公开(公告)号：US07479604B1

公开(公告)日：2009-01-20

申请号：US11862760

申请日：2007-09-27

申请人： Brian Smith ,  Hector Deju ,  Scott Burri ,  Larry E. Crider ,  Joseph Kreuzpaintner ,  Gregory M. Jandzio ,  Walter M. Whybrew

发明人： Brian Smith ,  Hector Deju ,  Scott Burri ,  Larry E. Crider ,  Joseph Kreuzpaintner ,  Gregory M. Jandzio ,  Walter M. Whybrew

IPC分类号： H05K1/16

CPC分类号： H05K1/182 ,  H01Q21/062 ,  H01Q21/26 ,  H05K2201/10356 ,  H05K2201/10681 ,  H05K2201/10893

摘要： At least one flexible appliance (120) and related method (300) for orthogonal, non-planar interconnections of at least a first electronic interface (115) disposed on a substrate (110) to an associated second electronic interface (161) positioned beneath the substrate (110). The flexible appliance (120) is comprised of a planar body (121) having at least one electrical connector (122) extending from and orthogonally oriented relative to the planar body (121). In one aspect of the invention, the electrical connector (122) is four electrical connectors (122). There is at least one aperture (112) formed in the substrate (110) for allowing the first electronic interface (115) to be electrically interconnected to the associated second electronic interface (161). The flexible appliance (120) is positioned on the substrate (110) by automated means. Contacts pads (123, 124) on the resilient connector (122) are electrically connected to the second electronic interface (161) and the first electronic interface (115) by automated means such as soldering, thermo sonic bonding, or gap welding.

摘要翻译： 至少一个柔性器具（120）和相关方法（300），用于将至少第一电子接口（115）布置在基板（110）上的相关联的第二电子接口（161）的正交非平面互连， 基板（110）。 柔性器具（120）由平面体（121）组成，平面主体（121）具有至少一个相对于平面主体（121）延伸并且相对于平面主体（121）定向的电连接器（122）。 在本发明的一个方面，电连接器（122）是四个电连接器（122）。 在衬底（110）中形成有至少一个孔（112），用于允许第一电子接口（115）与相关联的第二电子接口（161）电互连。 柔性器具（120）通过自动化方式定位在基底（110）上。 弹性连接器（122）上的接触垫（123,124）通过诸如焊接，热声波接合或间隙焊接的自动化手段电连接到第二电子接口（161）和第一电子接口（115）。

公开(公告)号：US5894983A

公开(公告)日：1999-04-20

申请号：US781541

申请日：1997-01-09

申请人： Donald J. Beck ,  Kelly V. Hillman ,  Hector Deju ,  Gary A. Rief ,  Thomas K. Buschor ,  James B. Nichols ,  Brett A. Pigon ,  Walter M. Whybrew ,  Steven E. Wilson

发明人： Donald J. Beck ,  Kelly V. Hillman ,  Hector Deju ,  Gary A. Rief ,  Thomas K. Buschor ,  James B. Nichols ,  Brett A. Pigon ,  Walter M. Whybrew ,  Steven E. Wilson

IPC分类号： H01L21/607 ,  H01L21/60 ,  H01L20/10

CPC分类号： H01L24/85 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48455 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20305 ,  H01L2924/20306 ,  H01L2924/20752 ,  H01L2924/3011

摘要： A thermosonic ribbon bonding process uses a combination of a relatively low temperature and a high frequency to bond a ribbon conductor to conductive bonding sites of a system level support structure, such as a space/airborne antenna, containing circuit components whose characteristics might otherwise be degraded at an elevated temperature customarily used in device-level thermosonic bonding processes. By relatively low temperature is meant a temperature no greater than the minimum temperature that would potentially cause a modification of the circuit parameters of at least one of the system's components. Such a minimum temperature may lie in a range on the order of 25-85.degree. C., while the ultrasonic bonding frequency preferably lies in a range of from 122 KHz to 140 KHz. For gold ribbon to gold pad bonds, this high frequency range achieves the requisite atomic diffusion bonding energy, without causing fracturing or destruction of the gold ribbon or its interface with the gold pad.

摘要翻译： 热超声带接合方法使用相对较低温度和高频率的组合将带状导体接合到系统级支持结构（例如空间/机载天线）的导电接合位置，该系统级支撑结构包含其特性可能降解的电路组件 在高温下通常用于器件级热键接合工艺。 相对较低的温度是指不大于潜在地导致系统组件中的至少一个的电路参数的修改的最小温度的温度。 这样的最小温度可以在25-85℃的范围内，而超声波接合频率优选在122KHz至140KHz的范围内。 对于金色带到金垫键，这种高频范围实现了所需的原子扩散结合能，而不会导致金带的破裂或破坏或其与金垫的界面。

公开(公告)号：US20090097526A1

公开(公告)日：2009-04-16

申请号：US11870510

申请日：2007-10-11

申请人： Joseph J. Kreuzpaintner ,  Thomas Shenton ,  Steven E. Wilson ,  Karen Wooldridge ,  Lee Burberry ,  Hector Deju

发明人： Joseph J. Kreuzpaintner ,  Thomas Shenton ,  Steven E. Wilson ,  Karen Wooldridge ,  Lee Burberry ,  Hector Deju

IPC分类号： G01N25/00

CPC分类号： G01N25/72

摘要： The invention concerns a method and apparatus for performing an accelerated simulation of mechanical stresses and strains to evaluate the reliability of a sub-miniature interconnect. The method can begin by determining at least one characteristic of at least one thermal cycle to which a sub-miniature interconnect having a predetermined configuration will be exposed. The at least one characteristic can be selected to include a temperature change during the at least one thermal cycle. Thereafter, at least one value is calculated which represents a dimensional variation in a substrate (400) to which the sub-miniature interconnect is bonded. In particular, the dimensional variation is a calculated variation in the substrate dimension caused by the thermal cycle. The dimensional variation can include a longitudinal dimensional variation aligned with a length of the ribbon or the wire or a lateral dimensional variation aligned transverse to the ribbon or wire.

摘要翻译： 本发明涉及用于执行机械应力和应变的加速仿真以评估子微型互连的可靠性的方法和装置。 该方法可以通过确定具有预定配置的次微型互连将被暴露的至少一个热循环的至少一个特性开始。 可以选择至少一个特性以在至少一个热循环期间包括温度变化。 此后，计算表示子微型互连结合到的基板（400）中的尺寸变化的至少一个值。 特别地，尺寸变化是由热循环引起的基板尺寸的计算变化。 尺寸变化可以包括与丝带或线的长度对准的纵向尺寸变化或横向于条带或线的横向尺寸变化。

公开(公告)号：US20080293235A1

公开(公告)日：2008-11-27

申请号：US11751849

申请日：2007-05-22

申请人： Hector Deju

发明人： Hector Deju

IPC分类号： H01L21/44

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48451 ,  H01L2224/48463 ,  H01L2224/48482 ,  H01L2224/48499 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85047 ,  H01L2224/85051 ,  H01L2224/85205 ,  H01L2224/85947 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01204 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754

摘要： A method is provided for creating a compound bond in a wire bonding process. The method includes forming a free air ball (804) at a first end (702) of a bonding wire (602). The method also includes determining a dimension and/or a shape of an anchored ball (406) disposed on a bonding site. The method further includes modifying a shape of the free air ball to at least partially conform to a shape of the anchored ball. This modification step also comprises modifying the shape of the free air ball in accordance with at least one of the dimension and the shape of the anchored ball. This modification step further comprises forming a concave surface (1502) on a portion of the free air ball. The method further includes bonding the free air ball to the anchored ball subsequent to modifying a shape of the free air ball.

摘要翻译： 提供了一种在引线接合工艺中产生化合键的方法。 该方法包括在接合线（602）的第一端（702）处形成自由空气球（804）。 该方法还包括确定设置在粘结部位上的锚定球（406）的尺寸和/或形状。 该方法还包括修改自由空气球的形状以至少部分地符合锚定球的形状。 该修改步骤还包括根据锚定球的尺寸和形状中的至少一个来修改自由空气球的形状。 该修改步骤还包括在自由空气球的一部分上形成凹面（1502）。 该方法还包括在修改自由空气球的形状之后将自由空气球接合到锚定的球。