公开(公告)号：US4268849A

公开(公告)日：1981-05-19

申请号：US957645

申请日：1978-11-03

申请人： Bruce Gray ,  James M. Harris ,  William M. Gouin

发明人： Bruce Gray ,  James M. Harris ,  William M. Gouin

IPC分类号： H01L21/285 ,  H01L23/485 ,  H01L33/40 ,  H01L23/48

CPC分类号： H01L33/40 ,  H01L21/28575 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041

摘要： A bonding pad structure for an LED includes a first layer of nickel-chromium in contact with the contact face of a gallium arsenide wafer with further layers of either gold, palladium, or both, with palladium being the top layer of the first pad structure laid down by vaporization with a raised structure overlying the first structure by means of plating and including layers of nickel, gold and/or other conducting metal.

摘要翻译： 用于LED的接合焊盘结构包括与砷化镓晶片的接触面接触的第一层镍 - 铬，其另外的金，钯或二者层，钯是第一焊盘结构的顶层 通过用覆盖在第一结构上的凸起结构，通过电镀并包括镍，金和/或其它导电金属的层而蒸发。

公开(公告)号：US4078980A

公开(公告)日：1978-03-14

申请号：US728575

申请日：1976-10-01

申请人： James M. Harris ,  William M. Gouin ,  Bruce Gray

发明人： James M. Harris ,  William M. Gouin ,  Bruce Gray

IPC分类号： C25F3/08 ,  C25F5/00 ,  H01L21/3213 ,  H01L21/60 ,  H01L23/485 ,  C25F3/12

CPC分类号： C25F5/00 ,  C25F3/08 ,  H01L21/32134 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

摘要： A layer of chromium is removed from the metalization system on a silicon integrated circuit wafer that also includes copper and aluminum. By electrolytic etching in a sulfuric acid solution containing about 10% by volume water saturated with chromium sulfate, chromium can be removed without excessive removal of copper or aluminum.

摘要翻译： 在包含铜和铝的硅集成电路晶片上，从金属化系统中除去一层铬。 通过在含有约10体积％硫酸铬饱和的水的硫酸溶液中进行电解蚀刻，可以除去铬而不过度去除铜或铝。

公开(公告)号：US4005472A

公开(公告)日：1977-01-25

申请号：US578651

申请日：1975-05-19

申请人： James M. Harris ,  William M. Gouin

发明人： James M. Harris ,  William M. Gouin

IPC分类号： H01L21/288 ,  H01L21/3205 ,  H01L21/60 ,  H01L23/52 ,  H01L29/46 ,  H01L23/48

CPC分类号： H01L24/11 ,  H01L21/288 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

摘要： An integrated circuit semiconductive device has a plurality of copper gang bonding bumps formed on the upper surface thereof. The bumps rise substantially above the surface of the semiconductive device and serve to make electrical connection to a pattern of intraconnect metallization formed on the semiconductive device for making electrical contact to various regions within the semiconductive body of the integrated circuit. The gang bonding bumps are to be thermal compression bonded to metallic leads by an automatic bonding machine. As a final step to the processing of the semiconductive wafers, containing the individual semiconductive devices, the wafers are immersed in an immersion gold plating solution for plating an antioxidant protective coating of gold of a thickness less than 6000 angstroms onto the copper gang bonding bumps to prevent oxidation thereof either before or during the gang bonding step. The thickness of such gold antioxidant coating permitting thermal compression bonding therethrough to the underlying metal layer.

摘要翻译： 集成电路半导体器件具有形成在其上表面上的多个铜焊接凸块。 凸起大大高于半导体器件的表面，并且用于与形成在半导体器件上的金属间连接的图案进行电连接，用于与集成电路的半导体本体内的各个区域进行电接触。 组合焊接凸块通过自动粘合机热压接在金属引线上。 作为处理半导体晶片的最终步骤，包含各个半导体器件，将晶片浸入浸镀金镀液中，以将厚度小于6000埃的金的抗氧化保护涂层镀在铜组合焊接凸块上 防止在组合步骤之前或过程中的氧化。 这种金抗氧化涂层的厚度允许热压粘合到其下面的金属层。

公开(公告)号：US06907904B2

公开(公告)日：2005-06-21

申请号：US10377831

申请日：2003-03-03

申请人： James M. Harris ,  Selser J. Michael

发明人： James M. Harris ,  Selser J. Michael

IPC分类号： F15B13/08 ,  F16K27/00 ,  F16K11/10

CPC分类号： F15B13/081 ,  F15B13/0814 ,  F15B13/0857 ,  F15B13/0871 ,  F15B13/0892 ,  F15B13/0896 ,  F16K27/003 ,  Y10T137/87885

摘要： A novel fluid delivery system includes a mounting panel, where the mounting panel includes channels that define the flow of fluid between any flow-control components mounted on the mounting panel. The mounting panel comprises a top plate and a bottom plate, and the channels are carved out of the underside of the top plate and are enclosed by the bottom plate. In a complex fluid delivery system having many fluid channels, the mounting panel may include one or more interior panels with additional channels carved out of the interior plates to accommodate all routing paths. The channels run in two or more directions to connect two or more gas/channel sticks together.

摘要翻译： 新颖的流体输送系统包括安装面板，其中安装面板包括在安装在安装面板上的任何流量控制组件之间限定流体流动的通道。 安装面板包括顶板和底板，并且通道被雕刻在顶板的下侧之外并被底板包围。 在具有许多流体通道的复杂流体输送系统中，安装面板可以包括一个或多个内部面板，其具有从内部板中雕刻出的附加通道，以适应所有的路线路径。 通道在两个或更多个方向上运行，以将两个或多个气体/通道棒连接在一起。

公开(公告)号：US06869818B2

公开(公告)日：2005-03-22

申请号：US10298847

申请日：2002-11-18

申请人： James M. Harris ,  Sapna Patel

发明人： James M. Harris ,  Sapna Patel

IPC分类号： B81B7/00 ,  B81C99/00 ,  F16K99/00 ,  H01L21/02 ,  H01L21/66 ,  H01L23/544 ,  H01L21/00

CPC分类号： H01L22/20 ,  B81B7/0012 ,  B81B2201/054 ,  B81B2201/058 ,  B81C99/0045 ,  B81C2203/038 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0034 ,  F16K99/0036 ,  F16K99/0059 ,  F16K2099/0074 ,  H01L21/02071 ,  H01L22/24 ,  H01L22/34

摘要： A method for producing a corrosion-resistant channel in a wetted path of a silicon device enables such device to be used with corrosive compounds, such as fluorine. A wetted path of a MEMS device is coated with either (1) an organic compound resistant to attack by atomic fluorine or (2) a material capable of being passivated by atomic fluorine. The device is then exposed to a gas that decomposes into active fluorine compounds when activated by a plasma discharge. One example of such a gas is CF4, an inert gas that is easier and safer to work with than volatile gases like ClF3. The gas will passivate the material (if applicable) and corrode any exposed silicon. The device is tested in such a manner that any unacceptable corrosion of the wetted path will cause the device to fail. If the device operates properly, the wetted path is deemed to be resistant to corrosion by fluorine or other corrosive compounds, as applicable.

公开(公告)号：US06306804B1

公开(公告)日：2001-10-23

申请号：US09457686

申请日：1999-12-09

申请人： James M. Harris ,  Sheldon E. Broedel, Jr.

发明人： James M. Harris ,  Sheldon E. Broedel, Jr.

IPC分类号： C11D714

CPC分类号： C11D11/0041 ,  C11D1/667 ,  C11D1/72 ,  C11D1/825 ,  C11D3/06 ,  C11D3/08 ,  C11D3/2086

摘要： A solid phase bilge water cleaning composition which is biodegradable and environmentally safe is disclosed. The composition includes a polysorbitan monostearate wax such as polyoxyethylenesorbitan monostearate and a mixture of nonionic alkyl detergent with about 18% sodium meta-silicate and about 12% chlorinated trisodium phosphate.

摘要翻译： 公开了一种可生物降解和环境安全的固相舱底水清洗组合物。 组合物包括聚山梨糖醇单硬脂酸酯蜡，例如聚氧乙烯脱水山梨糖醇单硬脂酸酯和非离子烷基洗涤剂与约18％偏硅酸钠和约12％氯化磷酸三钠的混合物。

公开(公告)号：US4089709A

公开(公告)日：1978-05-16

申请号：US772714

申请日：1977-02-28

申请人： James M. Harris

发明人： James M. Harris

IPC分类号： C23C22/08 ,  H01L21/3105 ,  H01L21/316 ,  H01L21/768 ,  C23F7/06 ,  C23F17/00

CPC分类号： C23C22/08 ,  H01L21/3105 ,  H01L21/31683 ,  H01L21/76888

摘要： An aluminum layer such as an intraconnect on an integrated circuit semiconductive device is passivated by oxidizing the aluminum layer to form a thin layer of amorphous alumina thereon. The alumina layer is coated with a surface active agent to form a hydrophobic surface on the aluminum oxide to inhibit the creation and growth of ALOOH on the oxide layer. The hydrophobic surface is coated with a conventional passivating material such as silicon dioxide, epoxy or the like.

摘要翻译： 在集成电路半导体器件上的诸如内部连接的铝层通过氧化铝层而钝化以在其上形成薄的无定形氧化铝层。 氧化铝层用表面活性剂涂覆以在氧化铝上形成疏水表面，以抑制氧化物层上ALOOH的产生和生长。 疏水表面涂覆有常规的钝化材料，例如二氧化硅，环氧树脂等。

公开(公告)号：US4079501A

公开(公告)日：1978-03-21

申请号：US734946

申请日：1976-10-22

申请人： James M. Harris

发明人： James M. Harris

IPC分类号： B21B1/02 ,  B22D11/126

CPC分类号： B21B1/026 ,  Y10T29/49989 ,  Y10T29/49991

摘要： Maximum yield in the production of a slab from an open-top or hot-top mold ingot is obtained by a method of selecting the ingot mold size and the pour height in the mold.

摘要翻译： 通过选择模具中的锭模尺寸和浇注高度的方法获得从开顶或热顶模具坯料生产板坯的最大产量。

公开(公告)号：US07229800B2

公开(公告)日：2007-06-12

申请号：US10825908

申请日：2004-04-16

申请人： James M. Harris

发明人： James M. Harris

IPC分类号： C12P19/34 ,  C12Q1/68 ,  C07H21/02 ,  C07H21/04

CPC分类号： C12Q1/689 ,  C12Q2600/16

摘要： The present invention relates to nucleic acid amplification assays for the detection of nucleic acid sequences of Neisseria gonorrhoeae. The present invention provides oligonucleotides that are complementary or that anneal to nucleic acid sequences of Neisseria gonorrhoeae. The present invention also provides internal amplification controls (IACs) that can be used in nucleic acid amplification reactions.

摘要翻译： 本发明涉及用于检测淋病奈瑟氏球菌的核酸序列的核酸扩增测定。 本发明提供与淋病奈瑟氏球菌的核酸序列互补或退火的寡核苷酸。 本发明还提供可用于核酸扩增反应的内部扩增对照（IAC）。

公开(公告)号：US07055550B2

公开(公告)日：2006-06-06

申请号：US11152582

申请日：2005-06-14

申请人： James M. Harris ,  Selser J. Michael

发明人： James M. Harris ,  Selser J. Michael

IPC分类号： F16K11/10

CPC分类号： F15B13/081 ,  F15B13/0814 ,  F15B13/0857 ,  F15B13/0871 ,  F15B13/0892 ,  F15B13/0896 ,  F16K27/003 ,  Y10T137/87885

摘要： A novel fluid delivery system includes a mounting panel, where the mounting panel includes channels that define the flow of fluid between any flow-control components mounted on the mounting panel. The mounting panel comprises a top plate and a bottom plate, and the channels are carved out of the underside of the top plate and are enclosed by the bottom plate. In a complex fluid delivery system having many fluid channels, the mounting panel may include one or more interior panels with additional channels carved out of the interior plates to accommodate all routing paths. The channels run in two or more directions to connect two or more gas/channel sticks together.

摘要翻译： 新颖的流体输送系统包括安装面板，其中安装面板包括在安装在安装面板上的任何流量控制组件之间限定流体流动的通道。 安装面板包括顶板和底板，并且通道被雕刻在顶板的下侧之外并被底板包围。 在具有许多流体通道的复杂流体输送系统中，安装面板可以包括一个或多个内部面板，其具有从内部板中雕刻出的附加通道，以适应所有的路线路径。 通道在两个或更多个方向上运行，以将两个或多个气体/通道棒连接在一起。