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公开(公告)号：US06928626B1
公开(公告)日：2005-08-09
申请号：US10313061
申请日：2002-12-06
申请人： Bruce W. McGaughy , Jun Qian , Jun Kong
发明人： Bruce W. McGaughy , Jun Qian , Jun Kong
IPC分类号： G06F17/50
CPC分类号： G06F17/5036
摘要： The present invention relates generally to the field of design automation. More particularly, the present invention relates to a system and method for the modeling of circuit components for use by a simulator. The present invention includes a model of a circuit component having a plurality of properties that depend on at least two variables comprising: a space defined by the two or more variables; a partition of said space comprising a plurality of regions wherein at least two of the properties share said partition; and at least one definition representing at least one of the properties in at least one of the regions.
摘要翻译： 本发明一般涉及设计自动化领域。 更具体地，本发明涉及一种用于由模拟器使用的电路部件建模的系统和方法。 本发明包括具有依赖于至少两个变量的多个属性的电路组件的模型，包括：由两个或多个变量定义的空间; 所述空间的分区包括多个区域，其中所述属性中的至少两个共享所述分区; 以及表示至少一个区域中的至少一个属性的至少一个定义。
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2.发明申请公开(公告)号：US20200005139A1
公开(公告)日：2020-01-02
申请号：US16449104
申请日：2019-06-21
IPC分类号： G06N3/08 , G05B19/4155
摘要： A method of generating training spectra for training of a neural network includes measuring a first plurality of training spectra from one or more sample substrates, measuring a characterizing value for each training spectra of the plurality of training spectra to generate a plurality of characterizing values with each training spectrum having an associated characterizing value, measuring a plurality of dummy spectra during processing of one or more dummy substrates, and generating a second plurality of training spectra by combining the first plurality of training spectra and the plurality of dummy spectra, there being a greater number of spectra in the second plurality of training spectra than in the first plurality of training spectra. Each training spectrum of the second plurality of training spectra having an associated characterizing value.
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公开(公告)号：US20190096722A1
公开(公告)日：2019-03-28
申请号：US16137009
申请日：2018-09-20
申请人： Sivakumar Dhandapani , Jun Qian
发明人： Sivakumar Dhandapani , Jun Qian
IPC分类号： H01L21/67 , B24B37/005 , B24B37/20 , B24B37/32 , H01L21/66 , H01L21/321
摘要： A method of processing substrates includes: subjecting each respective first substrate of a first plurality of substrates to a process that modifies a thickness of an outer layer of the respective first substrate; generating a plurality of groups of process parameter values, wherein the plurality of process parameters comprise a plurality of control parameters and a plurality of state parameters; generating a plurality of measured removal profiles; generating a matrix that relates the plurality of process parameters to a calculated removal profile; for each respective second substrate of a second plurality of substrates, determining a target removal profile and a plurality of state parameter values; calculating respective control parameter values to apply to the respective second substrate by applying the target removal profile and the state parameter values to the matrix; and subjecting each respective second substrate to the process using the respective process parameter values.
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4.发明申请POLISHING WITH EDDY CURRENT FEED MEAUREMENT PRIOR TO DEPOSITION OF CONDUCTIVE LAYER 有权在导电层沉积之前用EDDY电流进料抛光公开(公告)号：US20160020157A1
公开(公告)日：2016-01-21
申请号：US14800246
申请日：2015-07-15
申请人： Tomohiko Kitajima , Jeffrey Drue David , Jun Qian , Taketo Sekine , Garlen C. Leung , Sidney P. Huey
发明人： Tomohiko Kitajima , Jeffrey Drue David , Jun Qian , Taketo Sekine , Garlen C. Leung , Sidney P. Huey
IPC分类号： H01L21/66 , H01L21/3105 , H01L21/67 , H01L21/321
CPC分类号： H01L22/26 , B24B37/013 , B24B49/105 , H01L21/31053 , H01L21/31055 , H01L21/31111 , H01L21/31116 , H01L21/3212 , H01L21/67075 , H01L21/67092 , H01L21/67253 , H01L22/14 , H01L22/20 , H01L22/34 , H01L27/11556 , H01L27/11582
摘要： A method of controlling polishing includes storing a base measurement, the base measurement being an eddy current measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of a conductive layer over the at least one layer, after deposition of the conductive layer over the at least one layer and during polishing of the conductive layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ eddy current monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.
摘要翻译： 控制抛光的方法包括：在淀积位于半导体晶片上方的至少一层之后，以及在沉积导电层之后，至少沉积一层之后，存储基底测量，基底测量是衬底的涡流测量， 在至少一层上的导电层和在衬底上的导电层的抛光期间，从原位涡流监测系统接收衬底的原始测量序列，使原始测量序列中的每个原始测量标准化以产生 使用原始测量和基础测量的归一化测量序列，以及至少基于归一化测量的序列来确定抛光终点或抛光速率的调整中的至少一个。
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公开(公告)号：US20130288571A1
公开(公告)日：2013-10-31
申请号：US13456117
申请日：2012-04-25
申请人： Jeffrey Drue David , Jun Qian , Harry Q. Lee
发明人： Jeffrey Drue David , Jun Qian , Harry Q. Lee
CPC分类号： B24B37/013 , B24B49/12
摘要： During polishing of a substrate at a first platen and prior to a first time, a first sequence of values is obtained for a first zone of the first substrate and a second sequence of values is obtained for a different second zone of the substrate with an in-situ monitoring system. A first function is fit to a portion of the first sequence of values obtained prior to the first time, and a second function is fit to a portion of the second sequence of values obtained prior to the second time. At least one polishing parameter is adjusted based on the first fitted function and the second fitted function so as to reduce an expected difference between the zones. A second substrate is polished on the first platen using an adjusted polishing parameter calculated based on the first fitted function and the second fitted function.
摘要翻译： 在第一压板处理衬底并且在第一时间之前，在第一衬底的第一区域获得第一序列值，并且对于衬底的不同第二区域获得第二序列值，其中， 监测系统。 第一函数适合于在第一次之前获得的第一序列序列的一部分，并且第二函数适合于在第二次之前获得的第二值序列的一部分。 基于第一装配功能和第二装配功能来调整至少一个抛光参数，以便减少区域之间的预期差异。 使用基于第一拟合函数和第二拟合函数计算的调整的抛光参数在第一压板上抛光第二衬底。
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公开(公告)号：US20120231701A1
公开(公告)日：2012-09-13
申请号：US13480434
申请日：2012-05-24
IPC分类号： B24B51/00
摘要： A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.
摘要翻译： 研磨具有多个区域的基板并测量光谱。 对于每个区域，第一个线性函数拟合与参考光谱相关联的索引值序列，该参考光谱与测量的光谱最匹配。 基于第一线性函数确定参考区域将达到目标指标值的预计时间，并且对于至少一个可调整区域，计算抛光参数调整，使得可调节区域更接近目标索引处的目标索引 预计时间比没有这样的调整。 基于对先前基板计算的反馈误差来计算调整。 基于适合与调整抛光参数之后测量的最佳匹配光谱的参考光谱相关联的索引值序列的第二线性函数来计算后续衬底的反馈误差。
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公开(公告)号：US08264210B2
公开(公告)日：2012-09-11
申请号：US12249589
申请日：2008-10-10
CPC分类号： H03K19/00369
摘要： A method and apparatus to regulate voltage used to power an ASIC comprising an ASIC having a signal source and a modulator. The modulator establishes a characteristic of a signal created by the signal source to indicate a voltage level to be used to power the ASIC. The signal is communicated to a voltage regulator to apply an optimal voltage to the ASIC.
摘要翻译： 一种用于调节用于为包含具有信号源和调制器的ASIC的ASIC供电的电压的方法和装置。 调制器建立由信号源产生的信号的特性，以指示要用于为ASIC供电的电压电平。 该信号被传送到电压调节器以向ASIC施加最佳电压。
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公开(公告)号：US20110294400A1
公开(公告)日：2011-12-01
申请号：US13193011
申请日：2011-07-28
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
IPC分类号： B24B51/00
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。
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公开(公告)号：US07746485B2
公开(公告)日：2010-06-29
申请号：US12253160
申请日：2008-10-16
申请人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
发明人： Abraham Ravid , Boguslaw A. Swedek , Jeffrey Drue David , Jun Qian , Ingemar Carlsson , Dominic J. Benvegnu , Harry Q. Lee , Lakshmanan Karuppiah
IPC分类号： G01B11/28
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译： 确定基板的物理性质的方法包括记录从基板获得的第一光谱，第一光谱是在改变基板的物理性质的抛光工艺期间获得的第一光谱。 该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。 数据库中的每个光谱具有与之相关联的物理属性值。 该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中所识别的先前记录的频谱相关联的物理属性值来确定。 用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。
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公开(公告)号：USD994992S1
公开(公告)日：2023-08-08
申请号：US29814159
申请日：2021-11-03
申请人： Yongquan Yu , Liuzhu Chen , Jun Qian
设计人： Yongquan Yu , Liuzhu Chen , Jun Qian
摘要： FIG. 1 is a perspective view of a pet playpen, showing our new design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof; and,
FIG. 9 is an enlargement view of FIG. 1.
The dot-dashed broken lines represent the boundary of the enlarged portion and form no part of the claimed design.
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