ping Weng ,  Tzu-Han Lin

    Inventor： Jui-Ping Weng ,  Tzu-Han Lin

    IPC: H01L31/0232

    CPC classification number: H01L27/14627 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14685 ,  H04N5/2252 ,  H04N5/2257

    Abstract: An electronic assembly for an image sensor device is disclosed. The electronic assembly comprises a package module and a lens set mounted thereon. The package module comprises a device substrate comprising at least one grounding plug therein, in which the grounding plug is insulated from the device substrate and an array of optoelectronic devices therein. A transparent substrate comprises a dam portion attached to the device substrate to form a cavity between the device and transparent substrates. A micro-lens array is disposed within the cavity. A conductive layer is electrically connected to the grounding plug and covers the sidewalls of the lens set and the package module and the upper surface of the lens set. A method for fabricating the electronic assembly is also disclosed.

    Abstract translation: 公开了一种用于图像传感器装置的电子组件。 电子组件包括安装在其上的封装模块和透镜组。 封装模块包括其中包括至少一个接地插头的器件衬底，其中接地插头与器件衬底绝缘，并且其中的光电器件阵列。 透明基板包括附接到装置基板的坝部，以在装置和透明基板之间形成空腔。 微透镜阵列设置在腔内。 导电层电连接到接地插头并且覆盖透镜组和封装模块的侧壁和透镜组的上表面。 还公开了一种用于制造电子组件的方法。

    Image sensor package and fabrication method thereof
    10.
    发明授权
    Image sensor package and fabrication method thereof 有权
    图像传感器封装及其制造方法

    公开(公告)号：US07595220B2

    公开(公告)日：2009-09-29

    申请号：US11822011

    申请日：2007-06-29

    Applicant: Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

    Inventor： Jui-Ping Weng ,  Jang-Cheng Hsieh ,  Tzu-Han Lin ,  Pai-Chun Peter Zung

    IPC: H01L21/00 ,  H01L23/02

    CPC classification number: H01L27/14618 ,  H01L27/14683 ,  H01L2224/10

    Abstract: The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A bonding pad comprising a first opening is formed on an upper surface of the first substrate. A second substrate comprising a spacer element with a second opening therein is disposed on the first substrate. A conductive plug is formed in the hole and passes through the first and second openings to the second substrate to electrically contact with the bonding pad. A conductive layer is formed on a lower surface of the first substrate and electrically connects to the conductive plug. A solder ball is formed on the conductive layer and electrically connects to the bonding pad by the conductive plug. The image sensor package further comprises a second substrate bonding to the first substrate. The image sensor package is relatively less thick, thus, the dimensions thereof are relatively reduced.

    Abstract translation: 本发明提供一种图像传感器封装及其制造方法。 图像传感器封装包括其上包括传感器装置的第一基板和其中的孔。 包括第一开口的焊盘形成在第一基板的上表面上。 包括其中具有第二开口的间隔元件的第二基板设置在第一基板上。 导电插塞形成在孔中，并通过第一和第二开口到第二基板，以与接合焊盘电接触。 导电层形成在第一基板的下表面上并电连接到导电插塞。 在导电层上形成焊球，并通过导电插塞与焊盘电连接。 图像传感器封装还包括与第一基板结合的第二基板。 图像传感器封装相对较薄，因此其尺寸相对减小。

Patent Agency Ranking